• Corrosion Science and Technology
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• v.11 no.6
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• pp.275-279
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• 2012

Ni-W alloy deposits have lately attracted the interest as an alternative surface treatment method for hard chromium electrodeposits because of higher wear resistance, hardness at high temperature, and corrosion resistance. This study deals with influences of process variables, such as electodeposition current density, plating temperature and pH, on the internal stress of Ni-W nanocrystalline deposits. The internal stress was increased with increasing the applied current density. With increasing applied current density, the grain size of the deposit decreases and concentration of hydrogen in the deposit increases. The subsequent release of the hydrogen results in shrinkage of the deposit and the introduction of tensile stress in the deposit. Consequently, for layers deposited at high current density, cracking occurs readily owing to high tensile stress value. By increasing the temperature of the electrodeposition from $60^{\circ}C$ to $80^{\circ}C$, the internal stress was decreased. It seems that an increase in the number of active ions overcoming the activation energy at elevated temperature caused a decline in the concentration polarization and surface diffusion. It decreased the level of hydrogen absorption due to the lessened hydrogen evolution reaction. Therefore, the lower level of hydrogen absorption degenerated the hydride on the surface of the electrode, resulting in the reduction of the internal stress of the deposits. By increasing the pH of the electrodeposition from 5.6 to 6.8, the internal stress in the deposits were slightly decreased. It is considered that the decrease in internal stess of deposits was due to supply of W complex compound in cathode surface, and hydrogen ion resulted from decrease of activity.

• Journal of Surface Science and Engineering
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• v.43 no.2
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• pp.57-63
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• 2010

In this study, thermal stability of the mechanical properties of Ni-P-B and Ni-P-Fe layers electroplated on Alloy 600 material was evaluated by measuring their microhardness, tensile strength, and elongation after heat treatment at $325^{\circ}C$ and $400^{\circ}C$. According to the results, there was no noticeable change in microhardness of the two electrodeposits before and after heat treatment at the temperatures for 30 days. In the case of a Ni-P-B electrodeposit, ultimate tensile strength (UTS) slightly increases with heat treatment time, while its elongation decreases, showing good thermal stability in the mechanical properties at high temperature. On the other hand, UTS and elongation of Ni-P-Fe decrease with heat treatment time, which is very unusual observation. This result was attributed to the bad microstructure of Ni-P-Fe having many defects in the deposit formed early stage of an electroplating process and their redistribution to link to become large ones during heat treatment.

• Journal of Surface Science and Engineering
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• v.28 no.4
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• pp.207-218
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• 1995

Tungsten(W) metal has excellent properties in heat-resistance, corrison-resistance and impact-resistance but W-Metal is hard to sinter because higher than $2,000^{\circ}C$ is required to sinter W-powder. Con-sequently, a deposit technique of Nikel Phosphorus(NiP) on W-powber by the liquid reduction precipitation method was performed. Sintering temperature of the resulting W-NiP composite was lowered around to $1,000^{\circ}C$, and the mechanical properties of the sintered body was studied. The most suitable conditions for NiP thin film deposit on W-Powder by the liquid reduction precipitation method, which are composition, concentration, pH and temperature of the liquid reduction solution, were considered. The activated sintering was carried out in a reducing condition furnace. Components and properties of the sintered body were investigated by the density and the hardness measurements, X- ray diffraction analysis, and microscopic photographs of the surface. Quantity of NiP thin film on W-powder could be varied by the change of the liquid reduction solution composition. The sintering temperature of W-NiP composite powder is lowered to $950^{\circ}C$ from $2,000^{\circ}C$ and the hardness is increased (ca. 720 Hv). Large shrinkage could be observed since density was increased from 5.5 to 11.0 g/$cm^2$ which 86.2% of theoretical density. W metal and $Ni_3P$ crystal were detected through X-ray diffraction on the sintered body. Perfectly activated sintering was observed by microscopic photographs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Journal of Surface Science and Engineering
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• v.51 no.4
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• pp.197-201
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• 2018

Dynamic nano-indentation method was applied to characterize thin electroformed Ni-P layers. The Ni-P layers were produced in a sulphamic acid bath at $50^{\circ}C$ in $0.02A/cm^2$ for 10-60 minutes. The chemical analyses by XRD and EDX showed that the Ni-P layers were very fine grains with mainly $Ni_3P$ with Ni. The surface roughness determined by atomic force microscopy increased with thickness, which was relative to the surface morphology. The nano-hardness and the stiffness of the thin Ni-P layers with thickness of 1.9, 6.2 and $7.5{\mu}m$ were 5.52, 6.52 and 6.77 [GPa] and 56.7, 76.2 and 108.0 [${\mu}N/nm$], respectively. The elastic modulus of the Ni-P layer increased with thickness such as 37.29, 54.50 and 78.76 [GPa], respectively. The surface roughness of the electroplated Ni-P layers with diverse thickness was 8.66, 18.56 and 35.22 [nm], respectively. The enhanced nano-mechanical properties were related to mainly residual stress of the Ni-P layers.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.667-670
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• 2003

Ni-silicide has low thermal stabiliy. This point is obstacle to apply NiSi to devices. So In this paper, we have studied for obtain thermal stability and analysis of dopant dependency of NiSi. And then we applied Ni-silicide to devices. To improvement of thermal stability, we deposit Ni70/Co10/Ni30/TiN100 to sample. Co midlayer is enhanced thermal stability of NiSi. Co/Ni/TiN, this structure show very difference between n-poly and p-poly in sheet resistance. But Ni/Co/Ni/TiN, structure show less difference. Also junction leakage is good.

• Journal of Surface Science and Engineering
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• v.34 no.3
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• pp.215-224
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• 2001

Cotton was etched in 15% NaOH solution at $90^{\circ}C$ for 15 min in order to give good wettability. Then it was catalyzed and accelerated by using $PdC1_2$-$SnCl_2$ solution and 10% $_2$$SO_4$, respectively. Uniform deposits on cotton were obtained when it was electroless copper deposited in pH 10.5 solution at 3$0^{\circ}C$ and Ni-Fe-P deposited in solutions of pH 11 at$ 75^{\circ}C$. The latter deposit has a chemical composition similar to that of permalloy.

• Journal of Environmental Science International
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• v.24 no.10
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• pp.1253-1264
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• 2015

This study assessed the fertilizing value of struvite deposit recovered from swine wastewater in cultivating Chinese cabbage. Struvite deposit was compared with commercial fertilizers: complex, organic and compost to evaluate the fertilizing effect of struvite deposit. Laboratory pot test obviously presented that the struvite deposit more facilitated the growth of Chinese cabbage than organic and compost fertilizers even though complex fertilizer was the most effective in growing Chinese cabbage. It was revealed that the growth rate of Chinese cabbage was simultaneously controlled by phosphorus (P) and potassium (K). Also, the nutrients such as nitrogen (N), P, K, calcium (Ca) and magnesium (Mg) were abundantly observed in the vegetable tissue of struvite pot. Specifically, P was the most abundant component in the vegetable tissue of struvite pot. Meanwhile, the utilization of struvite as a fertilizer led to the lower accumulation of chromium ($Cr^{6+}$) than other pots, except for compost fertilizer pots, and no detection of cadmium (Cd), arsenic (As) and nickel (Ni) in the Chinese cabbage. The experimental results proved that the optimum struvite dosage for the cultivation of Chinese cabbage was 2.0 g struvite/kg soil. On the basis of these findings, it was concluded that the struvite deposits recovered from swine wastewater were effective as a multi-nutrient fertilizer for Chinese cabbage cultivation.

• Resources Recycling
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• v.10 no.2
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• pp.27-33
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• 2001

Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate, solution composion and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 50f) waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 10 times over than that of batch type. Plating time of 50% waste solution additive at continuous type took longer 3.7 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by depolited inferiority and larger decreased plating rate.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.73-80
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• 1989

Preparation and characteristics of electroless Ni-P and Ni-B systems for semiconducting ceramics have been investigated as a function of deposit rate, reducing agent and pH variation. The effect of DMAB as ruducing agent is greater than that of sodium hypophosphite. The nickel electrode prepared from the nickel-phosphorus system with sodium hypophosphite shows low contact resistance of 0.99ohm compared with the resistance of 10chm in the electrode prepared from the nickel-boron system with DMAB. The contact resistance increases with increasing pH valuein the nickel-phosphorus system with sodium hypophosphite. The ratio of Ni to P is about 76.0/24.0 for the contact resistance of 0.99ohm in the above system.