• 제목/요약/키워드: Ni-P deposit

검색결과 30건 처리시간 0.028초

ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 1. 무전해 Ni-P도금의 두께와 표면거칠기의 영향 (Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit)

  • 허석환;이지혜;함석진
    • 마이크로전자및패키징학회지
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    • 제21권3호
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    • pp.43-50
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    • 2014
  • 전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 실리콘 집과 인쇄회로기판의 인터커넥션의 고신뢰도가 요구되고 있다. 본 연구는 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 다양한 무전해 Ni-P 도금 두께에서의 high speed shear 에너지 및 파괴 모드를 연구하였다. 파괴 모드 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. 질산 기상 처리하지 않은 $1{\mu}m$ Ni-P 시편에서 낮은 shear 에너지가 나왔으며, 이는 솔더레지스트 선단에서 파단의 원인을 제공하는 것이 확인되었다. 질산 기상 처리한 시편에서 무전해 Ni-P 도금 두께가 커질수록 취성 파괴 모드는 감소한다. 또 Ni-P 도금 두께와 표면 거칠기(Ra)는 반비례 관계를 가진다. 이는 Ni-P 도금의 표면 거칠기를 낮추면 SAC405 솔더 조인트의 신뢰도를 향상시킨다는 사실을 나타낸다.

Ni-Fe-P 합금전착에 미치는 Grain Refiner의 영향 (The Effect of Grain Refiner on Ni-Fe-P Alloy Electrodeposition)

  • 서무홍;김동진;김정수
    • 한국표면공학회지
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    • 제36권6호
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    • pp.437-443
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    • 2003
  • The effects of additive(grain refiner, GR) on process efficiency of the Ni-Fe-P alloy electrodeposition and the material properties of the deposit were investigated. Electrochemical properties of the deposits were investigated using polarization and electrochemical impedance techniques, and the material properties of the deposits were characterized through inductively coupled plasma(ICP), spiral contractometer, XRD, SEM and TEM. When the additive was added into the electrodeposition bath, current efficiency, Ni content and corrosion resistance of the deposit increased, whereas residual stress, surface roughness and grain size of the deposit decreased.

무전해 Ni-P 두께와 Assembly Process가 Solder Ball Joint의 신뢰성에 미치는 영향 (Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability)

  • 이지혜;허석환;정기호;함석진
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.60-67
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    • 2014
  • The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

Alumina substrate 상의 무전해 도금층의 밀착력에 관한 연구 (A study on adhesion strength of electroless plated deposits on Alumina substrate)

  • 조용균;안균영;박용수
    • 한국표면공학회지
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    • 제24권4호
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    • pp.187-195
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    • 1991
  • Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

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무전해 Ni-W-P 도금에서 착화제의 종류가 피막특성에 미치는 영향 (The Effect of Complexing Agents on the Deposit Characteristics in the Electroless Nickel-Tungsten-Phosphorus Plating)

  • 조진기;박상욱;강성군;손성호
    • 대한금속재료학회지
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    • 제46권11호
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    • pp.725-729
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    • 2008
  • Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

무전해 Ni-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향 (Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Ni-Cu-P Deposits)

  • 오이식;이태희
    • 동력기계공학회지
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    • 제10권3호
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    • pp.58-66
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    • 2006
  • The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing $CuSO_4$ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than $90^{\circ}C$ and under $70^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

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Ni-Tl-P합금피막을 이용한 수처리장치용 정전류소자의 개발 (Development of constant current device for using in the water treatment controller with Ni-Tl-P alloy deposits)

  • 류일광
    • 환경위생공학
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    • 제18권3호통권49호
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    • pp.35-42
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    • 2003
  • The electric resistance and constant current were investigated on the nickel-thallium-phosphorus alloy deposits by electroless-plating. The Ni-Tl-P alloy deposits were achieved with a bath using sodium hypophosphit as the reducing agent and sodium citrate as the comlexing agent. The basic plating solution is composed of 0.1M NiSO$_4$, 0.005${\sim}$0.0IM Tl$_2$S0$_4$, 0.1${\sim}$O.2M sodium hypophosphite and 0.02${\sim}$O.IM sodium citrate and the plating condition were pH 5${\sim}$6, temperrature 80$_4$90${\circ}$C. The results obtained are summarized as follows: 1) The crystal structure of deposit was amorphous structure as deposited state, became microcrystallized centering on Ni(111) plane by heat treatment at 200${\circ}$C, and grew as polycrystalline Ni, Ni$_3$P, Ni$_5$p$_2$,Tl, etc. by heat treatment higher than 350${\circ}$C. The grain size of plated deposits was grown up to 28.3~42.0nm by heat treatment for 1hour at 500${\circ}$C. 2) The electrical resistivity showed a comparatively high value of 192.5$_4$208.3 ${\mu}$${\Omega}$Cm and its thermal stability was great with resistivity value less than 0.22% in the thermal surroundings of 200${\circ}$C. 3) Ni-Tl-P alloy deposit showed such good constant current-making-effect in the variation of electric voltage, heat treatment temperature, and the composition of the deposit that it can be put to practical use as the matter of constant current device.

트리에탄올아민을 착화제로 사용한 무전해 니켈도금욕에서의 석출물의 조성 및 기계적 성질 (Composition and Mechanical Properties of Nickel Deposit Obtained from Electroless Nickel Plating Bath Contained Triethanolamine as Complexing Agent)

  • 여운관;문인형
    • 한국표면공학회지
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    • 제19권2호
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    • pp.31-43
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    • 1986
  • The properties of the electroless nickel deposit mainly depends on the pH of the bath, the plating temperature, and the molar ratio of nickel to hypophosphite but they are also affected by its formulation and concentration of complexing and buffering agents. According to changeing the concentration of triethanolamine and boric acid, phosphorous contents, microsturcture, crystalline, hardness and wear resistance of deposits obtained from ammoniacal alkaline bath were investigated by EPMA, differential thermal analyser, X-ray diffractometer and wear tester. The results are as follows; (1) Increasing concentration of triethanolamine in the bath, the deposits is slightly inclined to increase its phosphorous content(3.7% P). (2) In the as-plated state, the deposits are not crystallized state but they are thermally unstable phase, and they are crystallized with precipitating $Ni_3P$ at 400$^{\circ}C$. (3) The deposit containing 2.3% P has higher hardness value in the as plated and heat treated state at below 300$^{\circ}C$ than those of 3.7% phosphorous deposit (1090Hk). But in the case of heat treating at 400$^{\circ}C$, the former has lower hardness value (1000Hk) than the latter and has remarkably Ni(III) orientation by heat treatment. (4) The 3.7% phosphorous deposit heat treated at 400$^{\circ}C$ has better wear resistance than hard chromium plating.

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Struvite recovery from swine wastewater and its assessment as a fertilizer

  • Ryu, Hong-Duck;Lee, Sang-Ill
    • Environmental Engineering Research
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    • 제21권1호
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    • pp.29-35
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    • 2016
  • This study evaluated the fertilizing value of struvite deposit recovered from swine wastewater in cultivating lettuce. Struvite deposit was compared to complex fertilizer, organic fertilizer and compost to evaluate the fertilizing effect of struvite deposit. Laboratory pot test showed that the struvite deposit better enhanced lettuce growth in comparison to commercial fertilizers. It was revealed that the growth rate of lettuce was simultaneously controlled by phosphorus (P) and magnesium (Mg). Moreover, nutrients such as nitrogen (N), P, K, calcium (Ca) and magnesium (Mg) were abundantly observed in the vegetable tissue of struvite pot. Meanwhile, struvite application led to the lower accumulation of mercury (Hg), lead (Pb), chromium ($Cr^{6+}$) and nickel (Ni). In addition, no detection of cadmium (Cd), arsenic (As) and nickel (Ni) in the lettuce tissue was observed in struvite application pots. The experimental results proved that the optimum struvite dosage for lettuce cultivation was 0.5 g struvite/kg soil. The column experiments clearly showed that ammonia nitrogen was more slowly released from struvite deposit than from complex fertilizer. Consequently, it was concluded that the struvite deposits recovered from swine wastewater were effective as a multi-nutrient fertilizer for lettuce cultivation.

ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 2. Pd 촉매 시간의 영향 (Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation)

  • 허석환;이지혜;함석진
    • 마이크로전자및패키징학회지
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    • 제21권3호
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    • pp.51-56
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    • 2014
  • 솔더조인트의 신뢰성에는 인쇄회로기판의 표면처리 특성이 많은 영향을 미치고 있다. 본 연구에서는 ENEPIG 표면처리에서 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 Pd 촉매 처리 시간에 따른 high speed shear 에너지 및 파괴 모드를 연구하였다. 또한 Pd 촉매 처리 시간과 무전해 Ni-P 도금의 표면 거칠기 (Ra)와의 관계를 규명하였다. Pd 촉매 처리 시간이 길어질수록 Ni-P nodule의 면적은 넓어지고, Ni-P 도금의 표면 거칠기 (Ra)는 감소한다. 이러한 영향으로 질산 기상 처리한 시편의 high speed shear 평가후 quasi-brittle과 brittle 모드의 점유율은 감소한다. 이는 Pd 촉매 처리 시간의 증가가 SAC405 솔더조인트의 신뢰도를 향상시키는 역할을 한다는 것을 나타낸다.