• Journal of Welding and Joining
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• v.15 no.4
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• pp.78-89
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• 1997

This study has evaluated the weld metal solidification cracking behavior of several Ni base superalloys (Incoloy 825, Inconel 718 and Inconel 600). Austenitic stainless steels(304, 310S) were also included for comparison. In addition, a possible mechanism of solidification cracking in the fusion zone was suggested based on the extensive microstructural examinations with SEM, EDAX, TEM, SADP and AEM. The solidification cracking resistance of Ni base superalloys was found to be far inferior to that of austenitic stainless steels. The solidification cracking of Incoloy 825 and Inconel 718 was believel to be closely related with the Laves-austenite (Ti rich in 825 and Nb rich in 718) and MC-austenite eutectic phases formed along the grain boundaries during solidification. Cracking in Inconel 600 was always found along the grain boundaries which were enriched with Ti and P. Further, solidifidcation cracking resistance was dependent not only upon the type of love melting phases but also on the amount of the phases along the solidification grain boundaries.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.205-208
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• 2006

Similar friction welding were produced using 15 mm diameter solid bar in Ni-base superalloy(alloy718) to investigate their mechanical properties. The main friction welding parameters were selected to endure good quality welds on the basis of visual examination, tensile tests, AE total counts and ultrasonic attenuation coefficient. The specimens were tested as welded, not heat-treated. The tensile strength of the friction welded joints was increased up to 90% of the alloy718 base metal under the condition of all heating time. Optimal welding conditions were n=2,000 (rpm), $P_1=200$ (MFa), $P_2=200$ (MFa), $t_1=8$ (s), $t_2=5$ (s) when the total upset length is 4.4(mm). The weld interface of similar friction welded steel bars was mixed strongly.

• The Journal of the Korea Contents Association
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• v.10 no.11
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• pp.228-234
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• 2010

Ni-Cr and Co-Cr alloy uncontained Be element for using as dental porcelain alloy were analyzed the mechanical properties through bonding strength and fracture test after the bonding with porcelain. The bonding strengths between alloy and ceramic were measured through the shear bond strength test. Consequently, the T-3 group contained Be element that had shear strength of 41.13(${\pm}5.11$)MPa was showed the highest shear strength than the other groups. The second highest group was a verabond contained Be element that had shear strength of 40.72(${\pm}5.98$)MPa. The results of the other groups according to the shear strength were Wirobond(38.40(${\pm}9.66$)MPa) belonged to Co-Cr alloy, and Verabond 2V(32.77(${\pm}4.31$)MPa), Bellabond N(28.63(${\pm}6.39$)MPa), Bellabond plus(24.97(${\pm}6.13$)MPa), Argeloy N.P. Star(22.69(${\pm}3.41$)MPa) uncontained Be element, respectively. The morphological aspects of the fracture surface between alloys and ceramic were observed that all groups were caused mixed failure as conformation attached ceramic fragments to metallic surface by fracture process.

• Journal of Hydrogen and New Energy
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• v.29 no.6
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• pp.549-558
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• 2018

The overall efficiency depend on the overpotential of the oxygen evolution reaction in alkaline water electrolysis. Therefore, it is necessary to research to reduce the oxygen evolution overpotential of electrodes. In this study, Ni-Zn-Fe electrodes were prepared by electroplating and the surface area was increased by Zn leaching process. Electroplating variables were studied to optimize the plating parameters(electroplating current density, pH value of electroplating solution, Ni/Fe content ratio). Ni-Zn-Fe electrode, which is electroplated in a modified Watts bath, showed 0.294 V of overpotential at $0.1A/cm^2$. That result is better than that of Ni and Ni-Zn plated electrodes. As the electroplating current density of the Ni-Zn-Fe electrode increased, the particle size tended to increase and the overpotential of oxygen evolution reaction decreased. As reducing pH of electroplating solution from 4 to 2, Fe content in electrode and activity of oxygen evolution reaction decreased.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Restorative Dentistry and Endodontics
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• v.22 no.2
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• pp.659-669
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• 1997

The goals of root canal instrumentation are complete debridement of pulp tissue, removal of microbes and affected dentin, and proper cleaning and shaping of the root canal space before obturation. Instrumentation with stainless steel files has been shown to produce undesirable results in canals, regardless of the improved technique or modified file type used. Nickel-Titanium(Ni-Ti) alloy has been shown to be exceptionally elastic, having a lower bending moment and lower permanent set after torsion, compared with similar gauge stainless steel. The purpose of this study was to evaluate the change of root canal prepared by Ni-Ti rotary and stainless steel instruments. Thirty-four single rooted teeth of similar shape and canal size were divided into three groups. The teeth were scanned by computed tomography before instrumentation. In group 1, canals were instrumented using a step-back technique with K-file. In group 2, canals were prepared with K-flex file using the same technique as group 1. Group 3 was prepared with nickel-titanium(Ni-Ti) rotary instrument using a manufacture's instruction. Instrumented teeth were again scanned using computed tomography, and reformated images of the uninstrumented canals were compared with images of the instrumented canals. K-flex file and Ni-Ti file caused significantly less canal transportation than K-file in the 8mm root canal section from the apex(p<0.05). K-flex file and Ni-Ti file produced more centered canal preparation than K-file in the 2mm section(p<0.05). Ni-Ti file maintained more precisely the center of the canal than K-flex file in the 10mm section (p<0.05). There was no difference in the removed volume of canals among each groups.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.92-92
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• 1998

반도체 기술의 경이적인 발전에 힘입이 최근 휴대용 이동통신기기, 노트북 컴퓨터 등 무선전자제품의 폭발적인 수요와 함께 이들의 소형화, 경량화가 요구되어 전원인 2차전지의 경량화, 고용량화, 장수명화의 필요성이 절실해졌다. Ni-MH 전지는 Ni-Cd전지에 비해 에너지밀도가 1.5~2배에 이르고 충방전 cycle이 길며 오염물질이 없어 환경 친화적이라는 장점이 었다. Ni-MH 전지의 성능은 음극재료인 수소저장합금에 의해 좌우되므로 수소저장능력이 크고 내식 성이 우수한 합금개발이 중요하다. $CaNi_5$는 수소저장능력이 크고 매장량이 많아 값이 싸다는 장점이 있지만 KOH 용액에서 내구성이 떨어진다는 단점이 있어 주로 Heat Pump 재료에만 사용이 제한되어왔다. 본 실험에서는 결정 구조의 nanocrystalline 및 amorphous화함으로써 해리압의 변화, 방전용량의 변화 등 새로운 전극 특성을 나타낸다고 보고되고 있는 MG (Mechanical Grinding)방법을 통해 CaNis 합금의 전극특성의 변화를 살펴보았고, 아울러 고상-기상반응에서 표면에 형성된 산화피막을 제거하여 안정한 불화물을 표면에 형성시킴으로써 불순물 가스에 대한 내구성을 높이고 활성화특성을 향상 시킨다고 보고되고있는 불화처리 방법을 이용하여 불화처리 시간을 달리하면서 용액 속에서의 pH의 변화, ICP분석, 전극의 성능 및 표면 특성변화를 충방전 test, SEM 등을 통해 고찰하였다.

• Journal of Hydrogen and New Energy
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• v.5 no.1
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• pp.33-39
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• 1994

The changes of hydrogenation properties of $LaNi_5$ by hydrogen charging condition were investigated using the P-C-isotherm curves, DSC(Differential Scanning Calorimetry), GC(Gas Chromatograph), X-ray diffractometer. As a results of static hydrogen charging, the hydrogen storage capacity gradually decreased and the plateau region severly slopped. Most of the degraded properties could be restored by the annealing treatment. The degradation of hydrogen storage capacity was related with the formation of stable hydride, which was not dehydrided at room temperature.