• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.256-256
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• 2012

SoP용 재료에 응용하기 위하여 NiCuZn 페라이트계 이용한 이종접합의 관한연구를 하였다. NiCuZn 페라이트계와 유전체의 이종접합특성은 XRD, Dilatometer, LCR meter, FE-SEM, EDS 이용하여 물리 화학적 특성을 조사하였다. NiCuZn 페라이트계는 일반적인 세라믹 제조공정을 이용하여 분말을 제조하였으며, 이종접합은 모든 시편에서 잘 진행되었으며 일부 유전체의 이온들이 페라이트 쪽으로 확산이 진행되었으며 NCZF700계는 $900^{\circ}C$ 소결 시편에서 확산이 진행되지 않은 현상이 나타났다.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.231-231
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• 2009

In this work, we prepared the Ni-loaded porous SBA-15 (SBA-15) by a depositionprecipitation (D-P) method, in order to enhance the hydrogen storage capacity. The structure and morphology of the Ni/SBA-15 were characterized by X-ray diffraction (XRD) and field emission transmission electron microscopy (FE-TEM). The results showed that, at the Ni loading used at the DP times in the range of 0-120 min, SBA-15 preserved the well-ordered hexagonal porous arrangement. The textural properties of the Ni/SBA-15 were analyzed using N2 adsorption isotherms at 77 K. Specific surface area and mesopore volume of the samples were determined from the Brunauer-Emmett-Teller (BET) equation and Barrett-Joiner-Halenda (BJH) method, respectively. The hydrogen storage capacity of the Ni/SBA-15 was evaluated at 298 K/10 MPa. The hydrogen storage capacity of the Ni/SBA-15 was increased in accordance with Ni content. Consequently, it was found that the presence of Ni on mesoporous SBA-15 created hydrogen-favorable sites which enhanced the hydrogen storage capacity by spillover effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.11
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.

• Proceeding of EDISON Challenge
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• 2017.03a
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• pp.365-371
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• 2017

본 연구에서는 $Ni_2P$에서의 물의 산화를 Density Functional Theory(DFT) 계산을 이용하여 그 메커니즘을 확인하였다. 기존의 $Ni_2P$ 각 면의 표면 에너지에 관한 연구를 바탕으로 하여 P termination 된 (0001)면을 선택하였고 흡착 에너지를 계산하여 표면에 hydroxide와 oxygen coverage를 결정하였다. 산소 생성반응의 각 단계는 두 개의 site에서 계산되었고 두 site 모두 반응 결정 단계는 $^*OOH$가 형성되는 단계였다. 과전압 값을 비교한 결과 center site가 더 선호됨을 확인하였고 Center site에서 pH=14 일 때의 과전압 값은 0.64 eV으로 계산되었다.

• Journal of the Korean Chemical Society
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• v.9 no.3
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• pp.121-123
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• 1965

Polarographic studies of Ni(II) ion complexed with monoethanolamine, MEA, in aqueous solution have been carried out using sodium perchlorate as a supporting electrolyte. With use of D. C. and A. C. polarograms polarographic behaviors of the complex have been discussed. The wave obtained from basic solutions are found to be well defined and reversible, while reduction of the complex at pH smaller than 8.8 seems to be kinetic controlled with different complex species. Reducing species of the complex on the mercury electrode is determined to be $Ni(MEA)_3OH$ instead of $Ni(MEA)_2(OH)_2$ which is reported by other workers. Overall stability constant of $Ni(MEA)_3OH$ is obtained to be $10^{20}.$

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.187-195
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• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.206-214
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• 1991

In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.877-887
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• 1994

Cu-Ni-Si-P alloys have been studied in order to develop connector material which has a favorable combination of strength, electrical conductivity, elastic limit, thermal softening resistence and bend formability. Three kinds of trial alloys with various nickel and silicon content were melted and cast, hot rolled at about $900^{\circ}C$ and cold rolled. Mechanical properties and electrical conductivities of these alloys annealed at $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ were investigated. An alloy with the composition of Cu-2.7%Ni-0.53%Si-O.O29%P, which shows a favorable combination of high strength and high electrical conductivity, has been developed. Various characteristics of the alloy 1 connector material were evaluated and compared with phospher bronze(C521OR-H) and brass(C26OOR-EH) connector material.

• Journal of Hydrogen and New Energy
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• v.1 no.1
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• pp.15-23
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• 1989

The selective separation of hydrogen from gas mixture containing hydrogen was experimentally studied using $LaNi_5$. The capacity and the rate of hydrogen separation, the purity of recovered hydrogen and the optimum condition of the regeneration of deactivated $LaNi_5$ were investigated. The separation rate and the recovery ratio of hydrogen were slowly decreased with the increase of the number of hydrogen absorption cycle. It was found that this result comes from the deactivation of $LaNi_5$ partly because of the blocking of hydrocarbon compounds in the $LaNi_5$ lattice and partly because of the poisoning of $LaNi_5$ surface by carbon monoxide contained in the gas mixture. The optimum condition for the regeneration of deactivated $LaNi_5$ was obtained by heating in a vacuum to about 637 K. The recovery ratio of hydrogen at the optimum condition was observed to be about 80%. The rates of hydrogen separation were measured in the ${\alpha}$-phase and two phase regions. The rate equations could be expressed as follows ; ${\alpha}$ - phase : $$-\frac{dP{_{H_2}}}{dt}=9.836{\times}10^{-3}(P{_{H_2}}_{-P_{eq}})$$ two phase region : $$-\frac{dP_{H{_2}}}{dt}=1.6909{\times}10^2\exp(-17560/RT)(P{_{H_2}}_{-P_{eq}})$$.

• Polymer(Korea)
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• v.25 no.2
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• pp.218-225
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• 2001

The electroless plating of a metallic nickel on PAN-based carbon fiber surfaces was carried out to improve mechanical interfacial properties of the carbon fiber/epoxy resin composites which were unidirectionally fabricated by a prepregging method. In this work, the influence of Ni-P alloy concentration showing brittle-to-ductile transition was investigated on interlaminar shear strength (ILSS) and impact strength of the composites. The surface properties of carbon fibers were also measured by X-ray photoelectron spectroscopy (XPS). As the result, the $O_{ls}$ /$O_{ls}$ ratio or Ni and P amounts were increased with increasing electroless nickel plating time but the ILSS were not significantly improved. However, the impact properties was significantly improved in the presence of Ni-P alloy in the carbon fiber surface, resulting in an increase of the ductility of the composites.