• 한국표면공학회지
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• 제27권4호
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• pp.223-233
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• 1994

It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.403-403
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• 2010

The Pt-Ni alloy is an electro-catalyst of interest in the low temperature direct methanol fuel cells(DMFCs). It has been already reported that the Pt-Ni alloy catalysts may even have enhanced activity compared to pure platinum catalyst, depending on how the surfaces are prepared. The order-disorder transition in bimetallic alloy such as $\beta$-CuZn, Cu3Au, and CuAu have been investigated greatly by x-ray diffraction. After annealing the bimetallic alloy, the crystal structure changes as observed in the order-disorder transition of Cu3Au which changes from the face centered cubic to a simple cubic structure. Pt-Ni bimetallic alloy has been already reported to have the face centered cubic structure. However, in nano-scale Pt-Ni bimetallic alloy crystals the crystal structures changes to a simple cubic structure. In this experiment, we have studied the order-disorder transition in Pt-Ni bimetallic nanocrystals. Pt/Ni thin films were deposited on sapphire(0001) substrates by e-beam evaporator and then Pt-Ni alloy were formed by RTA at 500, 600, and $700^{\circ}C$ in a vacuum environment and Pt-Ni nano particles were formed by RTA at $1059^{\circ}C$ in a vacuum environment. We measured the structure of Pt-Ni bimetallic alloy films using synchrotron x-ray diffraction and SEM.

• 전기화학회지
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• 제3권2호
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• pp.121-126
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• 2000

[ $AB_5$ ] 수소저장합금인 $LaNi_5$, 합금분말에 Ni 및 Cu 무전해 도금의 영향을 전기 화학적 실험을 통하여 고찰하였다. 전기 화학적 실험은 정전류 충$\cdot$방전 실험, 순환전류전위 실험, 교류 임피던스 실험 등을 실시하여 도금하지 않은 $LaNi_5$ 전극과 Ni 및 Cu 무전해 도금한 전극간의 특성을 비교 연구하였다. 현상학적인 분석으로는 SEM을 이용하여 분말상의 미세조직을 관찰하였으며 X-선 회절시험을 실시하였다 무전해 도금을 실시하여 Ni 및 Cu박막이 피복된 수소저장 합금은 활성화 특성파 싸이클 수명 등의 특성이 개선되었으며 도금하지 않은 전극에 비하여 반응속도가 증가하였다. 또한 충$\cdot$방전이 반복됨에 따라 전극과 전해질 계면에서의 전하이동저항이 현저하게 감소하였다. 따라서 본 연구에서 실시한 $LaNi_5$, 활물질에 Ni및 Cu 무전해 도금을 실시하면 초기 활성화반응을 촉진시키며 $LaNi_5$활물질이 전해질과의 직접 접촉을 피하게 되어 전극의 수명을 증가시키는 것을 알 수 있었다.

• Journal of Welding and Joining
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• 제12권4호
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• pp.85-101
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• 1994

Effect of Cr, Cu and Ni metal powders addition on the alloyed layer of aluminum alloy (AC2B) has been investigated with the plasma transferred arc (PTA) overlaying process. The overlaying conditions were 125-200A in plasma arc current, 150mm/min in process speed and 5-20g/min in powder feeding rate. Main results obtained are summarized as follows: 1) It was made clear that formation of thick surface alloyed layer on aluminum alloy is possible by PTA overlaying process. 2) The range of optimum alloying conditions were much wider in case of Cu and Ni powder additions than the case of Cr powder addition judging from the surface appearance and the bead macrostructure. 3) Alloyed layer with Cu showed almost the homogeneous microstructure through the whole layer by eutectic reaction. alloyed layers with Cr and Ni showed needle-like and agglomerated microstructures, the structure of which has compound layer in upper zone of bead by peritectic and eutectic-peritectic reactions, respectively. 4) Microconstituents of the alloyed layer were analyzed as A1+CrA $l_{7}$ eutectics, C $r_{2}$al sub 11/, CrA $l_{4}$, C $r_{4}$A $l_{9}$ and C $r_{5}$A $l_{*}$ 8/ for Cr addition, Al+CuA $l_{2}$(.theta.) eutectics and .theta. for Cu addition, and Al+NiA $l_{3}$ eutectics. NiA $l_{3}$, N $i_{2}$A $l_{3}$ and NiAl for Ni addition. 5) Concerning defect of the alloyed layer, many blow holes were seen in Cr and Ni additions although there was lesser in Cu addition. Residual gas contents in blow hole for Cu and Ni alloyed layer were confirmed as mainly $H_{2}$ and a littie of $N_{2}$ Cracking was observed in compound zone of the alloyed layer in case of Cr and Ni addition but not in Cu alloyed layer.r.r.

• 한국주조공학회지
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• 제21권5호
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• pp.286-289
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• 2001

The glass formation behavior was investigated in the melt spun Zr-Ti-Cu-Ni-X (X=B, P and Si) ribbons. The magnitude of supercooled liquid region of Zr-Ti-Cu-Ni alloy increased with an addition of alloying element. The glass transition temperature and the crystallization temperature increased and the magnitude of supercooled liquid region decreased with increasing the content of alloying elements. The largest supercooled liquid region was observed in the Si containing alloy. This is believed to be due to the dense atom packing with the optimum atomic size ratio of constituent elements.

• 한국주조공학회지
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• 제24권1호
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• pp.40-44
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• 2004

The influence of Pd and Ag additions on the thermal stability, the glass forming ability (GFA) and mechanical property of $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys obtained by melt spun and injection casting method have been investigated by using of X-ray diffraction, thermal analysis (DTA, DSC) and micro-Vickers hardness(Hv) testing. The thermal properties of melt-spun $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys exhibit a supercooled liquid region(${\Delta}T_x$) exceeding 91 K before crystallization. The largest ${\Delta}T_x$ reaches as large as 126 K for the $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_5$ alloy. The reduced glass transition temperature, $T_{rg}$ increased with increasing Ag content. The largest $T_{rg}$ is obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ alloy. The $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy rod with 3 mm in diameter was fabricated by injection casting. Hv increased with increasing Ag content and the largest value was obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy.

• 한국분말재료학회지
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• 제6권2호
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• pp.171-177
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• 1999

Ti-45.2at.%Ni-5at.%Cu and Ti-40.2at.%Ni-10atat.%Cu alloy powders were fabricated by gas atomization process. The microstructures, Shape, hardness and phase transformation behaviors of the powders were investigated by means of optical microscopy, scanning electron microscopy, micro-hardness measurement, x-ray diffraction analyses and differential scanning calorimetry. The hardness of the Ti-Ni-XCu alloy powders decreased as Cu-content increased. The x-ray diffraction analyses were carried out for powders without heat treatment, and those that treated at 85$0^{\circ}C$ for an hour in a vaccum state($10^5$ torr) and then quenched into ice water. The intensity of B$19^t$ phase increased with heat treating. The monoclinic B$19^t$ martensite was formed in the Ti-Ni-XCu alloy powders during cooling.

• 한국분말재료학회지
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• 제8권1호
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• pp.42-49
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• 2001

Ti-50Ni(at%) and Ti-40Ni-10Cu(at%) alloy powders have been fabricated by ball milling method, and their microstructure and phase transformation behavior were investigated by means of scanning electron microscopy/energy dispersive spectrometry, differential scanning calorimetry (DSC), X-ray diffractions and transmission electron microscopy. In order to investigate the effect of ball milling conditions on transformation behavior, ball milling speed and time were varied. Ti-50Ni alloy powders fabricated with the milling speed more than 250 rpm were amorphous, while those done with the milling speed of 100rpm were crystalline. In contrast to Ti-50Ni alloy powders, Ti-40Ni-10Cu alloy powders were crystalline, irrespective of ball milling conditions. DSC peaks corresponding to martensitic transformation were almost discernable in alloy powders fabricated with the milling speed more than 250 rpm, while those were seen clearly in alloy powders fabricated with the milling speed of 100 rpm. This was attributed to the fact that a strain energy introduced during ball milling suppressed martensitic transformation.

• 한국표면공학회지
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• 제39권6호
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• 한국분말재료학회지
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• 제9권1호
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.