• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• 한국분말재료학회지
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• 제22권3호
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• pp.181-186
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• 2015

In this study, the effect of the friction stir welding (FSW) was compared with that of the gas tungsten arc welding (GTAW) on the microstructure and microhardness of Cu-Ni alloy weldment. The weldment of 10 mm thickness was fabricated by FSW and GTAW, respectively. Both weldments were compared with each other by optical microstructure, microhardness test and grain size measurement. Results of this study suggest that the microhardness decreased from the base metal (BM) to the heat affected zone (HAZ) and increased at fusion zone (FZ) of GTAW and stir zone (SZ) of FSW. the minimum Hv value of both weldment was obtained at HAZ, respectively, which represents the softening zone, whereas Hv value of FSW weldment was little higher than that of GTAW weldment. These phenomena can be explained by the grain size difference between HAZs of each weldment. Grain size was increased at the HAZ during FSW and GTAW. Because FSW is a solid-state joining process obtaining the lower heat-input generated by rotating shoulder than heat generated in the arc of GTAW.

• 한국자기학회지
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• 제3권4호
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• pp.289-292
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• 1993

3-Gun 고주파 마그네트론 스퍼터링법에 의해 [Ni/Fe/Cu] 다층박막과 [Fe/Ni/Fe/Cu] 다층 박막을 제조하고 Ni/Fe 두께비에 따른 자기저항특성을 조사하였다. 열처리에 의한 효과를 고나찰하기 위하여 진공열처리를 행하였다. 두 종류의 다층박막에서 사잇층 Cu 두께에 따른 자기저항의 진동 현 상을 관찰할 수 있었다. Ni과 Cu의 계면에 삼입된 Fe 두께가 약 $3\;\AA$일때 자기저항이 극대값을 보 였으며, Fe 두께가 $1~2\;\AA$일때 자기저항은 이에 비해 크게 감소하지 않았으나, 포화자장은 현저 히 감소하는 것으로 나타났다. ${[Fe(1\;\AA)/Ni(18\;\AA)/Fe(1\;\AA)/Cu(23\;\AA)]}_{20}Fe(80\;\AA)/Si$ 시편의 경우, 100 Oe의 포화자장에서 6%의 자기저항을 얻을 수 있었다. 열처리에 의해서는 자기저항이나 큰 변화를 관찰할 수 없었으며, 합금상 형성 여부는 확인할 수 없었다.

• 대한금속재료학회지
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• 제48권11호
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• 한국표면공학회지
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• 제42권6호
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• pp.280-286
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• 2009

In this study, the corrosion property of copper alloy tubes in seawater has been investigated. Three copper alloys of nominal composition Cu-20Zn-2Al(Al-Brass), Cu-30Ni(CN70/30) and Cu-10Ni(CN90/10) were considered. The samples were immersed in 3%NaCl flowing solution at $90^{\circ}C$ for 30, 50 and 80 days. Corrosion rate of copper alloy tubes in 3%NaCl flowing solution was investigated by weight-loss measurements and electrochemical test. The CN70/30 showed lowest corrosion rate among three copper alloy tubes. Because of passive films formation, corrosion rates of three types of copper tubes were decrease with time. Surface characteristics of copper alloy tubes were analyzed by optical micrograph(OM), scanning electronic microscopy (SEM), energy dispersive X-ray analysis(EDAX) and X-ray diffraction patterns(XRD). CN70/30 showed partly pitting problem on the surface owing to high Fe content, even though having high resistant against corrosion. Cracks appeared on the surface of CN90/10 and CN70/30 after more than 50 days immersion, which could be derived from high nickel contents.

• Applied Microscopy
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• 제45권2호
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• pp.58-62
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• 2015

Formation of an icosahedral phase in the bulk glass forming $Ti_{40}Zr_{29}Be_{14}Cu_9Ni_8$ alloy during crystallization from amorphous phase and solidification from melt is investigated. The icosahedral phase with a size of 10 to 15 nm forms as a thermodynamically stable phase at intermediate temperature during the transformation from amorphous to crystalline phases such as Laves and ${\beta}$-(Ti-Zr) phases, indicating that the existence of the icosahedral cluster in the undercooled liquid. On the other hand, the icosahedral phase forms as a primary solidification phase even though the Laves phase is stable at high temperature, which is can be explained based on the high nucleation rate of icosahedral phase relative to that of competing crystalline Laves phase due to lower interfacial energy between icosahedral and liquid phases.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.273-276
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• 2005

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

• 한국수소및신에너지학회논문집
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• 제10권4호
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• pp.225-232
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• 1999

Ni-MH 2차 전지의 음극재료로 사용되는 수소저장합금중 이론 방전용량이 가장 높은 $Mg_2Ni$를 기계적 합금법으로 제조하여 각종 첨가물의 첨가에 따른 전기화학적 특성을 조사하였다. $Mg_2Ni$는 고에너지 볼밀인 SPEX 8000을 이용하여 두가지 방법으로 제조하였다. 하나는 Mg, Ni 분말에 첨가물인 $AB_5$, $AB_2$계 수소저장합금과 Ni, Co, Cu를 첨가하여 12시간 볼밀링한 경우이고, 다른 하나는 먼저 Mg, Ni 분말을 1시간동안 볼밀링한 후 $300{\sim}400^{\circ}C$에서 열처리하여 $Mg_2Ni$를 제조한 후 여기에 첨가물을 10wt% 첨가하여 12 시간동안 볼밀할 경우이다. 이 볼밀링한 복합분말을 상온에서 $754tons/cm^2$의 압력으로 냉간압착하여 디스크 모양의 전극을 제조하였다. 실험결과 볼밀링 후 열처리를 거친 합금분말의 경우가 그렇지 않은 경우에 비해 전극의 방전용량이 높았으며, Ni을 첨가한 경우는 방전용량을 증가시키고 Co를 첨가한 경우는 싸이클 특성이 향상되었다. 특히 $Mg_2Ni$에 Ni을 10wt%를 첨가하여 12시간 볼밀한 경우 $Mg_2Ni$의 최대 방전용량은 546mAh/g.alloy으로 이론용량의 약 55%에 달했다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1993년도 추계연구발표회 논문개요집
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• pp.42-43
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• 1993

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2007년도 High Temperature Superconductivity Vol.XVII
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• pp.74-74
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• 2007