• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.276-279
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• 2004

The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

• Journal of Powder Materials
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• v.24 no.5
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• pp.370-376
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• 2017

In this study we manufacture a Ni-Cr-B-Si +WC/12Co composite coating layer on a Cu base material using a laser cladding (LC) process, and investigate the microstructural and mechanical properties of the LC coating and Ni electroplating layers (reference material). The initial powder used for the LC coating layer is a powder feedstock with an average particle size of $125{\mu}m$. To identify the microstructural and mechanical properties, OM, SEM, XRD, room and high temperature hardness, and wear tests are implemented. Microstructural observation of the initial powder and LC coating layer confirm the layer is composed mainly of ${\gamma}-Ni$ phases and WC and $Cr_{23}C_6$ carbides. The measured hardness of the LC coating and Ni electroplating layers are 653 and 154 Hv, respectively. The hardness measurement from room up to high temperatures of $700^{\circ}C$ result in a hardness decrease as the temperature increases, but the hardness of the LC coating layer is higher for all temperature conditions. Room temperature wear results show that the wear loss of the LC coating layer is 1/12 of the wear level of the Ni electroplating layer. The measured bond strength is also greater in the LC coating than the Ni electroplating.

• Journal of the Korean institute of surface engineering
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• v.37 no.6
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• pp.344-349
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• 2004

Emulsions were formed through putting small quantity of nickel electroplating solution into supercritical carbon dioxide, and then electroplating in the $sc-CO_2$ emulsions was conducted. It is an environmental-friendly technology that can solve the treatment of a large quantity of toxic plating wastewater, which is a big problem in the existing wet plating, and also can reduce secondary waste generation fundamentally. Supercritical carbon dioxide emulsions enhanced by ultrasonic horn were formed by non-ionic surfactant and nickel solution. Plating condition within emulsions was set up as 120bar and $55^{\circ}C$ through measurement of electrical conductivity following the pressure change. Experiments were conducted respectively against supercritical carbon dioxide emulsions electroplating and general chemical electroplating, and then their results were compared and analyzed. As the experiment result utilizing emulsions, plating surface was formed very evenly even with a small quantity of electroplating solution, and fine particles were plated compactly without any pinhole or crack due to hydrogenation, which occurs in general electroplating. Used electroplating solution can be reused through recovery process. Therefore, this technology will be able to be applied as new clean technology in electro-plating.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.255-259
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• 2010

In this work, Ni-Co composites incorporated with nano-sized SiC particles in the range of 45-55 nm are prepared by electroplating. The effects of plating duration on the chemical composition, surface morphology, crystalline structures and hardness have been studied. The maximum hardness of Ni-Co-SiC composite coating is approximately 633 Hv at plating duration of 1 h. The hardness is gradually decreased with increasing plating duration, which can be attributed to the growth of crystalline size and the agglomerates of SiC nano-particles. It is therefore explained that the grain refinement of Ni-Co matrix and stable dispersion of SiC particles play an important role for strengthening, which indicate Hall-Petch relation and Orowan model were dominant for hardening of Ni-Co-SiC composite coatings.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.53-59
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• 2005

In this study, the supercritical electroplating was investigated by forming macroemulsion of electroplating solution using surfactant in supercritical $CO_2$. The fluorinated analogous AOT surfactant, sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate which has both '$CO_2$ philic' chains and 'hydrophilic' head group was used as a surfactant, and Ni plate and Cu plate were used as the anode and the cathode, respectively. Electroplating was carried out in the conventional method and the supercritical macroemulsion and both results were compared. The supercritical electroplating was carried out in various concentration of surfactant such as 2, 4, 7 wt%, the volume ratio of Ni-plating solution to $CO_2$ was varied in the range of 10-70 vol%, and propane was used as a supercritical fluid instead of $CO_2$. According to the experimental results, the plated surface of Ni on Cu plate performed in supercritical macroemulsion was better than that, in conventional state. In the image of Ni surface plated on Cu plate in supercritical state, there were fewer pin-holes and pits comparing with that in the conventional process. The current and conductivity was increased as the volume ratio of Ni-plating solution to $CO_2$ was increased and the current and the amount of Ni plated on Cu plate were decreased as the concentration of surfactant become higher. In addition, in case of the continuous phase, using $CO_2$ was more effective than using $CO_2$.

• Journal of the Korean institute of surface engineering
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• v.39 no.3
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• pp.115-120
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• 2006

The codeposition behavior of WC particles from an additive-free nickel sulfate and sulfamate solution has been investigated. Electroplating of Ni/WC composites was carried out at different current density with variation of WC particle size. The Guglielmi adsorption mechanism is applied to the electroplating of the fine WC in Ni matrix. The contents of WC in Ni composite coating were increased both by increasing current density and WC concentration in the bath. The hardness of Ni/WC composite coating at low current density is higher than that at high current density since finer WC particles dispersed through the coating. The codeposition behaviors of Co coated WC particles were also investigated. Conducting layer of particles promoted the codeposition behavior of Ni/WC-Co composite coatings.

• Journal of Electrochemical Science and Technology
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• v.14 no.4
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• pp.377-387
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• 2023

Ni-W/Al₂O₃ nano-composites were electrodeposited on mild steel substrate for mechanical and corrosion resistance applications. This study focused on the preparation of Ni-W/Al₂O₃ nano-composite coating with various quantity of Al₂O₃ incorporations. The addition of Al₂O₃ in the electrolytes were varied from 1-10 g/L in electrolytes and the Al₂O₃ incorporation in Ni-W/Al₂O₃ nano-composite coatings were obtained from 1.82 to 13.86 wt.%. The incorporation of Al₂O₃ in Ni-W alloy matrix influenced the grain size, surface morphology and structural properties were observed. The distributions of Al₂O₃ particle in alloy matrix were confirmed using electron microscopy (FESEM and TEM) and EDAX mapping analysis. The crystal structure informations were studied using X-ray diffraction method and it confirms that the deposits having cubic crystal structure. The better corrosion rate (0.87 mpy) and microhardness (965 HV) properties were obtained for the Ni-W/Al₂O₃ nano-composite coating with 13.86 wt.% of Al₂O₃ incorporations.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.77-81
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• 2017

Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.79-80
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• 2006

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.21-22
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• 2007