• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.04a
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• pp.10-11
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• 2003

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.538-544
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• 1998

The spallation of a thermal barrier coating layer depends on the formation of brittle spinels. thermal expansion mismatch between ceramic and metal. the phase transformation of a ceramic layer and residual stress of coating layer. In this work. the formation mechanism of oxide scale formed by oxidation treatment at 90$0^{\circ}C$ was investigated in order to verify oxidation behavior at the interface between E-beam coated $Zr0_2$-7wt.% $Y_20_3$ and plasma sprayed CoNiCrAIY. Some elements distributed in the bond coating layer were selectively oxidized after oxidation. At the initial time of oxidation. AI-depletion zone and $\alpha$-$Al_O_3$,O, were formed at the bond coating layer by the AI-outward diffusion. After layer grew until critical thickness. spinels. $Cr_20$, and $C0_2CrO_4$ by outward diffusion of Co. Cr, Ni were formed. It was found that the formation of spinels may be related to the spallation of $Zr0_2$-7wt.% $Y_20_3$ during isothermal oxidation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.145-150
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• 2003

In the electronic components and devices fabrication, thin film resistors with low TCR(temperature coefficient of resistance) and high precision have been used over 3 GHz microwave in recent years. Ni-Cr alloys thin films resistors is one of the most commonly used resistive materials because it has low TCR and highly stable resistance. In this work, we fabricated thin film resistors using Evanohm alloys target(72Ni-20Cr-3Al-4Mn-Si) of s-type with excellent resistors properties by RF-sputtering. Also we reported best annealing conditions of thin film resistors for microwave to observe microstructure and electronic properties of thin film according to annealing conditions$(200^{\circ}C,\;300^{\circ}C,\;400^{\circ}C,\;500^{\circ}C)$.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.323-329
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• 2014

Effects of sealant and sealing procedure on corrosion resistance of high velocity oxy-fuel (HVOF) sprayed coatings were studied. HVOF-sprayed CrC-20NiCr coatings were sealed using three commercial sealants based on phenolics and epoxy. Penetration depth of sealants, measured by fluorescent microscope technique, was between $19{\mu}m$ and $340{\mu}m$ depending on sealant, sealing condition or sealing procedure. It was found that sealing on rotation status was more effective than that on stationary specimen due to the Coriolis effect of fluid in pores of the coating. From the CASS results, corrosion resistance of properly sealed CrC-20NiCr coatings was equal to that of hexa-valent chromium plating.

• Transactions of the Korean hydrogen and new energy society
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• v.12 no.1
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• pp.39-50
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• 2001

Vanadium based solid solution alloys have been studied as a potential negative electrode of Ni/MH battery due to their high hydrogen storage capacity. In order to improve the kinetic property of V-Ti alloy in KOH electrolyte, the ball-milling process with Ni, which has a catalytic effect of hydrogen absorption/desorption, was carried out to modify the surface properties of V-Ti-Cr alloys with high hydrogen storage capacity. Moreover, to overcome the problem of poor cycle life, V-Ti alloy substituted by Cr, V0.68 Ti0.20 Cr0.12, has been developed showing a good cycle performance (keeping about 80 % of initial discharge capacity after 200 cycles). The cycle life of surface-modified V0.68 Ti0.20 Cr0.12 alloy was improved by suppressing the formation of TiO2 layer on the alloy surface while decreasing the amount of dissolved vanadium in the KOH electrolyte. In order to promote the effect of Ni coating on the surface property of V0.68 Ti 0.20 Cr 0.12 alloy by ball-milling, filamentary-typed Ni, which has higher surface coverage area than sphere-typed Ni was used as a surface modifier. Consequently, the surface-modified V0.68 Ti0.20 Cr0.12 alloy electrode showed a improved discharge capacity of 460 mAh/g.

• Analytical Science and Technology
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• v.6 no.2
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• pp.197-205
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• 1993

Blends of elemental Ni and 20 weight % Cr powder were milled for different period in a laboratory attritor. Powder size distribution, microstructure and X-ray diffraction characteristics were investigated as a function of processing period. Saturated magnetization, Ms and coercive force, Hc we also measured and compared with plasma melted ingot to confirm the mechanically alloyed states. Mechanical alloying occurred as a consequence of the partition of powders and the increase of interfacial area driving diffusing of Cr into Ni. However, magnetic properties of chemically homogeneous solid solution like melted ingot has not been observed even though steady state of submicron grain size has been achieved after milling over 15 hrs. Further mechanical alloying period gave refinement of grain size, which resulted in the increase of alloyed layer. It is concluded that homogenization should be controlled by the increase of interfacial area between constitutive powders caused by plastic particle deformation and by the diffusion of Cr within the alloyed phase into Ni-rich phase through lattice defects.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.144-144
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• 2006

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.152-152
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• 2005

• Proceedings of the Korean Magnestics Society Conference
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• 2001.10a
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• pp.88-89
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• 2001

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.554-559
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• 2005

Ni/Cr thin film is very interesting material as thin film resistors, filaments, and humidity sensors because their relatively large resistivity, more resistant to oxidation and a low temperature coefficient of resistance (TCR). These interesting properties of Ni/Cr thin films are dependent upon the preparation conditions including the deposition environment and subsequent annealing treatments. Ni/Cr thin films of 250 nm were deposited by DC magnetron sputtering on $Al_2O_3/Si$ substrate with 2-inch Ni/Cr (80/20) alloy target at room temperature for 45 minutes. Annealing treatments were performed at $400^{\circ}C,\;500^{\circ}C,\;and\;600^{\circ}C$ for 6 hours in air or $H_2$ ambient, respectively. The clear crystal boundaries without crystal growth and the densification were accomplished when the pores were disappeared in air ambient. Most of surface was oxidic including NiO, $Ni_2O_3$ and $Cr_xO_y$(x=1,2, y=2,3) after annealing in air ambient. The crystal growth in $H_2$ ambient was formed and stabilized by combination with each other due to the suppression of oxidized substance on film surface. Most oxidic Ni was restored when the oxidic Cr was present due to its stability in high-temperature $H_2$ ambient.