• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.994-996
• /
• 2002

We present a novel fabrication method for a V-grooved mold of the light guide plat of TFT-LCD with MEMS technology. This method is performed by the inclined UV lithography and Ni electroplating unlike the previous mechanical processing technique. V-grooves with different dimension can be made simultaneously with single photomask.

• Proceedings of the KIEE Conference
• /
• 1994.11a
• /
• pp.422-424
• /
• 1994

A comb drive electrostatic micro gripper was designed and fabricated. We designed it analytically using electrostatic force and cantilever deflection equation. In fabrication, we used LIGA-like technology consisted of Ni electroplating through polyimide patterned by $O_2$ Plasma RIE and Al sacrificial layer. This micro gripper was designed to handle an optical fiber which is $125{\mu}m$ in diameter.

• Korean Journal of Materials Research
• /
• v.11 no.8
• /
• pp.666-670
• /
• 2001

To improve the corrosion resistance of separator wet-seal area which is the barrier of commercialization of molten carbonate fuel cell(MCFC), Ni/Y/Al coating layer was fabricated by Ni electroplating and Y, Al e-beam PVD on AISI 316L stainless steel. NiAlY alloy coating layer was formed by heat treatment in reduction atmosphere at $800^{\circ}C$ for 5hr. Immersion test in molten carbonate salt at $650^{\circ}C$ was performed on as- received AISI 316L stainless steel and NiAlY coated specimen. According to cross sectional SEM/EDS observations, corrosion resistance of separator wet-seal area was improved by formation of dense oxide layers of Al and Y.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.7
• /
• pp.575-579
• /
• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2011.11a
• /
• pp.805-806
• /
• 2011

Thermal conductivities of a Ni-Cr coating applied for the protection of a thrust chamber operating under the condition of high pressure and high temperature were measured. Results showed that the data used in heat transfer calculation has a 20~25% margin compared with data measured.

• Environmental Analysis Health and Toxicology
• /
• v.19 no.2
• /
• pp.119-134
• /
• 2004

Human exposure to highly nickel-polluted environments, such as those associated with nickel refining, electroplating, and welding, has the potential to produce a variety of pathologic effects. Among them are skin allergies, lung fibrosis, and cancer of the respiratory tract. The exact mechanisms of nickel-induced carcinogenesis are not known and have been the subject of numerous epidemiologic and experimental investigations. This review provides the evidence of the current state for the genotoxic and mutagenic activity of Ni (II) particularly at high doses. Such doses are best delivered into the cells by phagocytosis of sparingly soluble nickel-containing dust particles. Ni (II) genotoxicity may be aggravated through the generation of DNA-damaging reactive oxygen species (ROS) and the inhibition of DNA repair by this metal. The epigenetic effects of nickel includes alteration in gene expression resulting from DNA hypermethylation and histone hypoacetylation, as well as activation some signaling pathways and subsequent transcrziption factors.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2006.05a
• /
• pp.188-190
• /
• 2006

본 연구에서는 Anodic Aluminum Oxide(AAO) 템플레이트를 이용하여 전기도금법으로 일정한 길이와 고밀도 대면적의 Nickel nanorod를 제작하였다. 전기도금법으로 AAO-템플레이트내를 채우는 방법으로 제작되었다. 그 결과 직경 $80{\sim}100$ nm, 길이 $0.5{\mu}m$ 가량의 균일한 nanorod를 직경 40mm, 두께 $0.8{\mu}m$의 대면적 원형 AAO-템플레이트에 가득 채우는데 성공 하였으며 AAO 템플레이트는 제거되어 기판 위에 free-standing 되는 구조로 제작 되었다

• 한국태양에너지학회:학술대회논문집
• /
• 2009.04a
• /
• pp.225-229
• /
• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Corrosion Science and Technology
• /
• v.20 no.5
• /
• pp.308-314
• /
• 2021

Neutron dose level at bottom head of a reactor pressure vessel (RPV) was calculated using reactor vessel neutron transport for a Korean nuclear power plant A. At 34 EFPY with a 40-year (2042) design life after plating repair, irradiation fast neutron effect was 6.6x10¹⁵ n/cm². As helium(He) gas can be generated by Ni only at 1/10⁶ level of 5 × 10²¹ n/cm², He generation possibility in the Ni plating layer is very little during 40 years of operation (2042, 34 EFPY). Thermal neutrons can significantly affect the generation of He from Ni metal. At 10 years after a repair, He can be generated at a level of about 0.06 appm, a level that can add general welding repair without any consideration. After 40 years of repair, 9.8 appm of He may be generated. Although this is a rather high value, it is within the range of 0.1 to 10 appm when welding repair can be applied. Clad repair by Ni electroplating technology is expected to greatly improve the operation efficiency by improving the safety and shortening the maintenance period of the nuclear power plant.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.2
• /
• pp.33-37
• /
• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.