• 방사선산업학회지
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• 제11권3호
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• pp.173-179
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• 2017

The small-scale electroplating device was designed and fabricated for Ni-63 sealed source (foil type) with a high specific activity needed for production of betavoltaic battery. The condition of Ni electroplating was optimized by using fabricated electroplating device to establish a Ni-63 electroplating condition on the Ni foil. The results showed that the optimum surface morphology and thickness of Ni deposit was obtained for 1,758 seconds at a current density of $15mA{\cdot}cm^{-2}$ with 0.5% tween 20. Radioisotope Ni-63 electroplating was implemented under established condition. The radioactivity of Ni-63 sealed source was calculated to $28mCi{\cdot}cm^{-2}$, and the thickness of Ni-63 deposit was about $2.4{\mu}m$.

• 한국수소및신에너지학회논문집
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• 제29권6호
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• pp.549-558
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• 2018

The overall efficiency depend on the overpotential of the oxygen evolution reaction in alkaline water electrolysis. Therefore, it is necessary to research to reduce the oxygen evolution overpotential of electrodes. In this study, Ni-Zn-Fe electrodes were prepared by electroplating and the surface area was increased by Zn leaching process. Electroplating variables were studied to optimize the plating parameters(electroplating current density, pH value of electroplating solution, Ni/Fe content ratio). Ni-Zn-Fe electrode, which is electroplated in a modified Watts bath, showed 0.294 V of overpotential at $0.1A/cm^2$. That result is better than that of Ni and Ni-Zn plated electrodes. As the electroplating current density of the Ni-Zn-Fe electrode increased, the particle size tended to increase and the overpotential of oxygen evolution reaction decreased. As reducing pH of electroplating solution from 4 to 2, Fe content in electrode and activity of oxygen evolution reaction decreased.

• 반도체디스플레이기술학회지
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• 제12권3호
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• pp.7-12
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• 2013

Ni-CNT(Carbon Nanotube) composite coatings is were formed by electrodeposition and their physical properties were investigated with variations of CNT content(1, 3, 6. 9 g/L) in the electrolyte solution, while the current density and electroplating time were fixed respectively at $6A/dm^2$ and 90 min.. With increasing CNT content from 1 to 9 g/L, incorporated CNTs into the composite coating were limited from 4.65 wt.% to 7.38 wt.%. Microhardness and contact angle values were increased with increasing CNT content of upto 3 g/L. With increasing the CNT content further, physical properties were degraded due to agglomeration, poor adhesion of CNTs to Ni matrix and thus rough surfaces. Optimum electroplating conditions were found to be the CNT content of 3 g/L, current density of 6 A/dm2 and electroplating time of 90 min.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Journal of Electrochemical Science and Technology
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• 제14권4호
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• pp.377-387
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• 2023

Ni-W/Al₂O₃ nano-composites were electrodeposited on mild steel substrate for mechanical and corrosion resistance applications. This study focused on the preparation of Ni-W/Al₂O₃ nano-composite coating with various quantity of Al₂O₃ incorporations. The addition of Al₂O₃ in the electrolytes were varied from 1-10 g/L in electrolytes and the Al₂O₃ incorporation in Ni-W/Al₂O₃ nano-composite coatings were obtained from 1.82 to 13.86 wt.%. The incorporation of Al₂O₃ in Ni-W alloy matrix influenced the grain size, surface morphology and structural properties were observed. The distributions of Al₂O₃ particle in alloy matrix were confirmed using electron microscopy (FESEM and TEM) and EDAX mapping analysis. The crystal structure informations were studied using X-ray diffraction method and it confirms that the deposits having cubic crystal structure. The better corrosion rate (0.87 mpy) and microhardness (965 HV) properties were obtained for the Ni-W/Al₂O₃ nano-composite coating with 13.86 wt.% of Al₂O₃ incorporations.

• 한국재료학회지
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• 제13권1호
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.276-279
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• 2004

The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

• 제어로봇시스템학회논문지
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• 제14권4호
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• pp.361-364
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• 2008

Tips of probe card were fabricated using MEMS technology. P-type silicon wafer with $SiO_2$ layer was used as a substrate for fabricating the probe card. Ni-Cr and Au used as seed layer for electroplating Ni were deposited on the silicon wafer. Line patterns for probing devices were formed on silicon wafer by electroplating Ni through mold which formed by MEMS technology. Bridge structure was formed by wet-etching the silicon substrate. AZ-1512 photoresist was used for protection layer of back side and DNB-H100PL-40 photoresist was used for patterning of the front side. The mold with the thickness of $60{\mu}m$ was also formed using THB-120N photoresist and probe tip with thickness of $50{\mu}m$ was fabricated by electroplating process.

• 한국표면공학회지
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• 제37권6호
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• pp.344-349
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• 2004

Emulsions were formed through putting small quantity of nickel electroplating solution into supercritical carbon dioxide, and then electroplating in the $sc-CO_2$ emulsions was conducted. It is an environmental-friendly technology that can solve the treatment of a large quantity of toxic plating wastewater, which is a big problem in the existing wet plating, and also can reduce secondary waste generation fundamentally. Supercritical carbon dioxide emulsions enhanced by ultrasonic horn were formed by non-ionic surfactant and nickel solution. Plating condition within emulsions was set up as 120bar and $55^{\circ}C$ through measurement of electrical conductivity following the pressure change. Experiments were conducted respectively against supercritical carbon dioxide emulsions electroplating and general chemical electroplating, and then their results were compared and analyzed. As the experiment result utilizing emulsions, plating surface was formed very evenly even with a small quantity of electroplating solution, and fine particles were plated compactly without any pinhole or crack due to hydrogenation, which occurs in general electroplating. Used electroplating solution can be reused through recovery process. Therefore, this technology will be able to be applied as new clean technology in electro-plating.

• Nuclear Engineering and Technology
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• 제51권8호
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• pp.1978-1982
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• 2019

The paper presents the electrical performance measurements of a prototype nuclear battery and two types of betavoltaic cells. The electrical performance was assessed by measuring current-voltage properties (I-V) and determining the short-circuit current and the open-circuit voltage. With ⁶³Ni as an irradiation source, the open-circuit voltage and the short-circuit current were determined as 1 V and 64 nA, respectively. The prototype consisted of 10 betavoltaic cells that were prepared using radioactive ⁶³Ni. Electroplating of the radioactive ⁶³Ni on an ohmic contact (Ti-Ni) was carried out at a current density of 20 mA/㎠. Two types of betavoltaic cells were studied: with an external ⁶³Ni source and a ⁶³Ni-covered source. Under irradiation of the ⁶³Ni source with an activity of 10 mCi, the open-circuit voltage V_oc of the fabricated cells reached 151 mV and 109 mV; the short-circuit current density J_sc was measured to be 72.9 nA/cm2 and 64.6 nA/㎠, respectively. The betavoltaic cells had the fill factor of 55% and 50%, respectively.