• 한국세라믹학회지
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• 제45권12호
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• pp.807-814
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• 2008

The Cu-Ni-YSZ cermet anodes for direct use of methane in solid oxide fuel cells have been fabricated by electroplating Cu into the porous Ni-YSZ cermet anode. The uniform distribution of Cu in the Ni-YSZ anode could be obtained via pulse electroplating in the aqueous solution mixture of $CuSO_4{\cdot}5H_{2}O$ and ${H_2}{SO_4}$ for 30 min with 0.05 A of average applied current. The power density ($0.17\;Wcm^{-2}$) of a single cell with a Cu-Ni-YSZ anode was shown to be slightly lower in methane at $700^{\circ}C$, compared with the power density ($0.28\;Wcm^{-2}$) of a single cell with a Ni-YSZ anode. However, the performance of the Ni-YSZ anode-supported single cell was abruptly degraded over 21 h because of carbon deposition, whereas the Cu-Ni-YSZ anode-supported single cell showed the enhanced durability upto 52 h.

• KIEE International Transactions on Electrophysics and Applications
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• 제3C권1호
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• pp.23-27
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• 2003

Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

• 수산해양교육연구
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• 제10권1호
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• pp.69-78
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• 1998

Thermal sprayed Cu-Ni alloy coating on the carbon steel was carried out impingement erosion-corrosion test and electrochemical corrosion test in the marine environment. The impingement erosion-corrosion behavior and electrochemical corrosion characteristics of substrate(SS400) and thermal sprayed Cu-Ni coating was investigated, and the corrosion control efficiency of Cu-Ni coating to substrate was estimated quantitatively. Main results obtained are as follows : 1) The weight loss rate of Cu-Ni coating layer by the impingement erosion-corrosion compared with substrate was smaller in high specific resistance solution than in low specific resistance solution. 2) The corrosion potential of Cu-Ni coating layer spray coating in the marine environment became more noble than that of substrate. 3) With the lapse of time, corrosion current density of Cu-Ni coating layer became stable, but that of substrate was increased. 4) As the corrosion control efficiency of Cu-Ni coating layer in the marine environment was over 90%, its anti-corrosion characteristics was excellent.

• 한국전기전자재료학회논문지
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• 제32권2호
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• pp.134-140
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• 2019

Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• 한국진공학회지
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• 제4권1호
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• pp.67-76
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• 1995

자기저항헤드용 Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn 다층박막에서 자기적 성질과 전기적 성질에 관하여 조사하였다. 저 포화자계에서 고 자기저항을 나타내는 스핀 밸브형 다층박막을 제작하기 위하여 Borond이 도핑된 p-type Si(100)기판위에 Ni-Fe-Co 단층박막과 Si/Ni-Fe-Co/Cu/Ni-FeCo, Si/Ni-Fe-Co/Fe-Mn 구조의 다층막을 제작하여 자기적 특성을 조사하였다. Ni-Fe-Co 단층박막의 자기적 특성은 고정된 아르곤 분압에서 박막의 두께 등에 의존성이 있는 것으로 나타났다. 또한 Si/Ni-Fe-Co($70AA$)/Fe-Mn 구조에서 Ni-Fe-Co와 Fe-Mn 계면에서의 두 자성층의 이방성 차이에 의해서 발생되어지는 교환자기이방성이 존재하였으며, 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값의 의존성을 알아보기 위하여 Ti, Cu를 바닥층으로 사용하였다. Ti을 바닥층으로 사용하였을 경우, 교환자기이방성자계값은 23.5 Oe 정도의 가장 큰 값을 나타내었다. XRD 분석결과, Ti 바닥층이 Cu 바닥층이나, 바닥층이 없는 경우와 비교하여 성막된 Ni-Fe-Co 자성층의 강한 fcc(111) texture를 형성하는 것으로 나타났다. 각각의 단층박막과 다층박막에서의 자기적 특성을 측정한 후, Si/Ti($50\AA$)/Ni-Fe-Co($70\AA$)/Cu($23\AA$)/Ni-Fe-Co($70\AA$)/Fe-Mn(150$\AA$)/Cu(50$\AA$)의 스핀밸브구조를 갖는 다층박막을 제작하였으며, 11 Oe의 낮은 포화자계값에서 4.1%의 고 자기저항값을 얻을 수 있었다.

• Bulletin of the Korean Chemical Society
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• 제22권12호
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• pp.1371-1374
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• 2001

Metal doping was adopted to modify TiO2 (P-25) and enhance the photocatalytic degradation of harmful cyanides in aqueous solution. Ni, Cu, Co, and Ag doped TiO2 were found to be active photocatalysts for UV light induced degradation of aqueous cyanides generating cyanate, nitrate and ammonia as main nitrogen-containing products. The photoactivity of Ni doped TiO2 was greatly affected by the state of Ni, that is, the crystal size and the degree of reduction of Ni. The modification effects of some mixed oxides, that is, Ni-Cu/TiO2 were also studied. The activity of Ni-Cu/TiO2 for any ratio of Cu/Ni was higher than that of Ni- or Cu-doped TiO2, and the catalyst at the Cu/Ni ratio of 0.3 showed the highest activity for cyanide conversion.

• 한국자기학회지
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• 제5권2호
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• pp.109-111
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• 1995

단결정 Cu/ Ni/ Cu 박막의 자기탄성계수(magnetoelastic coupling coefficients)를 자성박막의 두께에 따른 효과이방성에너지(effective anisotropy energy)를 측정하여 현 상학적인 이론 모델로 구하는 방법을 제안하였다. 이러한 간접적인 방법으로 자기탄성 계수를 결정하는 방법은 다른 결정정계에서도 가능하다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권1호
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• pp.11-16
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• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• 한국자기학회지
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• 제6권5호
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• pp.323-328
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• 1996

$4^{\circ}$ 기울어진 Si(111) 웨이퍼를 기판으로 사용해 Cu($50\;{\AA}$) 바닥층 위에 외부 자장의 인가없이 NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) 삼층막을 형성하여 자기이방성과 자기저항 특성을 연구하였다. NiFe($60\;{\AA}$) 층과 Co($30\;{\AA}$) 층을 Cu($50\;{\AA}$) 바닥층 위에 각각 단층막으로 형성할 경우에 면내 일축자기이방성이 유도되었으며, 기판을 기준으로 NiFe 층과 Co 층의 자화용이축은 면내에서 상호 수직임이 관찰되었다. NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) 삼층막을 동일한 기판과 바닥층 위에 형성할 경우, NiFe층과 Co층의 자기이방성은 단층박에서의 자기이방성이 재현되어, 자화용이축이 면내에서 상호 수직으로 놓임이 처음으로 발견되었으며 ~2.2%의 자기 저항비가 측정되었다. 이를 자기이방성이 유도되지 않은, 유리 기판위에 형성한 NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) 삼층막과 비교할 때 ~1.2% 큰 자기저항비를 보이며, 두 자성층의 자화 상태가 반평행을 유지해 자기저항비가 일정하게 유지되는 구간도 현저히 증하가였다. 위의 결과는 적절한 기판의 선택을 통해 삼층막을 이루는 두 자성층 내의 자기이방성 유도와 자화용이축 방향의 조절이 가능함을 나타내며, 이는 헤드 또는 메모리 소자 응용에 매우 유용할 것으로 판단된다.