• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.273-275
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• 2003

본 실험은 고출력 반도체 레이저의 p-side-down 마운팅용 솔더로서 AuSn 합금 솔더(80wt%:20wt%)의 적합성에 대해 연구하였다. $1{\mu}m$이하의 균일도로 폴리싱 된 Cu heat sink의 표면에 두께 $1{\mu}m$의 Ni로 코팅을 한다음, AuSn 다층박막은 e-beam 증착기로 AuSn 합금 솔더는 열증착기로 각각 증착하였다. 열처리는 산화 방지를 위해 $N_2$ 분위기에서 행하였으며, 동일한 압력으로 마운팅을 하였다. 표면의 거칠기와 형상은 AFM(Atomic Force Microscope)과 SEM(Scanning Electron Microscopy)으로 그리고 Au와 Sn의 성분비는 AES(Auger Electron Spectroscopy) 로 비교하였다. 또한 CW(연속발진)을 통한 L-I(Light-Current)측정을 통해 본딩상태를 비교하였다.

• Journal of the Korean Magnetics Society
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• v.11 no.4
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• pp.163-167
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• 2001

The rotation of uniaxial anisotropy field of 700 ${\AA}$ thick sputtered NiFe thin film due to magnetic annealing was investigated. NiFe film was annealed in a magnetic field which is perpendicular to the initial induced uniaxial anisotropy field. The NiFe film becomes nearly isotropic after 1 hour annealing at 160 $^{\circ}C$. With increase of annealing temperature over 160 $^{\circ}C$, the film gets uniaxial anisotropy field again. An abrupt increase of H$\sub$c/ was observed with annealing temperature over 400 $^{\circ}C$. The X-ray diffraction analysis and Auger electron spectroscopy with Ar ion etching showed extensive grain growth in NiFe film with (111) texturing and interdiffusion with adjacent Au electrode layer by 400 $^{\circ}C$ magnetic annealing.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.26.2-26.2
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• 2011

최근 주목 받고 있는 산화아연(ZnO)은 레이저 다이오드, 가스 센서, 자외선 센서, 투명전극 등으로 다양하게 사용될 수 있어 연구개발이 폭 넓게 이루어지고 있는 상황이다. 특히, 3.3 eV의 direct bandgap 에너지를 가지고 있는 ZnO은 현재 자외선센서로 많이 적용되고 있는 물질인 GaN계열을 대체할 수 있는 유망한 물질로 주목 받고 있다. 공기중의 산소나 수분의 표면반응에 의한 자외선 측정을 하는 ZnO을 나노선으로 만들게 되면, 표면대비 부피비가 박막에 비해 급격히 증가하기 때문에 민감도가 커지고 반응시간이 짧아지게 된다. 본 연구에서는 자외선센서의 민감도와 반응성을 향상시키기 위해 전기화학적 합성법을 통해 ZnO의 박막과 나노선을 제조하였다. 사진공정을 통해 3 ${\mu}m$의 간격을 가진 금(Au) 전극을 만든 후, 전기화학적 합성법을 통해 아연이온이 포함된 용액에서 정전류를 흘려보내 아연 또는 ZnO을 증착시킬 수 있었다. 첫 번째로 ZnO을 양쪽 Au 전극에서 동시에 증착하여 두 박막이 접합하였고, 두 번째는 100nm의 지름을 가진 Ni 나노선를 전극 양쪽에서 자석을 통해 자기장을 형성해 정렬시키고 ZnO을 Au 전극과 Ni 나노선에 증착한 후, Ni 나노선를 산화시킴으로써, ZnO 나노구조를 형성하였다. 세 번째로는 Au 전극 양쪽에 아연을 전기화학적 합성을 하여 박막으로 증착하고 고온에서 산화과정을 통해 100 nm 이하의 지름을 가진 ZnO 나노선를 형성하였다. 이렇게 만들어진 세가지 구조의 ZnO의 나노구조와 결정성은 주사전자현미경과 X선 회절 분석기를 통해 측정하였으며, 자외선에 대한 민감도와 반응성은 365 nm의 파장을 가진 자외선발생기와 소스미터장치를 통해 측정하였다. 박막에서 100 nm 이하의 지름을 가진 ZnO 나노선로 갈 수록 자외선에 대한 민감도와 반응성이 향상되었다.

• Journal of the Korean Association of Geographic Information Studies
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• v.13 no.3
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• pp.1-13
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• 2010

The aim of this study is to analyze gold-silver mineral potential in the Taebaeksan mineralized district, Korea using a Geographic Information System(GIS) and an artificial neural network(ANN) model. A spatial database considering Au and Ag deposit, geology, fault structure and geochemical data of As, Cu, Mo, Ni, Pb and Zn was constructed for the study area using the GIS. The 46 Au and Ag mineral deposits were randomly divided into a training set to analyze mineral potential using ANN and a test set to verify mineral potential map. In the ANN model, training sets for areas with mineral deposits and without them were selected randomly from the lower 10% areas of the mineral potential index derived from existing mineral deposits using likelihood ratio. To support the reliability of the Au-Ag mineral potential map, some of rock samples were selected in the upper 5% areas of the mineral potential index without known deposits and analyzed for Au, Ag, As, Cu, Pb and Zn. As the result, No. 4 of sample exhibited more enrichments of all elements than the others.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.171-171
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• 2008

본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.5
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• pp.182-188
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• 2003

We have demonstrated a fluidic technique for self-assembly of microfabricated parts onto substrate using patterned shapes of magnetic force self-assembled monolayers (SAMs). The metal particles and the array were fabricated using the micromachining technique. The metal particles were in a multilayer structure (Au, Ti, and Ni). Sidewalls of patterned Ni dots on the array were covered by thick negative photoresist (SU-8), and the array was magnetized. The array and the particles were mixed in buffer solution, and were arranged by magnetic force interaction. Binding direction of the metal particle onto Ni dots was controlled by multilayer structure and direction of magnetization. A quarter of total Ni dots were covered by the particles. The binding direction of the particles was controllable, and condition of particles was almost even with the Au surface on top. The particles were successfully arranged on the array.

• Bulletin of the Korean Chemical Society
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• v.22 no.9
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• pp.994-998
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• 2001

Ni, Fe and NiFe alloy thin films were electrodeposited at a polycrystalline Au surface using a range of electrolytes and potentials. Coulometry and EQCM were used for real-time monitoring of electroplating efficiency of the Ni and Fe. The plating efficiency of NiFe alloy thin films was computed with the aid of ICP spectrometry. In general, plating efficiency increased to a steady value with deposition time. Plating efficiency of Fe was lower than that of Ni at -0.85 and -1.0 V but the efficiency approached to the similar plateau value to that of Ni at more negative potentials. The films with higher content of Fe showed different stripping behavior from the ones with higher content of Ni. Finally, compositional data and real-time plating efficiency are presented for films electrodeposited using a range of electrolytes and potentials.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.55-62
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• 2023

In this study, Sn-3.0Ag-0.5Cu (wt.%, SAC305) solder dipping process was performed between Ni-foam skeleton with different pore per inch (PPI) to fabricate Ni-foam/SAC305 composite solder, and then applied to the transient liquid phase (TLP) bonding process to evaluate the microstructure and mechanical properties of the bonded joint. The Ni-foam/SAC305 composite solder preform consisted of Ni-foam and SAC305, and an intermetallic compound (IMC) having a (Ni,Cu)₃Sn₄ composition was formed at the Ni-foam interface. During TLP bonding process, the IMC at the Ni-foam interface was converted to (Ni,Cu)₃Sn₄+Au, and as the bonding time increased, the Ni-foam and SAC305 continuously reacted, and the bonded joint was converted into an IMC. And it was confirmed that the 130 PPI Ni-foam/SAC305 composite solder joint was converted into an IMC at the fastest rate. As a result of performing a shear test to confirm the effect of Ni-foam on mechanical properties, solder joints under all conditions exhibited excellent mechanical properties of 50 MPa or more in the early stages of the TLP bonding process, and the shear strength tends to increase as the bonding time increases.

• Journal of the Korean Chemical Society
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• v.23 no.3
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• pp.180-185
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• 1979

Electrochemical reduction behavior from 2-butyne-1, 4-diol (BID) to 2-butene-1,4-diol (BED) by the use of various cathodes, such as Ti, Zr, Ni, Pt, Cu, Ag, Au, Zn, Hg, Pb and graphite has been studied. It has been found that cathodic polarization curve with metal of IB subgroup such as Cu, Ag and Au consisted of one wave in BID-alkaline solution, whereas it was not formed any wave in BED solution. Therefore, it was found that the cathode which was the most suitable in order to proceed in this reaction was Cu, Ag and Au. At cyclic voltammetry using a silver cathode in BID-alkaline solution, the current of the peak was proportional to square root of the sweep rate of potential and also proportional to concentration of BID. Activation energy was calculated for 3.75 kcal/mole from the plot of log $I_l$ vs. 1/T. Consequently, the reduction current of BID with a silver cathode in alkaline solution was found the diffusion current.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.