• 한국재료학회지
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• 제12권3호
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• pp.220-224
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• 2002

The oxide scales formed on $Ni_3Al$-7.8%Cr-1.3%Zr-0.8%Mo-0.025%B after oxidation at 900, 1000 and 110$0^{\circ}C$ in air were studied using XRD, SEM, EPMA and TEM. The oxide scales consisted primarily of $NiO,\; NiAl_2O_4,\;{\alpha}-Al_2O_3,\; monoclinic-ZrO_2,\; and \;tetragonal-ZrO_2$. The outer layer of the oxide scale was rich in Ni-oxides, whereas the internal oxide stringers were rich in Al-oxides and $ZrO_2$. Within the above oxide scales, Cr and Mo tended to exist as dissolved ions.

• 한국세라믹학회지
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• 제38권3호
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• pp.207-211
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• 2001

The effects of the sintering atmosphere and Ni content on t도 densification of TiB$_2$-Ni have been investigated. TiB$_2$powder compacts containing 10, 20, and 30 wt% Ni were liquid-phase sintered at 1500-1$700^{\circ}C$ in vacuum or in flowing Ar. The densification was enhanced as Ni content increased. For a given Ni content, the densification was faster in compacts in compacts with larger grain size. These densification behaviors agree well with the prediction of the recently developed pore-filling theory. For samples containing high Ni contents, 80TiB$_2$-20Ni and 70TiB$_2$-30Ni, the densification was faster in vacuum than in Ar. In particular, 70TiB$_2$-30Ni was fully densified at 1$700^{\circ}C$ for 60min in vacuum. The suppressed densification in Ar was due to the entrapped Ar in the isolated pores. On the other hand, for 90TiB$_2$-10Ni, the Ar-sintering resulted in higher densification than did the vacuum-sintering. This result was attributed to the suppression of Ni volatilization by the Ar in the furnace and a retarded isolation of pores due to the limited amount of liquid in the sample. Therefore, vacuum sintering is recommended for the preparation of TiB$_2$-Ni with a high Ni content while Ar sintering is recommended for the preparation of TiB$_2$-Ni with a low Ni content.

• 열처리공학회지
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• 제7권4호
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• pp.253-261
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• 1994

Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 추계학술발표회 초록집
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• pp.90-90
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• 2006

• 한국재료학회지
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• 제14권8호
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• pp.552-557
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• 2004

Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

• 한국분말재료학회지
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• 제18권5호
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• pp.430-436
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• 2011

Joining of NiO-YSZ to 316 stainless steel was carried out with B-Ni2 brazing alloy (3 wt% Fe, 4.5 wt% Si, 3.2 wt% B, 7 wt% Cr, Ni-balance, m.p. 971-$999^{\circ}C$) to seal the NiO-YSZ anode/316 stainless steel interconnect structure in a SOFC. In the present research, interfacial (chemical) reactions during brazing at the NiO-YSZ/316 stainless steel interconnect were enhanced by the two processing methods, a) addition of an electroless nickel plate to NiO-YSZ as a coating or b) deposition of titanium layer onto NiO-YSZ by magnetron plasma sputtering method, with process variables and procedures optimized during the pre-processing. Brazing was performed in a cold-wall vacuum furnace at $1080^{\circ}C$. Post-brazing interfacial morphologies between NiO-YSZ and 316 stainless steel were examined by SEM and EDS methods. The results indicate that B-Ni2 brazing filler alloy was fused fully during brazing and continuous interfacial layer formation depended on the method of pre-coating NiO-YSZ. The inter-diffusion of elements was promoted by titanium-deposition: the diffusion reaction thickness of the interfacial area was reduced to less than 5 ${\mu}m$ compared to 100 ${\mu}m$ for electroless nickel-deposited NiO-YSZ cermet.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.80-82
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• 2003

• 한국자기학회지
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• 제18권3호
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• pp.85-88
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• 2008

페로브스카이트 구조를 가지는 전이금속 질화물인 $FeCo_3N$과 $NiCo_3N$의 전자구조를 전전자 총퍼텐셜선형보강평면파(all electron FLAPW) 방법에 의해 계산하고, 그 결과를 $Co_4N$의 전자구조와 비교함으로써 꼭지점에 위치한 Co 원자(CoI)를 Fe과 Ni 원자로 대치하였을 때의 영향을 탐구하였다. CoI원자를 각기 Fe와 Ni 원자로 대치한 경우에 면심위치의 CoII 원자의 자기모멘트는 1.458과 $1.494\;{\mu}_B$으로 대치하지 않은 경우와 비교하여 커다란 차이가 없었다. $FeCo_3N$과 $NiCo_3N$에서 꼭지점에 위치한 Fe와 Ni 원자의 자기모멘트는 각기 3.086과 $0.795\;{\mu}_B$로 거의 포화된 값을 가졌으며, 국소적 자성을 나타냈다.

• Corrosion Science and Technology
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• 제3권3호
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• pp.112-117
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• 2004

This work investigated the material properties of Ni-P-B alloy electrodeposits obtained from a Ni sulfamate bath as a function of the contents of the P and B sources($H_3PO_3$ and dimethyl amine borane complex(DMAB), respectively) with/without additives. Chemical composition, residual stress, microstructure and micro hardness were investigated using ICP(inductively coupled plasma) mass spectrometer, flexible strip, XRD, TEM and micro Vickers hardness tester, respectively. From the results of the compositional analysis, it was observed that P and B are incorporated competitively during the electrodeposition and the sulfur from the additive is codeposited into the electrodeposit. The measured residual stress value increased in the order of Ni, Ni-P, Ni-B and Ni-P-B electrodeposits indicating that boron affects the residual tensile stress greater than phosphorus. As the contents of the alloying element sources of P and B increased, crystallinity and the grain size of the electrodeposit decreased. The effect of boron on crystallinity and grain size was also relatively larger than the phosphorus. It can be explained that the boron with a smaller atomic radius contributes to the increase of residual stress in the tensile direction and the larger restraining force against the grain growth more significantly than the phosphorus with a larger atomic radius. Introduction of an additive into the bath retarded crystallization and grain growth, which may be attributed to the change of the grain growth kinetics induced by the additive adsorbed on the substrate and electrodeposit surfaces during electrodeposition.

• 대한화학회지
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• 제23권2호
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• pp.65-74
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• 1979

팔면체$ [Ti(Ⅲ)A_3B_3]$, $ [V(Ⅲ)A_3B_3]$, $ [Fe(Ⅲ)A_3B_3]$ 및 $ [Ni(Ⅱ)A_3B_3]$ 형태 착물의 바닥상태에 대한 리간드 궤도함수의 spin-orbit coupling의 영향을 고찰하여 보았다. 리간드 궤도함수의 spin-orbit coupling이 바닥상태의 파동함수에는 영향을 주지 않았으나 에너지 준위의 분열에는 영향을 주었으며, 그 크기는 Ti(Ⅲ) > V(Ⅲ) > Fe(Ⅲ)의 순서로 감소하였다