• Title/Summary/Keyword: Next-generation displays

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Invited Paper: Oxide Thin Film Transistors for Use as Next Generation Active Matrix Backplanes

  • Kim, Hye-Dong;Park, Jin-Seong;Mo, Yeon-Gon;Kim, Sang-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.35-37
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    • 2009
  • In this work, we introduce new next generation activematrix backplane technologies for large-size AMOLED displays. Among the general requirements for successful market launch of AMOLED TVs, backplane issues are discussed. It will be shown that the amorphous oxide TFT is most suitable due to large scalability and superior cost effectiveness. Development status and current challenges of amorphous oxide TFTs are discussed.

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NEW OPTICALLY TRANSPARENT MATERIALS FOR TRANSPARENT ELECTRONICS AND DISPLAYS

  • Ju, Sang-Hyun;Liu, Jun;Li, Jianfeng;Chen, Po-Chiang;Zhou, Chongwu;Facchetti, Antonio;Janes, David B.;Marks, Tobin J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.973-974
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    • 2008
  • Optically transparent and flexible electronic circuits and displays are attractive for next-generation visual technologies, including windshield displays, head-mounted displays, and transparent screen monitors. Here we report on the fabrication of transparent transistors and circuits based on the combination of nanoscopic dielectrics and organic, inorganic, or hybrid semiconductors. Furthermore, the first demonstration of a transparent and flexible AMOLED display driven solely by $In_2O_3$ nanowire transistors (NWTs) is reported. The display region exhibits an optical transmittance of ~35% and a green peak luminance of ${\sim}300\;cd/m^2$. These results indicate that NWT-based drive circuits are attractive for fully transparent display technologies.

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Preparation and Characterization of transparent electrode based on polymer/metal oxide composite via electrospinning (전기 방사를 이용한 고분자/금속산화물 복합소재 기반의 투명전극 제조 및 특성 분석)

  • Kang, Hye Ju;Jeong, Hyeon Taek
    • Journal of the Korean Applied Science and Technology
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    • v.38 no.6
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    • pp.1553-1560
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    • 2021
  • We have confirmed that optimized transmittance and surface resistance by electrospinning time, also the fabricated transparent electrode composed of silver nanofiber with excellent electrical, optical and mechanical performances is showed applicability to next generation flexible displays such as solar cells, displays, and touch screens. → We have confirmed the optimized transmittance and surface resistance by electrospinning time Also the fabricated transparent electrode composed of silver nanofiber with excellent electrical, optical and mechanical performances showed applicability to next generation flexible displays such as solar cells, displays, and touch screens.

APPLICATION OF IMPEDANCE SPECTROSCOPY TO POLYCRYSTALLINE SI PREPARED BY EXCIMER LASER ANNEALING (임피던스 측정법을 이용한 엑시머 레이져 열처리 Poly-Si의 특성 분석)

  • 황진하;김성문;김은석;류승욱
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.200-200
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    • 2003
  • Polycrystalline Si(polysilicon) TFTs have opened a way for the next generation of display devices, due to their higher mobility of charge carriers relative to a-Si TFTs. The polysilicon W applications extend from the current Liquid Crystal Displays to the next generation Organic Light Emitting Diodes (OLED) displays. In particular, the OLED devices require a stricter control of properties of gate oxide layer, polysilicon layer, and their interface. The polysilicon layer is generally obtained by annealing thin film a-Si layer using techniques such as solid phase crystallization and excimer laser annealing. Typically laser-crystallized Si films have grain sizes of less than 1 micron, and their electrical/dielectric properties are strongly affected by the presence of grain boundaries. Impedance spectroscopy allows the frequency-dependent measurement of impedance and can be applied to inteface-controlled materials, resolving the respective contributions of grain boundaries, interfaces, and/or surface. Impedance spectroscopy was applied to laser-annealed Si thin films, using the electrodes which are designed specially for thin films. In order to understand the effect of grain size on physical properties, the amorphous Si was exposed to different laser energy densities, thereby varying the grain size of the resulting films. The microstructural characterization was carried out to accompany the electrical/dielectric properties obtained using the impedance spectroscopy, The correlation will be made between Si grain size and the corresponding electrical/dielectric properties. The ramifications will be discussed in conjunction with active-matrix thin film transistors for Active Matrix OLED.

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Laser Microfabrications for Next-Generation Flat Panel Display (레이저를 이용한 차세대 평판 디스플레이 공정)

  • Kim, Kwang-Ryul
    • Korean Journal of Materials Research
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    • v.17 no.7
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    • pp.352-357
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    • 2007
  • Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

Cost Reduction of Construction of Bridges for the High-Speed EMU (동력분산형 고속철도의 교량형식에 따른 교량건설비용 저감방안 연구)

  • Lee, Tae-Gyu;Kim, Hye-Uk
    • Proceedings of the KSR Conference
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    • 2008.06a
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    • pp.1195-1200
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    • 2008
  • The railway bridge design specification used in our country at present, is reflected results that take into account link between vehicle and roadbed according to decision of TGV vehicle style in 1994, and executes design verification. Hereafter, the particular loading condition and the design speed of the high-speed EMU that is recognized to the next generation of high speed railway, are plain difference with TGV vehicle style decided in 1994. The effect that these load and design speed get in roadbed, especially superstructure, displays difference with the existent high speed railway. The goal of this study is to choose the suitable bridge type, and to reduce the construction cost for the next generation of railway, i.e., the high-speed EMU.

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A tailor-made process proposal for Interactive space using smart device (스마트 디바이스를 이용한 인터렉티브 공간의 맞춤형 콘텐츠 프로세스 제안)

  • Won, Jong Wook;Oh, Moon Seok
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.9 no.4
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    • pp.155-165
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    • 2013
  • For the service and creation of new space, the next generation smart device for interactive space using tailor-made contents process serve as an opportunity for the growth of new special display due to the integration of the latest digital technology. The application of next generation technology is in the field that most people expect. So, this thesis serving as the beginning, it is hoped that the smart mirror and wall industry in Korea will play a practical and academic momentum. An interactive environment which is the smart device can be realized when space displays based on smart device built on the experience of the user can provide various tailor-made processes such as academics, performances, meetings, virtual experience, exhibits and promotion, and through this a strategic direction was suggested for the development of each field.

Technology Trends of Complex Modulation Spatial Light Modulator (복소변조 공간 광 변조 기술 동향)

  • Nam, J.;Kim, H.E.;Park, M.;Kim, Y.H.;Hwang, C.S.
    • Electronics and Telecommunications Trends
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    • v.37 no.4
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    • pp.81-88
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    • 2022
  • In this study, we investigate the trends and prospects of spatial light modulation (SLM) technology that enables full complex modulation as a next-generation SLM. Current SLM technology, which is used as a key element in holography, augmented reality (AR), XR, and realistic displays, has performance limits that modulate only amplitude or phase. Notably, SLM capable of full complex modulation does not produce diffraction noise, unlike DC and twin image, and thus has a high-efficiency performance. In the future, the application field of next-generation SLM, which can be full-complex modulated, is expected to cover a wide range of holography-AR and-XR devices, optical artificial intelligence, and 6G free space optics communications, which will greatly contribute to the development of a super-realistic metaverse platform and service.

Electroluminescent Characteristics of Organic Thin Film (유기박막의 Electroluminescent(EL) 특성)

  • Moon, Jong-Dae
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.1
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    • pp.88-91
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    • 2008
  • Electroluminescent(EL) devices based on organic thin films are considered to be one of the next generation of flat-panel displays. In this paper, we have investigated electro-luminescent(EL) characteristics of organic EL device using $Alq_3$, PBD as emitting material. Current and luminance can be seen that express a similar relativity in voltage and could know that luminance is expressing current relativity.

Next Generation AMLCD Production Technologies for Large Substrate

  • Ohta, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2001.08a
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    • pp.3-8
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    • 2001
  • This paper will review the state of the latest development of AMLCD manufacturing facilities for large Substrate and discuss the future technologies. The trend of the display size enlargement of Note book PC has hauled the enlargement of the mother glass substrate in past 10 years. The enlargement of a substrate size has brought about the productivity improvement of the TFT panel with process innovation as yet. Will this trend be continuing hereafter too? The issues of the processing and facilities related with the large square substrate and mask step reduction will be overviewed and the future processing and facilities will be discussed.

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