• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2002.05a
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• pp.34-45
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• 2002

The new measuring method of micro-stickies considering both the effects of charge neutralization and evaporation of process water was developed by KRICT PPRC. By the new KRICT method, the contamination of metal dryer surface and other machine clothes could be estimated quickly and simultaneously. According to this study, it could be confirmed that the novel method is a useful one for the evaluation of several treatments regarding the reduction of stickies troubles.

• Journal of the Korean Operations Research and Management Science Society
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• v.8 no.1
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• pp.11-18
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• 1983

This paper shows a new efficient solution method of finding an optimal path for a cruise missile or aircraft to a target which has the maximal survivability and penetration effectiveness against sophisticated defenses and over varied terrain. We first generate a grid structure over the terrain, to construct a network. Since our network usually has about 10,000 nodes, the conventional Dijkstra algorithm takes too much computational time in its searching process for a new permanent node. Our method utilizes the Hashing technique to reduce the computational time of the searching process. Extensive computational results are presented.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.540-543
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• 2006

LTPS TFT backplanes for AM OLED displays have advantages in regard to reliability and performance compared to TFT backplanes based on amorphous silicon. However, the requirements for homogeneous laser crystallization during LTPS process are much higher than for LCD backplanes. Most important is the energy stability of the laser source. In this paper we describe a new excimer laser which meets the requirements of LTPS manufacturing process with high homogeneity.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1451-1454
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• 2006

We propose a new electrical test method bringing repeatable and unambiguous test results eliminating drawbacks of the lighting test for LCD Cell manufacturing process. In this paper, we will show its basic concept, examples of actual test results and effectiveness of the method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.143-145
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• 1996

A new method of fabricating 3-dimensional patterns on single crystal silicon is presented in this paper. The method utlizes both chemical and mechanical reactions to make patterns with dimensions of few microns in width and submicron in height. The primaryadvantage ofthis new method over conventional methods of making patterns on silicon lies in its cost effectiveness and speed. The process introduced in this paper is a maskless process and does not reauire expensive capital investment. It is expected that this method can be employed for flexible and cost effective fabrication of micro-machine components in MEMS application.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2008.10a
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• pp.47-48
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• 2008

New scouring agent which was stable up to 50% NaOH 350g/l has been developed for simultaneous CPB/silket treatment of N/C union fabric. The physical and dyeing properties of N/C union fabric treated with new scouring agent were measured. Fabric scoured and Mercerized by one bath CPB/silket process showed almost the same degree of Mercerization and K/S value with two bath process.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.8
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• pp.52-59
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• 1998

New types of PFD (phase-frequency detector) are proposed with reset time and propagation delay reduced. The perfomrance of our proposed PFDs are confirmed by SPICE simulation with 0.8.mu.m CMOS process parameter. As a result of simulation, the reset time of PFDs are 0.32 nsec and 0.030 nsec in capture-process. The proposed PFDs can be used in hihg-speed phase-licked loop (PLL).

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.222-222
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.

• Journal of Powder Materials
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• v.8 no.3
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• pp.207-209
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• 2001

Nano particles have recently been a major research interest, motivated by their unusual physical and chemical properties. Such particles can be synthesized using physical and chemical methods. The physical methods need expensive installation like vacuum induction furnace, whereas in chemical methods the process in generally very simple and low cost. In this study, simple and new fabrication process by using ultrasound was investigated to prepare the nano-sized metal particles on various powders at room temperature.

• Textile Coloration and Finishing
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• v.13 no.2
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• pp.135-140
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• 2001

Interlace texturing is very useful method to make compound yarns for new synthetic fabrics. In this study, we make the compound ems for peach skin fabric by interlace texturing method. This study surveys relationship between physical properties of interlace textured yarns and process conditions such as air pressure, yarn tension and take-up speed. Nip density, tensile properties and multi-step shrinkage of the various specimens were discussed with process conditions.