• Title/Summary/Keyword: New Process

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Optimizing Spacer Dry Etch Process using New Plasma Etchant (New Plasma Etchant를 사용하여 Spacer dry etch 공정의 최적화)

  • Lee, Doo-Sung;Kim, Sang-Yeon;Nam, Chang-Woo;Ko, Dae-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.83-83
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    • 2009
  • We studied about the effect of newly developed etchant for spacer etch process in gate patterning. With the 110nm CMOS technology, first, we changed the gate pattern size and investigated the variation of spacer etch profile according to the difference in gate length. Second, thickness of spacer nitride was changed and effect of etch ant on difference in nitride thickness was observed. In addition to these, spacer etch power was added as test item for variation of etch profile. We investigated the etch profiles with SEM and TEM analysis was used for plasma damage check. With these results we could check the process margins for gate patterning which could hold best performance and choose the condition for best spacer etch profile.

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A causal ordering algorithm using a new compression method (새로운 압축 방식을 이용한 인과관계 순서화 알고리즘)

  • 권봉경;정광수
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.22 no.6
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    • pp.1127-1136
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    • 1997
  • A vector timestamp is used to satisfy message ordering in a group communications. In this paper, we propose a new vector timestamp compression method which is applicable to a single process group environment where one process belongs to only one precess group. An existing compression method compares the fields of the previously sent vector timestamp with thouse of the currently updated vector timestamp, then sends only the modified fields of the vector timestamp. Unlike the previous one, a proposed compression method performs individual compression for each process using the locally maintained vector timestamp information on other processes. Also, we logicallyproved the causal ordering algorithm using the new compression method and compared the performance of the proposed method with one of the previous compression method by computer simulation. Using the proposed compression method, the message overhead required for causal ordering can be reduced.

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A Proposal of Mentoring Basic Process Model based on DEVS Formalism : Focusing on Mentoring Activities in Undergraduate Class (DEVS 형식론을 이용한 멘토링 기본 프로세스 모델 제안: 학부수업 멘토링 활동을 중심으로)

  • Han, Youngshin
    • Journal of Korea Multimedia Society
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    • v.19 no.12
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    • pp.2024-2035
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    • 2016
  • Modern industry requires people with the ability to create and improve their knowledge. Most educational institutions have used mentoring activities which can train those people. Then each of the institutions has different directions because they work in their own fields. For that reason, many people which want to make new mentoring program have no choice but to go through many trials and errors. This paper deals with the design method of basic process model for mentoring based on DEVS in order that people plan a new mentoring business or make a new mentoring group easily. Our proposed model is expected to be used as a guide to establish procedures for mentoring systems.

Finite element analysis of forging for spring cup of engine valve (엔진 벨브 스프링 컵 단조의 유한요소해석)

  • Lee, In-Hwan;Cho, Hae-Yong;Song, Hong-Ki;Kim, Ji-Hoon;Seo, Bo-Hyuck;Kyoung, Ki-Hyun
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1361-1366
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    • 2007
  • Forging for spring cup of engine valve was investigated in this study. New method is needed to reduce cost and development lead time required to fix forming process of new product, that eventually can provide die, metal flow and forming loads with high confidence level. FEM could provide required detail information that could reduce trial error in advance before the actual production. By using the rigid-plastic finite element simulation, possibilities of improving former research were explored. Results generated by FEM could foresee expected material deformation in advance and made possible new forming process successfully.

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Knowledge Creating Patterns of Technology Catching-up and Pioneering Phase in the New Product Development Process (신제품 개발 과정에서 기술추격과 선도개발 단계의 지식창출 패턴)

  • Seol, Hyun-Do
    • Knowledge Management Research
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    • v.5 no.2
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    • pp.25-51
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    • 2004
  • The purpose of this study is to investigate the knowledge creating pattern of technology catching-up and pioneering phase in the new product development process. This paper first reviews the knowledge conversion, absorptive capability, learning orientation and the trigger of learning. The paper then presents the integrative model of knowledge creating. Based on the integrative model, in-depth case analysis was conducted on the new product development process in Phicom. As a result, the paper discuss that the pattern of absorptive capability building, knowledge conversion and knowledge transfer is different from technology catching-up and pioneering phase. Finally, the implications and limitations of the study are discussed.

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A Study on the Selection of the Administration System for Busan New Port using the Hierarchical Fuzzy Process (계층퍼지분석법을 이용한 부산신항만의 항만관리 방안에 관한 연구)

  • Kim, Sung-Kuk
    • Journal of Navigation and Port Research
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    • v.27 no.5
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    • pp.547-555
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    • 2003
  • A Port Authority system has been regarded as one of the efficient ways of port management. The Korean government is thus now planning to set up such a system into the Busan Port. Busan New Port is located in Kadok Island but divided Busan and Kyongnam administrative district, so complicated in the appropriate selection to Busan New Port Administration. The research method which was used in this study accounted for overlapping between attributes, and introduced the HFP( Hierarchical Fuzzy Process) method that can perform an operation.

Development of Interconnect Process Technology for 5 nm Technology Nodes (5 nm 급 반도체 배선 공정 기술 개발)

  • Choi, Eunmi;Pyo, Sung Gyu
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.25-29
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    • 2016
  • The semiconductor industry has been developed mainly by micronization process due to many advantages of miniaturization of devices. Mass production of semiconductors of 10 nm class has been started recently, and it is expected that the technology generation of 5 nm & 7 nm technology will come. However, excessive linewidth reduction affects physical limits and device reliability. To solve these problems, new process technology development and new concept devices are being studied. In this review, we introduce the next generation technology and introduce the advanced research for the new concept device.

Developing CBR System for Bolt's CAPP (볼트의 자동공정계획수립을 위한 CBR시스템의 개발)

  • Kim, Jin-Baek
    • Asia pacific journal of information systems
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    • v.9 no.2
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    • pp.19-37
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    • 1999
  • Computer aided process planning(CAPP) is a key for implementing CIM. It is bridge between CAD and CAM and translates the design information into manufacturing instructions. Generally, manufacturing is an area where intelligent systems will not be able to rely on methods requiring formalized knowledge. Manufacturing lacks a body of knowledge that is specific, formalized, and rigorous, and which can be coded as rules or procedures. Thus expertise in manufacturing is developed over a period of many years. Case-based reasoning(CBR) offers a new approach for developing intelligent system. In the case-based approach the problem solving experience of the experts is encoded in the form of cases. CBR's retrieval process can be divided to two step. The first step is matching step, and the second step is selection step. For selecting base case, new preference heuristics were introduced using similarity concept. Similarity concept has three has three dimensions, i.e. entity similarity, structural similarity, and goal similarity. In this paper, bolt's process planning was selected an application domain. Following the test result, the new preference heuristics were approved as a useful procedure in CAPP.

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A new Model to Optimize the Process Conditions in Tension Leveling - Part II : Prediction of the Residual Stress Distribution (텐션 레벨링 공정 최적화를 위한 수식 모델 - Part II : 잔류응력 분포 예측)

  • Cho, Y.S.;Hwang, S.M.
    • Transactions of Materials Processing
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    • v.22 no.7
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    • pp.377-382
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    • 2013
  • Tension leveling is the process that removes the shape defects such as edge waves and center buckles, which may be formed in the rolled strip. The main purpose of tension leveling is to eliminate the differences in elongation in order to reduce the residual stresses. In this paper, a new approach for the optimization of the process conditions in tension leveling is presented. This new approach is an analytic model that predicts the residual stresses from the strip curvature. The prediction accuracy of the proposed model is examined through comparison with the predictions from a finite element model.

Research on the formulation and Process of Base Bleed Unit for reducing of Curing Time (항력감소제용 추진제의 경화시간 단축을 위한 조성 및 공정 연구)

  • Choi, Young-Ki
    • Journal of the Korean Society of Propulsion Engineers
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    • v.12 no.4
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    • pp.24-32
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    • 2008
  • We made a new propellant formulation to improve the productivity of Base Bleed Unit(aka BBU) by reducing of the curing time. We made an experiment with new propellant formulation such as binder characteristics and manufacturing process. In addition, we already tested several basic characteristics and the final performance of the new propellant. According to the test report, it was not only satisfied with all requirements in the specification, but it also contributed to improve productivity and reduced 53% of the curing time.