• Current Optics and Photonics
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• v.7 no.6
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• pp.714-720
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• 2023

Laser cleaning has the advantages of environmental protection, precision, and high efficiency, and has good prospects for application in removing oxide films on the surface of aluminum alloy. This paper discusses the cleaning threshold and cleaning mechanism of aluminum alloy surface oxide film. A nanosecond pulsed laser was used to remove a 5-㎛-thick oxide film from the surface of 7A04 aluminum alloy, and the target surface temperature and cleaning depth were simulated. The effects of different laser energy densities on the surface morphology of the aluminum alloy were analyzed, and the plasma motion process was recorded using a high-speed camera. The temperature measurement results of the experiment are close to the simulation results. The results show that the laser cleaning of aluminum alloy oxide film is mainly based on the vaporization mechanism and the shock wave generated by the explosion.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.185-186
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.14-18
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• 2000

No Abstract, See Full Text

• Journal of the Korean Society for Precision Engineering
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• v.29 no.10
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• pp.1089-1095
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• 2012

Laser beam machining (LBM) using nanosecond pulsed laser is widely known to be rapid and non-wear process for micromachining. However, the quality itself cannot meet the precision standard due to the recast layer and heat affected zone. In this paper, a fabrication method for machining micro features in stainless steel using a hybrid process of LBM using nanosecond pulsed laser and electrochemical etching (ECE) is reported. ECE uses non-contacting method for precise surface machining and selectively removes the recast layer and heat affected zone produced by laser beam in an effective way. Compared to the single LBM process, the hybrid process of LBM and ECE enhanced the quality of the micro features.

• Laser Solutions
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• v.4 no.2
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Laser Solutions
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• v.17 no.4
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• pp.7-13
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• 2014

In this work, the application of laser induced breakdown spectroscopy (LIBS) for the composition analysis of thin $Cu(In,Ga)Se_2$ (CIGS) solar cell films ($1-2{\mu}m$ thickness) is reported. For the ablation of CIGS films, femtosecond (fs) laser (wavelength = 343nm, pulse width = 500fs) and nanosecond (ns) laser (wavelength = 266nm, pulse width = 5ns) were used under atmospheric environment. The emission spectra were detected with an intensified charge coupled device (ICCD) spectrometer and multichannel CCD spectrometer for fs-LIBS and ns-LIBS, respectively. The calibration curves for fs-LIBS and ns-LIBS intensity ratios of Ga/Cu, In/Cu, and Ga/In were generated with respect to the concentration ratios measured by inductively coupled plasma optical emission spectrometry (ICP-OES).

• Korean Journal of Materials Research
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• v.33 no.2
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• pp.71-76
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• 2023

The electroconvection generated on the surface of an ion exchange membrane (IEM) is closely related to the electrical/chemical characteristics or topology of the IEM. In particular, when non-conductive regions are mixed on the surface of the IEM, it can have a great influence on the transfer of ions and the formation of nonlinear electroconvective vortices, so more theoretical and experimental studies are necessary. Here, we present a novel method for creating microscale non-conductive patterns on the IEM surface by laser ablation, and successfully visualize microscale vortices on the surface modified IEM. Microscale (~300 ㎛) patterns were fabricated by applying UV nanosecond laser processing to the non-conductive film, and were transferred to the surface of the IEM. In addition, UV nanosecond laser process parameters were investigated for obvious micro-pattern production, and operating conditions were optimized, such as minimizing the heat-affected zone. Through this study, we found that non-conductive patterns on the IEM surface could affect the generation and growth of electroconvective vortices. The experimental results provided in our study are expected to be a good reference for research related to the surface modification of IEMs, and are expected to be helpful for new engineering applications of electroconvective vortices using a non-conductive patterned IEM.