• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.192-192
• /
• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.28 no.1
• /
• pp.14-20
• /
• 2018

Lead zinc niobate (PZN) added lead zirconate titanate (PZT) thick films with thickness of $5{\sim}10{\mu}m$ were fabricated on silicon and sapphire substrates using aerosol deposition method. The contents of PZN were varied from 0 %, 20 % and 40 %. The initial particles (PZT, 2PZN-8PZT, 4PZN-6PZT) had irregular shape and submicron sizes. The as-deposited film had fairly dense microstructure without any crack, and showed only a perovskite single phase formed with nano-sized grains. The as-deposited films on silicon were annealed at the temperatures of $700^{\circ}C$, and the films deposited on sapphire were annealed at $900^{\circ}C$ in the electrical furnace. The effects of PZN addition on the microstructural evolution were observed using by FE-SEM and HR-TEM.

• Journal of the Korean Electrochemical Society
• /
• v.20 no.2
• /
• pp.41-48
• /
• 2017

Herein, we have fabricated an ultrathin aluminum oxide ($Al_2O_3$) coated PP separator by using a RF sputter deposition process. Approximately 20 nm thickness coating layer on the bare PP separator was formed at the power of 55 W for 2 minutes without thermal damage. Whereas only permeability of the coated separator was degraded slightly, other properties such as thermal stability, uptake amount of liquid electrolyte, and ionic conductivity were improved comparing to the bare PP separator. As a result, an only 20-nm-thick $Al_2O_3$ coating layer could improve the rate capability compared with a bare PP separator under a high current density.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1196-1200
• /
• 2004

Micropump is very useful component in micro/nano fluidics and bioMEMS applications. In this study, a bubble-powered micropump was fabricated and tested. The micropump consists of two-parallel micro line heaters, a pair of nozzle-diffuser flow controller and a 1 mm in diameter, 400 ${\mu}m$ in depth pumping chamber. The two-parallel micro line heaters with 20 ${\mu}m-width$ and 200 ${\mu}m-length$ were fabricated to be embedded in the silicon dioxide layer of a wafer which serves as a base plate for the micropump. The pumping chamber, the pair of nozzle-diffuser unit and microchannels including the liquid inlet and outlet port were fabricated by etching through another silicon wafer. A glass wafer (thickness of $525{\pm}15$ ${\mu}m$) having two holes of inlet and outlet ports of liquid serve as upper plate of the pump. Finally the silicon wafer of the base plate, the silicon wafer of pumping chamber and the glass wafer were aligned and bonded (Si-Si bonding and anodic bonding). A sequential photograph of bubble nucleation, growth and collapse was visualized by CCD camera. Clearly liquid flow through the nozzle during the period of bubble growth and slight back flow of liquid at the end of collapsing period can be seen. The mass flow rate was found to be dependent on the duty ratio and the operation frequency. As duty ratio increases, flow rate decreases gradually when the duty ratio exceeds 60%. Also as the operation frequency increases, the flow rate of the micropump decreases slightly.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.41 no.6
• /
• pp.409-414
• /
• 2017

The aim of this study is to understand the phonon transfer characteristics of a silicon thin film transistor. For this purpose, the Joule heating mechanism was considered through the electron-phonon interaction model whose validation has been done. The phonon transport characteristics were investigated in terms of phonon mean free path for the variations in the device power and silicon layer thickness from 41 nm to 177 nm. The results may be used for developing the thermal design strategy for achieving reliability and efficiency of the silicon-on-insulator (SOI) transistor, further, they will increase the understanding of heat conduction in SOI systems, which are very important in the semiconductor industry and the nano-fabrication technology.

• Korean Journal of Materials Research
• /
• v.20 no.11
• /
• pp.611-616
• /
• 2010

A cobalt oxide - tin oxide nanocomposite based gas sensor on an $SiO_2$ substrate was fabricated. Granular thin film of tin oxide was formed by a rheotaxial growth and thermal oxidation method using dc magnetron sputtering of Sn. Nano particles of cobalt oxide were spin-coated on the tin oxide. The cobalt oxide nanoparticles were synthesized by polymer-assisted deposition method, which is a simple cost-effective versatile synthesis method for various metal oxides. The thickness of the film can be controlled over a wide range of thicknesses. The composite structures thus formed were characterized in terms of morphology and gas sensing properties for reduction gas of $H_2$. The composites showed a highest response of 240% at $250^{\circ}C$ upon exposure to 4% $H_2$. This response is higher than those observed in pure $SnO_2$ (90%) and $Co_3O_4$ (70%) thin films. The improved response with the composite structure may be related to the additional formation of electrically active defects at the interfaces. The composite sensor shows a very fast response and good reproducibility.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.56-56
• /
• 2003

BaTiO$_3$, SrTiO$_3$단일막과 BaTiO$_3$ (BTO)/SrTiO$_3$ (STO) 산화물 인공격자를 pulsed laser deposition (PLD) 법에 의해서 100 nm 두께의 (La,Sr)CoO3 (LSCO) 산화물 전극이 코핑된 MgO 단결정 기판 위에 증착시켰다. 이러한 기판위에서 2 unit cell의 적층 두께를 갖는 BTO/STO 초격자 (=BTO2/STO2)를 100～5 nm까지 변화시켰다. 또한 BTO와 STO 단일막도 같은 두께로 변화시켰다. 이러한 두께 범위에서 BTO, STO 단일막과 초격자의 격자변형에 따른 유전특성을 살펴 보았다. 두께 변화에 따른 단일막과 초격자의 구조 분석은 포항 방사광 가속기의 x-ray 회절에 의해서 이루어졌다. 다양한 두께를 갖는 BTO2/STO2 초격자에서 BTO와 STO 충은 in-plane 방향으로 격자정합을 유지하면서 변형되었다. 두께가 얇아지면서 하부 LSCO영향으로 BTO, STO의 n-plane 격자상수는 LSCO 격자상수 쪽으로 접근하였다. Out-of-plane 방향의 BTO 격자상수는 두께가 얇아지면서 증가하였고 반면에 STO 격자상수는 감소하였다. STO와 BTO 단일막의 격자변형은 두께가 얇아지면서 in-plane 방향으로 압축응력으로 인해 증가하였다. 그러나, 격자부정합도가 큰 BTO격자에서 더 많이 변형되었다. 또한 초격자에서 BTO격자가 BTO 단일막보다 더 많이 변형되었는데 초격자에서는 BTO, STO 두 층의 발달된 변형뿐만 아니라 하부 LSCO/MgO 기판의 영향을 함께 받고 있기 때문이다. 초격자와 단일막의 유전상수를 살펴보면은 두께가 감소하면서 유전상수가 감소하는 size effect을 보이고 있다. 하지만 초격자에서의 유전상수가 단일막보다 우수한 유전특성을 보이고 있다. 이러한 결과로 볼 때 격자변형이 size effect 영향을 끼치는 중요한 요소임을 확인하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.27 no.4
• /
• pp.226-231
• /
• 2014

Thin thermistor films of solutions with nickel and manganese oxides were prepared by metal-organic decomposition (MOD). The structural properties of the thin films were investigated as a function of annealing temperature. Field emission scanning electron microscope (FE-SEM) results indicated that the thin films had a thin thickness, smooth and dense surface. The crystallization temperature of $414.9^{\circ}C$ was confirmed from thermogavimetric-differential thermal analysis (TG-DTA) curve. A single phase of cubic spinel structure was obtained for the thin film annealed from $700^{\circ}C$ to $800^{\circ}C$, which was confirmed from the X-ray diffraction (XRD). From the selected area electron diffraction (SAED) in high resolution transmission electron microscope (HRTEM), the nano grains (2~3 nm) of spinel phase with (311) and (222) planes were detected for the thin film annealed at $500^{\circ}C$, which could be applicable to read-out integrated circuit (ROIC) substrate of the uncooled microbolometer with low processing temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.5
• /
• pp.373-379
• /
• 2020

In this study, TiN-coated cBN (cubic-structure boron nitride) powders were successfully synthesized by a sol-gel method using titanium (IV) isopropoxide (TTIP) and by controlling the heat treatment conditions. After the sol-gel process, amorphous nano-sized TiO_x was uniformly coated on the surface of cBN powder particles. The obtained TiO_x-coated cBN powders were heated at 1,000~1,300℃ for 1 or 6 h in a flow of 95%N₂-5%H₂ mixed gas. With increasing temperature, the chemical composition of the TiO_x coating layer changed in the order of TiO₂→Ti₆O₁₁→Ti₄O₇→TiN due to reduction of the Ti ions. The TiN coating layer was observable in the samples heated at 1,200℃ and appeared as the main phase in the sample heated at 1,300℃. The resulting thickness of the TiN coating layer of the sample heated at 1,300℃ was approximately 45~50 nm.

• Journal of computational fluids engineering
• /
• v.17 no.4
• /
• pp.16-23
• /
• 2012

Current display manufacturing processes apply thermal treatment of glass backplanes widely for hydrogen degassing, crystallization of thin-films, tempering, forming, and precompaction. Estimation of the characteristics of transient heating stages and thermal non-uniformities on a single glass substrate or in a stack of glasses are extremely helpful to understand non-homogeneity of mechanical and electronic features of nano/micro structures of end products. Based on simple heat transfer models and using an electric muffle furnace, temperature variations in a glass stack were predicted and measured for glass backplanes of $1.5{\times}1.85m^2$ in size and 0.7 mm in thickness. Except for the period of putting glass backplanes into the furnace, thermal radiation was the major heating mechanism for the treatment and theoretical predictions agreed well to the experimental temperatures on the backplanes. Using the theoretical model, thermal fields for a glass stack of glass-size, $2.2{\times}2.5m^2$, and of the number of sheets, 1 to 12, were calculated for practical design and manufacturing of the muffle furnace for large-scale displays, e.g. up to $8^{th}$ generation.