• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.10a
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• pp.428-430
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• 2009

C-axis-oriented ZnO thin films were successfully deposited on p-Si (100) in an RF magnetron sputtering system. Deposition conditions such as deposition power, working pressure, and oxygen gas ratio were varied. Crystalline structures of the deposited ZnO films were investigated by a scanning electron microscope (SEM) technique. Results show that the deposition parameters can have a strong impact on the preferred orientations and grain sizes of the deposited ZnO films.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.931-937
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• 2012

The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.

• Journal of the Korean GEO-environmental Society
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• v.15 no.2
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• pp.17-25
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• 2014

In the present study, it were performed an unconfined compression test and a field applicability test according to a mixed ratio of SS, soil type and curing period to analyze strength and deformation characteristic in order to evaluate engineering characteristics of soil mixed pavements using the eco-friendly soil stabilizer (SS). The test results revealed that SS mixed soil shows fast strength development at the initial curing time while 28-day strength amounted for 97% of the final strength. Furthermore, coarse-grained dredged sand (DS) and weathered granitic soil (WGS) have a larger ratio of deformation coefficient with respect to unconfined compressive strength than fine-grained dredged clay (DC) and organic soil (OS). Moreover, a comparison test between natural and forced drying conditions was conducted and test result showed 54% to 67% of strength degradation while having 55% to 63% of strength degradation in the freezing and thawing test result. Finally, a repeated loading test result showed that DS experiences up to 35% of strength reduction compared to initial strength under 10,000 times loading in maximum. Thus, it was validated that an appropriate amount of fine-grained sand is necessary to secure resistance capability to repeated loading.

• Journal of Hydrogen and New Energy
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• v.21 no.5
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• pp.375-382
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• 2010

A layered perovskite photocatalysts, $SrBi_2Nb_2O_9$ (SBN), was synthesized by the conventional solid-state reaction method and characterized by X-ray diffraction (XRD) and UV-visble spectrophotometry. The results showed that the structure of $SrBi_2Nb_2O_9$ is orthorhombic. Diffuse reflectance spectra for calcined and attrition-milled SBN showed the main absorption edges were less 400 nm, that is ultraviolet region. SBN under micron-sized powder was deposited on the $Al_2O_3$ by room temperature powder spray in vacuum process, so called aerosol deposition (AD), and nano-grained $SrBi_2Nb_2O_9$ photocatalytic thick film was fabricated. AD-deposited SBN thick films were characterized by XRD, scanning electron microscopy (SEM) and UV-visable spectrophotometry, Moreover, it was found that several nano-sized SBN film by AD process can improve the photocatalytic activity under visable reflectance.

• Journal of Powder Materials
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• v.10 no.6
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.137-143
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• 2006

The effects of Cu and Fe additions on the thermal stability, microstructure and mechanical properties of $Al_{85}-Ni_{8.5}-Mm_{6.5},\;Al_{84}-Ni_{8.5}-Mm_{6.5}Cu_1,\;Al_{84}-Ni_{8.5}-M_{m6.5}Fe_1$ alloys, manufactured by gas atomization, degassing and hot-extrusion were investigated. Gas atomization, with a wide super-cooled liquid region, allowed the alloy powders to exhibit varying microstructure depending primarily on the powder size and composition. Al hotextruded alloys consisted of homogeneously-distributed fine-grained fcc-Al matrix and intermetallic compounds. A substitution of 1 at.% Al by Cu increased the thermal stability of the amorphous phase and produced alloy microstructure with smaller fcc-Al grains. On the other hand, the same substitution of 1 at.% Al by Fe decreased the stability of the amorphous phase and produced larger fcc-Al grains. The formation of intermetallic compounds such as $Al_3Ni,\;Al_{11}Ce_3\;and\;Al_{11}La_3$ was suppressed by the addition of Cu or Fe. Among the three alloys examined, the highest Vickers hardness and compressive strength were obtained for $Al_{84}-Ni_{8.5}-M_{m6.5}Cu_1$ alloy, and related to the finest fcc-Al grain size attained from increased thermal stability with Cu addition.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.63-68
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• 2005

The nano-grained Pd or Pt-doped $SnO_{2}$ thin films were deposited on the alumina substrate at ambient temperature or $300^{\circ}C$ by using an R.F. magnetron sputtering system and then annealed at $650^{\cir}C$ for 1 hour or 4 hours in air. The crystallinity and microstructure of the annealed films were analyzed. A grain size of the thin films was 30 nm to 50 nm. As a result of gas sensitivity measurements to an alcohol vapor of $36^{\circ}C$, the 2 wt.% Pt-doped $SnO_{2}$ thin-film sensor deposited at $300^{\circ}C$ and annealed at $650^{\circ}C$ for 4 hours showed the highest sensitivity.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.4
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• pp.83-91
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• 2008

The development of the equal channel angular pressing(ECAP) process in metals has recently provided a feasible solution to produce ultra-fine or nano-grained bulk materials with tailored material properties. However, ECAP process is difficult to scale up commercially due to requirements of an excessive load. In this paper, a new Hybrid-ECAP process with torsional die is considered to obtain materials of ultra-fine grain structure under low forming load. An upper bound analysis and numerical simulation (DEFORM 3D, a commercial FEM code) are carried out on the torsional die. By the upper bound analysis, analytical expression for the compression force and rotation speed are obtained. By the FEM analysis, the distribution of strain, stress and deformation are obtained. These results show that the Hybrid-ECAP is a useful process because this process can obtain the homogeneous deformations with relatively low forming load. Additionally, due to decreased forming load, die life can be improve.

• The KIPS Transactions:PartD
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• v.12D no.6 s.102
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• pp.921-930
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• 2005

In this paper, a general purpose molecular simulation system which has been developed by the author, are described. One of the most advantageous features is that the molecular simulation system can handle a coarse-grained model as well as an all-atom mode. Therefore, we can simulate mesoscopic phenomena as well as microscopic phenomena with the help of Langevin dynamics simulation and dissipative particle dynamics simulation techniques. Thus we could study anesthesia, protein folding, biopolymer flow in microchannel with single framework, which spans from microscopic to mesoscopic scales. We expect that we can also simulate many other bio/nano systems of technological importance which are not feasible by means of molecular dynamics simulation technique. Finally, performance data are shown and a bottleneck is identified for future optimization.

• Korean Journal of Materials Research
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• v.20 no.7
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• pp.374-378
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• 2010

$MgTiO_3$ thin films were prepared by r.f. magnetron sputtering in order to prepare miniaturized NPO type MLCCs. $MgTiO_3$ films showed a polycrystalline structure of ilmenite characterized by the appearance of (110) and (202) peaks. The intensity of the peaks decreased with an increase in the chamber pressure due to the decrease of crystallinity which resulted from the decrease of kinetic energy of the sputtered atoms. The films annealed at $600^{\circ}C$ for 60min. showed a fine grained microstructure without micro-cracks. The grain size and roughness of the $MgTiO_3$ films decreased with the increase of chamber pressure. The average surface roughness was 1.425~0.313 nm for $MgTiO_3$ films prepared at 10~70 mTorr. $MgTiO_3$ films showed a dielectric constant of 17~19.7 and a dissipation factor of 2.1~4.9% at 1MHz. The dielectric constant of the films is similar to that of bulk ceramics. The dielectric constant and the dissipation factor decreased with the increase of the chamber pressure due to the decrease of grain size and crystallinity. The leakage current density was $10^{-5}\sim10^{-7}A/cm^2$ at 200kV/cm and this value decreased with the increase of the chamber pressure. The small grain size and smooth surface microstructure of the films deposited at high chamber pressure resulted in a low leakage current density. $MgTiO_3$ films showed a near zero temperature coefficient and satisfied the specifications for NPO type materials. The dielectric properties of the $MgTiO_3$ thin films prepared by sputtering suggest the feasibility of their application for MLCCs.