• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.308-317
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• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Korean Chemical Engineering Research
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• v.62 no.3
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• pp.262-268
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• 2024

In this study, the MXene/Si composite was prepared by electrostacic assembly with 2-dimensional structured titanium carbide (MXene) and nano silicon for anode material of high-performance lithium-ion battery. Ti₃C₂T_x MXene was synthesized by etching the Ti₃AlC₂ MAX with LiF/HCl, and the surface of nano silicon was charged to positively using CTAB (Cetyltrimethylammonium bromide). The MXene/Si anode composite was successfully manufactured by simple mixing process of synthesized MXene and charged silicon. The physical and electrochemical properties of prepared composite were investigated with MXene-silicon composition ratio, and the surface of electrode after cycles was analyzed to evaluate stability of the electrode. The MXene/Si composites demonstrated high initial discharge capacities of 1962.9, 2395.2 and 2504.3 mAh/g as the silicon composition ratio increased to 2, 3 and 4 compared to MXene, respectively. MXene/Si-4, which is MXene and silicon ratio with 1 : 4, exhibited 1387.5 mAh/g of reversible capacity, 74.5% of capacity retention at 100 cycles and high capacity of 700.5 mAh/g at high rate of 4.0 C. As the results, the MXene/Si composite prepared by electrostatic-assenbly could be applied to anode materials for high-performance LIBs.

• Proceedings of the Korean Vacuum Society Conference
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• 2007.02a
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• pp.128-128
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• 2007

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.10
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• pp.3853-3858
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• 2010

This paper shows electrical analysis of the silicon solar cell according to the various ARC thickness using Medici program. we built a mesh structure of the solar cell that use ARC consisting of ITO(Indium-Tin-Oxide) transparent electrode, for the Medici modeling. About various oxide layer thickness of the ARC for 30 nm, 60 nm, 90 nm, changes of the I-V curve, Isc, Voc, transmittance and external collection efficiency performed according to wavelength of Incident ray. Simulation results show maximum power 22 mW/$cm^2$, fill factor 0.83 in condition of 60 nm ITO thickness.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.63-63
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• 2003

The nanotopography of silicon wafers has emerged as an important factor in the STI process since it affects the post-CMP thickness deviation (OTD) of dielectric films. Ceria slurry with surfactant is widely applied to STI-CMP as it offers high oxide-to-nitride removal selectivity. Aiming to control the nanotopography impact through ceria slurry characteristics, we examhed the effect of surfactant concentration and abrasive size on the nanotopography impact. The ceria slurries for this study were produced with cerium carbonate as the starting material. Four kinds of slurry with different size of abrasives were prepared through a mechanical treatment The averaged abrasive size for each slurry varied from 70 nm to 290 nm. An anionic organic surfactant was added with the concentration from 0 to 0.8 wt %. We prepared commercial 8 inch silicon wafers. Oxide Shu were deposited using the plasma-enhanced tetra-ethyl-ortho-silicate (PETEOS) method, The films on wafers were polished on a Strasbaugh 6EC. Film thickness before and after CMP was measured with a spectroscopic ellipsometer, ES4G (SOPRA). The nanotopogrphy height of the wafer was measured with an optical interferometer, NanoMapper (ADE Phase Shift)

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.440-443
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• 2010

We report a top-down approach based on atomic force microscopy (AFM) local anodic oxidation for the fabrication of the nano-pattern field effect transistors (FETs). AFM anodic oxidation is relatively a simple process in atmosphere at room temperature but it still can result in patterns with a high spatial resolution, and compatibility with conventional silicon CMOS process. In this work, we study nano-pattern FETs for various cross-bar distance value D, from ${\sim}0.5\;{\mu}m$ to $1\;{\mu}m$. We compare the optical characteristics of the patterned FETs and of the reference FETs based on both 2-dimensional simulation and experimental results for the wavelength from 100 nm to 900 nm. The simulated the drain current of the nano-patterned FETs shows significantly higher value incident the reference FETs from ${\sim}1.7\;{\times}\;10^{-6}A$ to ${\sim}2.3\;{\times}\;10^{-6}A$ in the infrared range. The fabricated surface texturing of photo-transistors may be applied for high-efficiency photovoltaic devices.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.93-99
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• 2010

A nano-stereolithography is the direct patterning process with a nanoscale resolution using twophoton absorption induced by a femtosecond laser. However, in the majority of the works, the fabrication of 3D microstructures have been done only onto transparent glass due to the use of an oil immersion objective lens for achieving a high resolution. In this work, the coaxial illumination and the auto-focusing system are proposed for the direct patterning of nano-precision patterns on an opaque substrate such as a silicon wafer and a metal substrate. Through this work, 3D polymer structures and metallic patterns are fabricated on a silicon wafer using the developed process.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1971-1973
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• 2005

We fabricated an alumina membrane with nano-sized pore array by anodic oxidation using the thin film aluminum deposited on silicon wafer. It is important that the sample prepared by metal deposition method has a flat aluminum surface and a good adhesion between the silicon wafer and the thin film aluminum. The oxidation time was controlled by observation of current variation. The nano-sized pores with diameter of $60{\sim}120nm$ was obtained by $40{\sim}80$ voltage. The pore widening process was employed for obtaining the flat surface because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of rough surface. Finally, the sample was immersed to the phosphoric acid with 0.1M concentration to etching the barrier layer. The sample will be applied to electronic sensors, field emission display, and template for nano- structure.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.591-597
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• 2012

This paper presents regularly micro-textured glass surfaces ensuring the superhydrophobic properties in the Cassie-Baxter regime. The proposed surfaces were fabricated simply and efficiently by filling the glass material into a silicon micro-mold with periodic micro-cavities based on a thermal-reflow process, resulting in a successful demonstration of the textured glass surface with periodically-arrayed micro-pillar structures. The static and dynamic wetting properties of the micro-textured glass surfaces were characterized by measuring the static contact angle (SCA) and contact angle hysteresis (CAH), respectively. In addition, the surface wettability was estimated theoretically based on Wenzel and Cassie-Baxter wetting theories, and compared with the experimental ones. Through the experimental and theoretical observations, it was clearly confirmed that the proposed micro-textured glass surfaces showed the slippery superhydrophobic behaviors in the Cassie-Baxter wetting mode.