• Journal of the Korean Vacuum Society
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• v.21 no.1
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• pp.48-54
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• 2012

Carbon coils could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and $H_2$ as source gases and SF6 as an additive gas under thermal chemical vapor deposition system. The geometries of as-grown carbon materials were investigated with increasing the reaction temperature as the increment of $25^{\circ}C$ from $650^{\circ}C$ up to $800^{\circ}C$. At $650^{\circ}C$, the embryos for carbon coils were formed. With increasing the reaction temperature to $700^{\circ}C$, the coil-type geometries were developed. Further increasing the reaction temperature to $775^{\circ}C$, the development of wave-like nano-sized coils, instead of nano-sized coils, and occasional appearance of micro-sized carbon coils could be observed. Fluorine in $SF_6$ additive may shrink the micro-sized coil diameter via the reduction of Ni catalyst size by fluorine's etching role. Finally, the preparation of the micro-sized carbon coils having the smaller coil diameters, compared with the previously reported ones, could be possible using $SF_6$ additive.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Journal of the Korean Vacuum Society
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• v.21 no.3
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• pp.178-184
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• 2012

Carbon coils could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and $H_2$ as source gases and $SF_6$ as an additive gas under thermal chemical vapor deposition system. The characteristics (formation density and morphology) of as-grown carbon coils were investigated as functions of additive gas flow rate and the cycling on/off modulation of $C_2H_2/SF_6$ flows. Even in the lowest $SF_6$ flow rate (5 sccm) in this work, the cycling on/off modulation injection of $SF_6$ flow for 2 minutes could give rise to the formation of nanosized carbon coils, whereas the continuous injection of $SF_6$ flow for 5 minutes could not give rise to the carbon coils formation. With increasing $SF_6$ flow rates from 5 to 30 sccm, the cycling on/off modulation injection of $SF_6$ flow confines the geometry for the carbon coils to the nanosized ones. Fluorine's role of $SF_6$ during the reaction was regarded as the main cause for the confinement of carbon coils geometries to the nano-sized ones.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.1
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• pp.37-42
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• 2021

The effect of chemical composition on the structural and thermal properties of TiZrN thin films was studied. As the Zr fraction in the deposited TixZr1-xN (x = 0.87, 0.82, 0.7, 0.6, and 0.28) increased, microstructural changes consisted of reduction in the grain size and a gradual transition from columnar structure to granular structure were observed. In addition, it was also confirmed that a gradual crystal phase transition from TiN to TiZrN has occurred as the Zr fraction increased up to 0.4. After heat treatment at 900℃, Ti0.82Zr0.18N and Ti0.7Zr0.3N layers were converted to a form in which rutile phase TiO2 and TiZrO4 oxides coexist, while Ti0.6Zr0.4N layer was converted to TiZrO4 oxide. Among the five compositions of TiZrN films, the Ti0.6Zr0.4N showed the best high temperature stability and produced a significant enhancement in the thermal oxidation resistance of Inconel 617 through suppressing the surface diffusion of Cr caused by thermal oxidation of the Inconel 617 substrate.