• Applied Chemistry for Engineering
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• v.22 no.1
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• pp.98-103
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• 2011

We prepared a counter electrode by electroplating Ni as underlayer and Pt as plating layer on the FTO glass to increase the efficiency of dye-sensitized solar cell (DSSC). We found an excellent adhesion between Ni underlayer and FTO glass when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min on FTO glass. We observed Ni and Pt metal diffraction peaks by XRD analysis when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min, and Pt layer was electroplated at $5mA/cm^2$ for 1 min on the Ni underlayer. Photovoltaic performance and impedance analysis of DSSCs fabricated with this counter electrode shows the highest efficiency of 5.6% and the lowest resistance of 75 ohm.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.33-41
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• 2011

Due to the recent quantum leaps forward in bio-, nano-, and information-technologies (BT, NT and IT), the precisionization and miniaturization of mechanical and electrical components are in high demand. In particular, the ITrelated equipments that take a great part in our domestic industry are in the area requiring high precision technologies. As a consequence, the researches on the development vibration isolation systems that diminish external disturbance or internal vibration are highly required. Among the components comprising the vibration isolation system, air spring has become on a focal point for the researchers due to its merits. This air spring is able to support heavy loads, keep a low natural frequency despite of having a lower value of stiffness, and control the performance of vibration isolation. However, sometimes the sole use of air spring is in demand due to some economic reasons. Under this circumstance, the damping effect of sole air spring may not enough to reduce sufficient amount of vibration. In this study, the air spring mount system connecting with an external chamber is proposed to increase or control the damping effect. To investigate its damping mechanism, the thermal and dynamic behaviors of the system is examined through a theoretical modeling approach in this part of research. In this approach, thermomechanical and Helmholtz resonator type models are to be employed for the air spring/external chambers and connecting tube system, respectively. The frequency response functions (FRFs) derived from the modeling effort are evaluated with physical parametric values and the effects of connecting tube length on these FRFs are identified through computer simulations.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.10
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• pp.962-974
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• 2010

Recently, the convergence of information technology with bio-technology, nano-technology or other technologies has been creating a new paradigm. In a field of transportation, the intelligent transport systems which is a convergence of intelligent technologies and transportation systems have been studied. The Variable Speed Limit(VSL), is one of ITS technologies, is thought to improve safety and efficiency of transportation while controlling speed limit based on road conditions. Legacy studies have considered only one station for VSL algorithm. However, it is not appropriate for an urban freeway installed with many stations. In this paper, new algorithm is proposed to not only enhance effectiveness of VSL based on cooperation of stations but also reflect road conditions within 30 seconds. The proposed algorithm consists of 4 steps: the first is a "searching bottleneck station" step, the second is a "calculating a size of congestion" step, the third is a "calculating the number of controlled stations" step, the final is a "calculating VSL" step. This algorithm guarantees improved safety and minimum additional travel time. The travel time should be considered because drivers would against the VSL algorithm when the proposed algorithm occurs additional travel time. In our experiments, microscopic traffic simulator VISSIM is selected to perform a modeling work. The results show that proposed algorithm provides the improved safety and minimum increase of travel time.