• Title/Summary/Keyword: Nano Step Test

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Study on Two Step Plasma Treatment for Electroless Cu Plating of Fluoropolymer (불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구)

  • Shin, Seung-Han;Han, Sung-Ho;Kim, Young-Seok
    • Journal of the Korean institute of surface engineering
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    • v.38 no.3
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    • pp.118-125
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    • 2005
  • Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.

Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer (구리 질화막을 이용한 구리 접합 구조의 접합강도 연구)

  • Seo, Hankyeol;Park, Haesung;Kim, Gahui;Park, Young-Bae;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.55-60
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    • 2020
  • The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

Adhesion of Plasma Spray Coated Hydroxyapatite Film on the Two-Step Anodized Dental Implant

  • Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.126-126
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    • 2012
  • In this study, adhesion of plasma spray coated hydroxyapatite film on the two-step anodized dental implant was investigated. The plasma spray was carried out on the dental implant after two step anodization. The adhesion of coated HA film was investigated by FE-SEM after fatigue test. In the case of two-step anodized implant showed a good adhesion between implant and coated film.

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The Development of Medical Device for Strengthening the Intervertebral Disc (추간판 강화용 의료기 개발)

  • Ryu, Suchak;Kim, Seunghyeon;Jo, Sungkwang;Shim, Keonoh
    • Journal of the Korean Society for Heat Treatment
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    • v.35 no.1
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    • pp.20-26
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    • 2022
  • This paper was designed to prevent intervertebral disc escape and treatment. we produced downsized lumbar traction bed at home and automated system depending on weight and muscle mass by using 3D print and Arduino to confirm the possibility of prototyping. Hence, we checked muscle mass 10 males in their 20s with different exercise conditions, and it shows that average muscle mass of group who exercised was 56.63kg, and non-exercise group was 50.8 kg. this is shows lumbar repetitive exercise can show the traction therapy effect can be seen traction therapy effect. In addition, we installed wooden doll substitute people with spring and test changing of length. Traction bed has the steps ranging from 1 to 4, in which the motor with torque and rpm, ranging from 4.7 to 5.5 kgf and from 4.5 to 5.3 rpm, respectively. The motor controlled with the voltage of Arduino was operated for the length of the spine to be stretched to 4-5 mm. As increasing the weight of the wooden doll by 10g, it was confirmed that the spring increased by 4-5 mm from the first step to the fourth step.

Influence of modeling agents on the surface properties of an esthetic nano-hybrid composite

  • Kutuk, Zeynep Bilge;Erden, Ecem;Aksahin, Damla Lara;Durak, Zeynep Elif;Dulda, Alp Can
    • Restorative Dentistry and Endodontics
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    • v.45 no.2
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    • pp.13.1-13.10
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    • 2020
  • Objective: The aim of this study was to evaluate the influence of different modeling agents on the surface microhardness (Vickers hardness number; VHN), roughness (Ra), and color change (ΔE) of a nano-hybrid composite with or without exposure to discoloration by coffee. Materials and Methods: Sixty-four cylinder-shaped nano-hybrid composite specimens were prepared using a Teflon mold. The specimens' surfaces were prepared according to the following groups: group 1, no modeling agent; group 2, Modeling Liquid; group 3, a universal adhesive (G-Premio Bond); and group 4, the first step of a 2-step self-adhesive system (OptiBond XTR). Specimens were randomly allocated into 2 groups (n = 8) according to the storage medium (distilled water or coffee). VHN, Ra, and ΔE were measured at 24 hours, 1 week, and 6 weeks. The Kruskal-Wallis test followed by the Bonferroni correction for pairwise comparisons was used for statistical analysis (α = 0.05). Results: Storage time did not influence the VHN of the nano-hybrid composite in any group (p > 0.05). OptiBond XTR Primer application affected the VHN negatively in all investigated storage medium and time conditions (p < 0.05). Modeling Liquid application yielded improved Ra values for the specimens stored in coffee at each time point (p < 0.05). Modeling Liquid application was associated with the lowest ΔE values in all investigated storage medium and time conditions (p < 0.05). Conclusion: Different types of modeling agents could affect the surface properties and discoloration of nano-hybrid composites.

Array-based Nano-amplification Technique Was Applied in Detection of Hepatitis E Virus

  • Liu, Hui-Hui;Cao, Xuan;Yang, Yong;Liu, Ming-Gui;Wang, Ye-Fu
    • BMB Reports
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    • v.39 no.3
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    • pp.247-252
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    • 2006
  • A rapid method for the detection of Hepatitis E Virus (HEV) was developed by utilizing nano-gold labeled oligonucleotide probes, silver stain enhancement and the microarray technique. The 5'-end -$NH_2$ modified oligonucleotide probes were immobilized on the surface of the chip base as the capture probe. The detection probe was made of the 3'-end -SH modified oligonucleotide probe and nano-gold colloid. The optimal concentrations of these two probes were determined. To test the detection sensitivity and specificity of this technique, a conservative fragment of the virus RNA was amplified by the RT-PCR/PCR one step amplification. The cDNA was hybridized with the capture probes and the detection probes on microarray. The detection signal was amplified by silver stain enhancement and could be identified by naked eyes. 100 fM of amplicon could be detected out on the microarray. As the results, preparation of nano-gold was improved and faster. Development time also was shortened to 2 min. Thus, considering high efficiency, low cost, good specificity and high sensitivity, this technique is alternative for the detection of HEV.

Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface (Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석)

  • Choi, Seonghun;Kim, Gahui;Seo, Hankyeol;Kim, Sarah Eunkyung;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.29-37
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    • 2021
  • The effect of Ar/N2 two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N2 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N2 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m2 and 2.33±0.67 J/m2, respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

Development of Semiconductor Packaging Technology using Dicing Die Attach Film

  • Keunhoi, Kim;Kyoung Min, Kim;Tae Hyun, Kim;Yeeun, Na
    • Journal of Sensor Science and Technology
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    • v.31 no.6
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    • pp.361-365
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    • 2022
  • Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

Study of nano patterning rheology in hot embossing process (핫엠보싱 공정에서의 미세 패턴 성형에 관한 연구)

  • Kim, H.;Kim, K.S.;Kim, H.Y.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10a
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    • pp.371-376
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    • 2003
  • The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process, simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during Compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

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Improvement of charging efficiency of AGM lead acid battery through formation pattern research (Formation pattern 연구를 통한 AGM 연축전지의 충전 효율 향상)

  • Kim, Sung Joon;Son, Jeong Hun;Kim, Bong-Gu;Jung, Yeon Gil
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.31 no.1
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    • pp.55-62
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    • 2021
  • In order to improve fuel economy and reduce CO2, HEV adopts ISG system as a standard. This ISG system increased the electric load that the battery had to bear, and the number of starting increased rapidly. AGM Lead Acid batteries have been developed and used, but the charging time is about three times longer as the electrolyte amount control during formation must be maintained at a higher level compared to conventional lead-acid batteries. In this study, we tried to shorten the charging time by increasing the charging efficiency through the optimization of the formation pattern. In order to optimize the Formation Pattern, 10 charging steps and 6 discharging steps were applied to 16 multi steps, and the charging current for each step was controlled, and the test was conducted under 4 conditions (21 hr, 24 hr, 27 hr, 30 hr). As a result of simultaneous application of multi-step and discharge step, it was verified that minimizing the current loss and eliminating the sudden polarization during charging contributes to the improvement of charging efficiency. As a result, it showed excellent results in reducing the charging time by about 30 % with improved charging efficiency compared to the previous one.