• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.560-562
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• 2009

In this paper, we proposed a simple method of decreasing the off current generated by degradation for improve the electrical characteristics such as mobility and on/off current ratio by making the line patterns on the pentacene surface between the electrodes using atomic force microscope (AFM) lithography.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.24-25
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• 2007

Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by "partial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

• Journal of Adhesion and Interface
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• v.6 no.1
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• pp.7-10
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• 2005

Condensation control of nano-particles has become important in order to fabricate minute condensed structures. In this study, we focus our attention on condensation mechanism of polymer aggregates in a resist film. The polymer aggregate is structural component of a resist material which is used in lithography process. The condensation nature of polymer aggregates in the resist film surface is observed by using atomic force microscope (AFM). By using the AFM, the condensation of polymer aggregates can be observed clearly. The condensation of polymer aggregate strongly affects to precise fabrication of resist pattern below 100nm size. The interaction force among polymer aggregates can be analyzed based on Derjaguin approximation. We also discuss about condensation nature of polymer aggregates in the resist film surface with the help of micro sphere model.

• 한국연소학회:학술대회논문집
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• 2014.11a
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• pp.95-96
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• 2014

In this study, the nano-particle emitted from Gasoline Direct Injection(GDI) vehicles was measured using the Engine Exhaust Particle Sizer(EEPS) on a chassis dynamometer. In addition, driving mode were divided into cold start mode(CVS-75, NEDC) and hot start mode(NIER-6, NIER-9) to evaluated the characteristics in the various operating conditions. The Particle Number(PN) concentration was analyzed for various driving patterns, i.e., acceleration, deceleration, idling, cruising and the phases of mode. In a result, Total concentration of PN for size was concentrated from 50 to 100 nm and acceleration represents the highest concentration among the driving pattern. It is believed that the increases quantity of fuel, and mixture will be richer than other patterns.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1518-1521
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries This paper focus to apply the sputtering technology accumulated by experiments to 3d structure fabrication with high resolution. Therefore some verifications and discussions of the characteristics of FIB sputtering results according to focal length were described in this paper. And we suggested the definition of rectangular pattern profile and made the verifications of sputtering results based on definition of it.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.426-426
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• 2007

We report the field emission characteristics of transparent single-walled carbon nanotube (SWNT) film printed using an inkjet. Pure SWNTs dispersed in dimethylformamide were printed in a transparent layer on indium-tin oxide-coated glass and annealed at $350^{\circ}C$. After taping treatment, SWNTs were oriented vertically on the substrate. The front and the back of the fabricated device produced simultaneous emissions of identical quality. In addition, inkjet printing directly achieved a patterned emission, without a secondary pattern process. This method allows simple fabrication using only SWNTs, without the use of other additives.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.13-17
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• 2006

Dense and periodic arrays of holes and tungsten none dots were fabricated on silicon oxide and silicon. The holes were approximately 25 nm wide, 40 nm deep, and 60 nm apart. To obtain nano-size patterns, self-assembling resists were used to produce layer of hexagonally ordered parallel cylinders of polymethylmethacrylate(PMMA) in polystyrene(PS) matrix. The PMMA cylinders were degraded and removed with acetic acid rinse to produce a PS mask for pattern transfer. The silicon oxide was removed by fluorine-based reactive ion etching(RIE). Selectively deposited tungsten nano dots were formed inside nano-sized trench by using a low pressure chemical vapor deposition(LPCVD) method. Tungsten nano dot and trenched silicon sizes were 26 nm and 30 nm, respectively.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.224-227
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• 2009

Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.210-217
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• 2003

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation was studied with numerical method by ABAQUS S/W. Polymer (PMMA) and brittle materials (Si, Pyrex glass) were used as specimens, and forming conditions to reduce the elastic restoration and pile-up was proposed. The indenter was modeled a rigid surface. Minimum mesh sizes of specimens are 1-l0mm. The result of the investigation will be applied to the fabrication of the hyper-fine pattern and mold.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.333-336
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• 2002

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation was studied with numberical method by ABAQUS S/W. Polymer (PMMA) and brittle materials (Si, Pyrex glass) were used as specimens, and forming conditions to reduce the elastic restoration and bur was proposed. The indenter was modeled a rigid surface. Minimum mesh sizes of specimens are 1-l0nm. The result of the investigation will be applied to the fabrication of the hyper-fine pattern and mold.