• 정보저장시스템학회논문집
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• 제3권3호
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• pp.118-122
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• 2007

Phase-change wet-etching technology using GeSbTe phase-change films is developed. Selective etching between an amorphous and a crystalline phase can be carried out with an alkaline etchant of NaOH. Etching selectivity is dependent not only on the concentration of the alkaline etchant but also on the film structure. Specifically, metal films for heat control cause marked effects on the etching properties of GeSbTe film. Surviving amorphous pits can be obtained with Al metal layer, however etched amorphous pits are seen with Ag metal layer. An opposite selective etching behavior can be observed between samples with two different metal layers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.485-486
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• 2011

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.644-647
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• 2001

Amorphous As-Ge-Se-S thin films have been studied with the aim of identifying optimum etching condition which can be used to produce holographic grating structure for use as diffractive optical elements. In this study, holographic gratings have been formed using He-Ne laser(632.8nm), and fabricated by the method of wet etching using NaOH etchant with various concentration(0.26N, 0.33N, 0.40N). The diffraction efficiency was obtained by +1st order intensity of the diffracted beam. The formed grating profiles were observed by atomic force microscope and showed that the expected grating profile could be achieved by controlling the etching time. Over-etching resulted in under-cutting of the grating lines. The highest 1st order diffraction efficiency for these gratings was about 5.05%.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.180-182
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• 2009

Two different wet etching solutions, NaOH 40% and Acid, were used for etching in tri-crystalline Silicon(Tri-Si) solar cell fabrication. The wafers etched in NaOH40% solution showed higher reflectance compared to the wafers etched in Acid solution after $SiN_x$ deposition. In light current-voltage results, the cells etched in Acid solution exhibited higher short circuit current and open circuit voltage than those of the cells etched in NaOH 40% solution. We have obtained 16.70% conversion efficiency in large area($156cm^2$) Tri-Si solar cells etched in Acid solution.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 추계학술발표대회 논문집
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• pp.383-387
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• 2009

Multi-crystalline silicon surface etching without grain-boundary delineation is a challenging task for the fabrication of high efficiency solar cell. The use of sodium hydroxide - sodium hypochlorite (NaOH40% + NaOCl 12%) solution for texturing multi-crystalline silicon wafer surface in solar cell fabrication line is reported in this article. in light current-voltage results, the cells etched in NaOH 40% + NaOCl 12% = 1:2 exhibited higher short circuit current and open circuit voltage than those of the cells etched in NaOH 40% + NaOCl 12% = 1:1 solution. we have obtained 15.19% conversion efficiency in large area(156cm2) multi-Si solar cells etched in NaOH 40% + NaOCl 12% = 1:1 solution.

• 한국표면공학회지
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• 제30권1호
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• pp.44-56
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• 1997

Influence of electrochemical etching conditions on capacitance gain of aluminium electrolytic on capacitor foil has been investigated by etching cubic textured high purity aluminum foil in dilute hydrochloric acid. Uniformly distributed etch pit tunnels on aluminum surface have been obtained by pretreatment aluminium foil in 10% NaOH solution for 5 minutes followed by electrochemical etching. Electrostatic capacitance of etched aluminium foil anodized to high voltage increased with the increase of current density, total charge, temperature and concentration of electrolyte up to maximum CV-value and then deceased. Election optical observation of the etched foil revealed that the density of etch of etch pits increased with the increase of current density and concentration of electrolyte. this increase of etch pit density enlarged of the increase of capacitance. However, abnormal high current density and high electrolyte concentration induced the local dissolution of the foil surface which resulted the decrease of foil capacitance.

• 한국의학물리학회지:의학물리
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• 제2권2호
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• pp.129-139
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• 1991

중성자 선원에 의한 되튕긴 양성자의 궤적을 PN-3 검출기를 이용하여 화학적 부식방식으로 검출하는 방법에 대해 논의해 보았다. 또한 PN-3 의 부식 및 검출특성을 부식된 궤적지름과 여러 변수들로 표시하여 보았다. 본 연구를 통해 고체 비적 검출기에 검출된 입자를 분석하기 위해 입자의 전하, 에너지, 질량과 궤적 부식 비율 결정 및 궤적 구조 형성 과정 사이의 관계식에 대한 자세한 정보를 얻을 수 있었다. 또한 하전입자를 보다 정확하게 검출하기 위해 입자의 종류 및 에너지에 대한 부식 조건을 변화시키면서 이에 대응하는 최적의 부식조건을 경험적으로 찾아내었다. 아울러 기대되는 기술 저변 확대 효과로는 고분자플라스틱 검출기를 이용한 저준위 중성자 측정기술의 축적 및 개발을 통해 원자력발전소, 비파괴검사기관 및 의료기관 동 방사선 동위원소 취급기관의 중성자 선량측정계로의 유용한 응용 가능성이 예상된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.88-91
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• 2005

본 논문에서는 비정질 As-Ge-Se-S 박막의 에칭 레이트를 측정하였으며 As-Ge-Se-S 박막에 회절격자를 형성 시킨 후 선택적 에칭을 통한 엠보싱 홀로그램을 제작하였다. NaOH 수용액으로 0.26N, 0.33N, 0.40N 농도로 변화시키며 수행하였으며 에칭 시간에 따른 에칭되는 두께의 변화를 측정하였다. 에칭 레이트는 NaOH 용액의 농도가 0.26N, 0.33N, 0.40N 일 때 각각 $2.5{\AA}/s$, $3.3{\AA}/s$, $3.9{\AA}/s$ 였다. 또한 2차원 엠보싱 회절격자를 형성 시킨후 0.26N NaOH용액으로 60초간 선택적 에칭을 수행하여 AFM(Atomic Force Microscopy) 으로 측정한 결과 선명한 엠보싱 형태의 회절격자를 확인 할 수 있었다.

• 청정기술
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• 제9권2호
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• pp.57-61
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• 2003

금속가공 공정에서 알루미늄 합금소재의 알칼리 에칭 후 표면에 발생한 스머트(Smut) 를 제거하기 위해 무질산 디스머트(Nitric acid-free desmut) 용액을 개발하였다. 과산화수소(2%), 불산(0.5%) 및 황산(10%)을 혼합한 산용액이 NaOH 수용액에 처리한 A16061 및 A15052 규격의 알루미늄 합금 소재에 대한 스머트 제거효과가 5% 질산수용액의 사용할 경우와 유사하게 관찰되었다. 스머트 제거를 위한 혼합 산용액 처리 전 후 소재 표면을 SEM-EPMA 분석을 통해 확인하였다.