• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.4
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• pp.63-69
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• 1999

The electrical properties of rf-magnetron sputtered $Ba_{0.5}Sr_{0.3}TiO_3$ (BST) capacitors were investigated by varying annealing temperature and atmosphere of the rapid thermal annealing (RTA). The electrical properties of Pt/BST/Pt capacitors were found to strongly depend on the RTA condition. It seems that the dependence of the electrical properties of the Pt/BST/Pt capacitors on the RTA condition is related to the oxygen vacancies in BST thin films. In order to clarify the relation between the oxygen vacancies and the electrical properties of Pt/BST/Pt capacitors, we have examined the two different annealing methods. One annealing method was performed in $O_2$ gas and the other was done in $O_2$-plasma at the same condition of 450$^{\circ}C$, 20 mtorr. It was found that the leakage current densities of $O_2$-plasma annealed capacitor were much lower than those of $O_2$ annealed capacitor. The dielectric constants of $O_2$ annealed capacitor decreased about 14% comparing with those of as-deposited. In contrast, there was no decrease in the dielectric constant of $O_2$-plasma annealed. These results indicate that $O_2$-plasma annealing is very effective in compensation the oxygen vacancies in BST thin films. It can be also concluded that the oxygen vacancies greatly affect the electrical properties of Pt/BST/Pt capacitors.

• Progress in Superconductivity and Cryogenics
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• v.7 no.3
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• pp.9-12
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• 2005

[ $Y_1Ba_2Cu_3O_{7-8}$ ] (YBCO) coated conductor has been fabricated by batch-type process using oxide-precursor-based metal-organic deposition (MOD) method. The batch-type process can be scaled up more simply to Produce long-length YBCO conductor than the reel-to-reel process. Also, it has less handling problems and is adequate to the ambient gas environment. In this work, YBCO oride powder was used as a starting precursor for MOD method. After reel-to-reel dip coating process, me ter-long-buffered metal tape was wound around a cylinder and underwent calcination and annealing processes. Annealed YBCO films showed good c-axis alignment and dense surface morphology with no cracks, but exhibited very low critical current density of $10^5\;A/cm^2$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.12
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• pp.31-38
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• 1991

The current-voltage characteristics at annealed Be-Cu alloy(1.8-2 wt% Be, 0.2 wt% Co+Ni) interfaces have been studied by means of the cyclic voltammetric method. The specimens were annealed in nitrogen gas($N_{2}$) furnace at 36$0^{\circ}C$ for 1.5 hours. After annealing, the vickers hardness(HV) was increased from 210 to 385. The used solutions were distilled water(H$_{2}$O), 10$^{-3}M\;CsNO_{2},10^{-2}M\;KCl,10^{-2}M\;KOH,10^{-4}M\;H_{2}SO_{4}$ aqueous electrolytes, and ethylalcohol ($C_{2}H_{5}OH$), etc. The cyclic voltammograms showed significant current-voltage characteristics between the annealed and unannealed specimens at the same conditions. The age hardening and the related surface potential barrer and dissolution effects have been observed during the whole experimental process. The dissolution process of annealed Be-Cu alloys was effectively retarded by the age hardening phenomenon. The age hardening effect also raised the surface potential barrier of Be-Cu alloys. The interfacial phenomena of Be-Cu alloys seem to be one of good models for understanding the activation process.

• Fire Science and Engineering
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• v.16 no.1
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• pp.77-83
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• 2002

The objective of this study is to propose a method to prevent the possible stress corrosion cracking of a horizontal side-wall sprinkler head deflector in the same atmosphere of ammonia gas as it regulated in the UL (Underwriters Laboratory). A corrosion test is carried out for three types of specimen according to post-forming treatment, one of which is annealing, another sand blasting and the other no treatment. The observation of the test specimens with a metal micro-scope says that the tensile residual stress is a major factor causing corrosion cracking, and that a proper heat treatment can remove or reduce the residial stress and prevent a crack from occurring even in a severe corrosive atmosphers.

• Journal of the Korean Ceramic Society
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• v.29 no.9
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• pp.689-694
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• 1992

Strontium Titanate single crystal is grown by Verneuil method. Feed materials were prepared by coprecipitation method which started with Sr(NO3)2 and TiCl4. SrTiO3 can not be grown from feed materials having the stoichiometric components due to volatilization of SrO, when the powder added more 3 wt% SrO used, the crystal can be grown. Growth conditions that the pressure of oxygen and hydrogen gas was 5 psi, the flow rate of oxygen and hydrogen was 7.3 and 30ι/min respectively, the growth rate was 20 mm/hr were optimum. The grown single crystal has the diameter of 10~15 mm and its length is 30~40 mm. The grown crystal was deep brown color and somewhat transparent. The color of grown crystal was lightened after annealing.

• Journal of Powder Materials
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• v.17 no.6
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• pp.477-481
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• 2010

Cu-Sn based alloys were manufactured by gas atomization spray casting route in order to achieve a fine scale microstructure and a high tensile strength. The spray cast Cu-10Sn-2Ni-0.2Si alloy had an equiaxed grain microstructure, with no formation of brittle ${\delta}-Cu_{41}Sn_{11}$ phase. Aging treatment promoted the precipitation of finely distributed particles corresponding to ${\delta}-Ni_2Si$ intermetallic phase throughout the $\alpha$-(CuSn) matrix. The cold-rolled Cu-Sn-Ni-Si alloy had a very high tensile strength of 1200 MPa and an elongation of 5%. Subsequent aging treatment at $450^{\circ}C$ for 1h slightly reduced the tensile strength to 700 MPa and remarkably increased the elongation up to 30%. This result has been explained by coarsening the precipitates due to over aging and reducing the dislocation density due to annealing effects.

• Applied Chemistry for Engineering
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• v.10 no.5
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• pp.644-651
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• 1999

In this experiment the Iron phthalocyanine (FePc) films on Si-wafer and alumina pallet were prepared using vacuum sublimation with conditions of changing reaction time, temperature, and deposition rate. Then, some samples were annealed following annealing. Techniques such as XRD, SEM, and resistance measurement method, were dedicated to characterize the changes of surface structure, phase transformation and electric resistance sensitivity in accordance with change of film thickness. In proportion to the decrease of deposition temperature from $370^{\circ}C$ to $350^{\circ}C$, intensities of (200), (011), (211) and (114) planes of $\alpha$-phase were decreased and (100) plane of $\beta$-phase were appeared. The film thickness were controlled by regulating the volume of precursor material during rapid deposition. As a result, it was observed that crystalline particle size had been increased according to the increase of film thickness and $\alpha$-phase transformed to $\beta$-phase. In consequence of measuring the crystallinity of films annealed between $150^{\circ}C$ and $350^{\circ}C$, $\alpha$- to $\beta$-phase transformation was appeared to begin at $150^{\circ}C$ and completely transformed to $\beta$-phase at $350^{\circ}C$. Electric resistance sensitivity of FePc film to $NO_x$ gas along temperature change of FePc films was observed to be more stable with the decrease of the film thickness.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.782-785
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• 1995

In this paper, $Mn^{2+}$ ion was doped in Y-Ba-Cu-O as an EPR probe. The following samples were prepared by conventional solid-state reaction method : $YBa_{2}Cu_{2.96}Mn_{0.04}O_{7-\delta}$ (MN-I), annealed $YBa_{2}Cu_{2.96}Mn_{0.04}O_{7-\delta}$ (AMN) and $YBa_{2}Cu_{2.94}Mn_{0.06}O_{7-\delta}$ (MN-II). AMN sample was obtained from MN-I by annealing for 1 hr under the Ar gas atmosphere at $600^{\circ}C$. X-band (~9.05 GHz) EPR spectra were measured from 103 K to room temperature by employing a JES-RE3X spectroscopy with a $TE_{0.11}$ cylindrical cavity and 100 kHz modulation frequency. In MN-I we have observed only the $Cu^{2+}$ signal. The fact that no $Mn^{2+}$ signal was observed, in spite of $Mn^{2+}$ being a very sensitive EPR probe, indicates that most likely isolated $Mn^{2+}$ ions don't exist in the MN-I sample. Most probably $Mn^{2+}$ ions in the MN-I sample interact antiferromagnetically and hence are EPR silent. The AMN spectra of at room temperature and 103 K indicate not only the $Cu^{2+}$ signal but also an extra signal, which increases with decreasing temperature. It is suggested that the extra signal originates from Mn ions that were antiferromagnetically coupled before the annealing process. In MN-II, from 103 K to room temperature, also, the extra signal was observed together with the $Cu^{2+}$ signal. The extra signal in MN-II, however, decreases with decreasing temperature and nearly disappears at 103 K. The signal originates from Mn ions in impurity phases that include $Mn^{2+}$ ions. We suppose that there exist at least two $Mn^{2+}$ doped phases in Y-Ba-Cu-O. The $Mn^{2+}$ signal of one phase is undectable at all temperature and that of another phase decreases with decreasing temperature and disappears around 103 K.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.6
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• pp.297-303
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• 2003

Mn-Ni-Co type thin films were prepared at various conditions by a rf magnetron sputtering system. At the condition. or substrate temperature of $300^{\circ}C$ and $Ar/O_2$= 10/0, a cubic spinel phase was obtained. When oxygen was included in process gas, a cubic spinel phase was not formed even after the thermal annealing at $900^{\circ}C$. The thermistor thin film had no other elements except Mn, Ni and Co. The infrared reflection spectra of the thermistor thin films showed that the films had somewhat high reflectance for incoming infrared ray with some angle. The etch rate of the thermistor thin films was about 63nm/min at a condition of DI water : $HNO_3$: HCl = 60 : 30 : 10 vol%. The B constant and temperature coefficient of resistance of the thermistor thin films were 3500 K and -3.95 %/K, respectively. The voltage responsivity of the thermistor thin film infrared sensor was 108.5 V/W and its noise equivalent power and specific detectivity were $5.1\times 10^{-7}$ W/$Hz^{-1/2}$ and $0.2\times 10^6$cm $Hz^{1/2}$/W, respectively.