• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.24.2-24.2
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• 2010

고분자 몰드를 이용한 nanoimprint lithography (NIL)는 고분자소재의 유연성과 투명성으로 인하여, 유기전자소자나 유연한 디스플레이소자 등 다양한 응용이 가능하다. 하지만, 고분자소재는 일반적으로 열저항성과 내구성이 낮아서, 고분자 몰드를 이용한 패턴형성 시, 자외선 경화방식이 주로 사용된다. 만약 복제가 쉽고, 가격이 저렴하며, 열저항성과 내구성이 강한 고분자 몰드를 제작한다면, thermoplastic-NIL 기술에 적용할 수가 있기 때문에, 고온을 요구하는 소자의 패턴형성 공정에 사용 가능하다. 본 연구에서는 이러한 고분자 몰드 제작을 위하여, 열저항성과 내구성이 강한 polyimide 필름과 polyurethane acrylate (PUA)를 기반으로 제작된 resin을 이용하였다. 먼저 Polyimide 필름 위에 자외선 노광을 사용하여, PUA resin 을 경화시킴으로써 패턴을 형성하였다. 이렇게 만들어진 몰드를 thermoplastic-NIL기술에 적용함으로써, Si 기판 위에 sub-마이크로 급 패턴을 형성하였다. 또한, 제작된 고분자 몰드를 사용하여 반복적인 NIL 공정을 수행함으로써 몰드의 내구성을 확인하였으며, 곡면 기판 위에 NIL을 함으로써 몰드의 유연성을 확인 할 수 있었다.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1168-1170
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• 2005

Nanoimprint Lithography(NIL) has increasingly been recognized as a key manufacturing technology for nanosized feature. One of the most important task for nanoimprint lithography is to provide the imprinting stamp with low price. The Stamp fabricated with Si based material by e-beam lithography, RIE is extremely expensive and its throughput is very limited and PDMS replica is too soft to hold high imprinting pressure.(>5atm) In this study, we present the imprinting stamp which can be easily replicated from original mold and is based on PVC film. Replication of original Si mold to PVC film was done by Hot embossing technique, ($120^{\circ}C$ of Temperature, 20 atm applied) As small as 100nm patterns were successfully transferred into PVC film. The size of stamp was up to 100mm in diameter.

• Tribology and Lubricants
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• v.22 no.5
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• pp.243-251
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• 2006

Molecular dynamics simulations of nanoimprint lithography NIL) are performed in order to investigate effects of process parameters, such as stamp shape, imprinting temperature and adhesive energy, on nanoimprint lithography process and pattern transfer. The simulation model consists of an amorphous $SiO_{2}$ stamp with line pattern, an amorphous poly-(methylmethacrylate) (PMMA) film and an Si substrate under periodic boundary condition in horizontal direction to represent a real NIL process imprinting long line patterns. The pattern transfer behavior and its related phenomena are investigated by analyzing polymer deformation characteristics, stress distribution and imprinting force. In addition, their dependency on the process parameters are also discussed by varying stamp pattern shapes, adhesive energy between stamp and polymer film, and imprinting temperature. Simulation results indicate that triangular pattern has advantages of low imprinting force, small elastic recovery after separation, and low pattern failure. Adhesive energy between surface is found to be critical to successful pattern transfer without pattern failure. Finally, high imprinting temperature above glass transition temperature reduces the imprinting force.

• Journal of the Semiconductor & Display Technology
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• v.11 no.4
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• pp.37-42
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• 2012

Nanoimprint lithography (NIL) has attracted broad interest as a low cost method to define nanometer scale patterns in recent years. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, the performance of the cooling system of thermal NIL is numerically investigated by SolidWorks Flow Simulation program. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the effects of the change of flow velocity and cooler location on the cooling performance are investigated. For the 6 cases (0.1 m/s, 0.5 m/s, 1 m/s, 3 m/s, 5 m/s, 10 m/s) of flow velocity and for the 6 cases of distances (50 mm, 40 mm, 30 mm, 20 mm, 10 mm, 1 mm) of cooler location, the heat conjugated flow analyses are performed and discussed.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1069-1072
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• 2003

Ultraviolet-nanoimprint lithography (UV-NIL) is a promising nanoimprint method for cost-effectively defining nanometer scale structures at room temperature and low pressure. Nanostamp fabrication technology is a key technology for UV-NIL because fabricating a high resolution nanostamp is the first step for defining high resolution nanostructures in a substrate. We used quartz as an UV transparent stamp material for the UVNIL. A $5{\times}5{\times}0.09$ inch stamp was fabricated using the quartz etch process in which Cr film was used as a hard mask for transferring nanostructures into the quartz. In this paper, we describe the quartz etching process and discuss the results including SEM images.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1119-1122
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• 2004

In the UV-NIL process using an elementwise patterned stamp (EPS), which includes channels formed to separate each element with patterns, low-viscosity resin droplets with a nano-liter volume are dispensed on all elements of the EPS. Following pressing of the EPS, the EPS is illuminated with UV light to cure the resin; and then the EPS is separated from several thin patterned elements on a wafer. Experiments on UV-NIL were performed on an EVG620-NIL. 50 － 70 nm features of the EPS were successfully transferred to 4 in. wafers. Especially, the wafer deformation during imprint was analyzed using the finite element method (FEM) in order to study the effect of the wafer deformation on the UV-NIL using EPS.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Tribology and Lubricants
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• v.21 no.4
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• pp.177-184
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• 2005

The molecular dynamics simulation of nanoimprint lithography (NIL) using $SiO_2$ stamp and amorphous poly-(methylmethacrylate) (PNMA) film is performed to study pattern transfer in NIL. Force fields including bond, angle, torsion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and $SiO_2$ stamp. Nose-Hoover thermostat is used to control the system temperature and cell multipole method is adopted to treat long range interactions. The deformation of PMMA film is observed during pattern transfer in the NIL process. For the detail analysis of deformation characteristics, the distributions of density and stress in PMHA film are calculated. The adhesion and friction forces are obtained by dividing the PMMA film into subregions and calculating the interacting force between subregion and stamp. Their effects on the pattern transfer are also discussed as varying the indentation depth and speed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.473-478
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• 2012

In this paper, the air bubble formation mechanism in the rectangular and triangular line-and-space pattern during dispensing UV Nanoimprint Lithography (UV-NIL) at an atmospheric condition is studied. To investigate the air bubble formation, an analytic model based on geometric approach and a numerical model based on CFD(computational fluid dynamics) were used in the analysis. It was found in the numerical analysis that every time the flow front passed through a corner of the pattern, it proceeded with a newly formed shape, occurring due to interface reconfiguration, since the flow fronts were formed such that they minimized the surface energy. Moreover, the conditions for the air bubble formation were investigated by applying the analytic analysis based on geometric approach and the numerical analysis. Good overall agreement was found between the analytic and numerical analysis.