• Journal of Magnetics
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• v.4 no.4
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• pp.128-130
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• 1999

We have measured the magnetization of Ni/Ag(Ni at %)/Ni (50$\AA$/30 $\AA$/50 $\AA$) trilayered films including Ni atoms inserted in non-magnetic Ag spacer. The magnetization as a function of applied field at 5 K and as a function of temperature at 100 Oe were investigated respectively using SQUID magnetometer. In these measurements peaks of magnetization at some critical temperatures were observed in all the samples. The antiferromagnetic coupling energy between neighboring Ni layers showed oscillatory behaviors according to the amounts of the Ni atoms inserted in Ag spacer. Loose spin model suggested by slonczews야 was used to explain such results.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.13-13
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• 2007

Ni-Fe 합금을 전주성형하여 Ni용출 특성을 연구하였다. 피팅현상은 Ni용출을 가속화시키나 전주성형된 Ni-Fe 합금의 나노구조는 피팅현상을 줄임으로써 Ni용출량을 줄이는 역할을 함을 알 수 있었다. Ni 용출시험은 인공땀 용액에서 수행하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.6
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• pp.269-275
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• 2005

Ni/Ni-aluminide/Ti/Ti-aluminide laminate composite, considered as a functionally gradient material, was manufactured by thin foil hot press technique. Thick intermetallic layers of NiAl and $TiAl_3$ were formed by a self-propagating high-temperature synthesis (SHS) reaction, and thin continuous taters of $Ni_3Al$ and TiAl were formed by a solid-state diffusion. Fracture resistance with loading along the crack arrester direction is higher than crack divider direction due to the interruption of crack growth in metal layers. The $Ni_3Al$ and NiAl intermetallic layer showed cleavage and intergranular fracture behavior, respectively, while the fracture mode of $TiAl_3$ layer was found to be an intragranular cleavage. The debonding between metal and intermetallic layer and the pores were observed in the Ni/Ni-aluminide layers, resulting in the lower fracture resistance. With the results of acoustic emission (AE) source characterization the real time of failure and the effect of AE to crack growth could be monitored.

• Analytical Science and Technology
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• v.10 no.4
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• pp.246-255
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• 1997

A series of Ni(II) complexes with multidentate N, O-Schiff base ligands: ie [bis-(salicylaldehyde) ethylenediamine(SED), bis-(salicylaldehyde) propylenediamine(SPD), bis-(salicylaldehyde) dietrylenetriamine(SDT), and bis-(salicylaldehyde) triethylenetetraamine(STT)] and Ni(II) complexes were synthesized. The Ni(II) complexes were characterized by elemental analysis, IR, UV-Vis and mass spectrometry. The stability constants of each nickel (II) complexes were determined by potentiometry in 70% dioxane-30% $H_2O$ and ethanol. The stability constants of Nickel(II) complexs increased in the order of Ni(II)-SPD

• Journal of the Korean Magnetics Society
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• v.12 no.4
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• pp.132-136
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• 2002

Enhancement of crystallinity and exchange bias characteristics for NiFe/FeMn/NiFe trilayer with Si buffer layer fabricated by ion-beam deposition were examined. A Si buffer layer promoted (111) texture of fcc crystallities in the initial growth region of NiFe layer deposited on it. FeMn layers deposited on Si/NiFe bilayer exhibited excellent (111) crystal texture. The antiferromagnetic FeMn layer between top and bottom NiFe films with the buffer Si 50 ${\AA}$-thick induced a large exchange coupling field Hex with a different dependence. It was found that H$\sub$ex/ of the bottom and top NiFe films with Si buffer layer revealed large value of about 110 Oe and 300 Oe, respectively. In the comparison of two Ta and Si buffer layers, the NiFe/FeMn/NiFe trilayer with Si could possess larger exchange coupling field and higher crystallinity.

• Journal of the Korean institute of surface engineering
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• v.50 no.1
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• pp.29-34
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• 2017

Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of $Ni^{2+}$ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface morphology and microstructure of Ni films were studied. In the case of $0.2M\;Ni^{2+}$ concentration, current efficiency was decreased to about 65 % with increasing saccharin concentration, but, in the case of $0.7M\;Ni^{2+}$ concentration, it was shown more than 90 % with the increase of saccharin concentration. Residual stress of Ni thin film was appeared to be about 400 MPa up to 0.0244 M saccharin concentration at the $0.2M\;Ni^{2+}$ concentration and surface morphology with severe cracks was observed in the range of 0.0487~0.0975 M saccharin concentration. Residual stress of Ni thin films was measured to be about 750 MPa without saccharin addition and 114~148 MPa at the range of 0.0097~0.0975 M saccharin concentration for the $0.7M\;Ni^{2+}$ concentration. Relatively low residual stress values (114~148 MPa) of the Ni films at the range of 0.0097~0.0975 M saccharin concentration may be resulted from codeposition of S from saccharin. Ni films at $0.7M\;Ni^{2+}$ concentration showed smooth surface morphology and were independent of saccharin concentration. Ni films at $0.7M\;Ni^{2+}$ concentration consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks and the intensities of FCC(111) and FCC(200) peaks increased with increasing saccharin concentration. Also, the average grain size decreased with increasing saccharin concentration from about 30 nm to about 15 nm.

• Proceedings of the Korean Magnestics Society Conference
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• 1998.10a
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• pp.22-23
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• 1998

• Proceedings of the Korean Magnestics Society Conference
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• 1998.10a
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• pp.20-21
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• 1998

• Journal of Korean Society of Forest Science
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• v.99 no.3
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• pp.292-297
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• 2010

This study was carried out to provide preliminary data to purify contaminated sites by nickel (Ni). After rooted cuttings of Salix reichardtii had been grown in Ni solution (hydroponic culture), pH changes in the solution and the accumulated Ni amount in plant parts were measured and analyzed. When the Ni concentration was low enough for S. reichardtii cuttings to grow well, the pH value of the solution decreased considerably. As the Ni concentration got higher, the plant growth got poorer and the pH value decreased slowly. Roots accumulated the highest Ni amount. Leaves and stems followed after. When stems were older, the accumulated Ni amount was lower. more Ni was accumulated in the plant parts which had more flexible tissue and live cells. As the Ni concentration in solution got higher up to 50.0 ${\mu}mol$/L, so did the Ni accumulation in the plant parts. However, the plant individuals nearly died and the Ni accumulation tended to drop when the Ni concentration in solution was 100.0 ${\mu}mol$/L. The rooted cuttings of S. reichardtii grew poorer as the Ni concentration in solution got higher. The plants in solution with 100.0 ${\mu}mol$/L of Ni were practically dead in four weeks.

• Journal of the Korean Ceramic Society
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• v.43 no.7 s.290
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• pp.402-407
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• 2006

NiO/YSZ(70 wt%NiO) composite powders were prepared by ball-milling of 8YSZ and NiO precursors, dried and then followed by calcination. The approach was to combine acidic $Ni(NO_3)_2{\cdot}6H_2O$ and basic $2NiCO_3{\cdot}3Ni(OH)_2{\cdot}4H_2O$ via acid-base reaction as a mixed NiO precursor. Their effects were studied in the aspects of DSC, microstructure, porosity, and electrical conductivity. Ni/YSZ composite of 1N9C (1 mole NiO from the nitrate and 9 moles of NiO from the carbonate) was prepared by consolidation at $1400^{\circ}C$ for 3 h, and then followed by reduction at $1000^{\circ}C$ for 3 h under flowing of 6% $H_2/N_2$. It showed a homogeneous microstructure with ${\sim}20%$ porosity and 1880 S/cm at $1000^{\circ}C$.