• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.46-50
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• 2012

This paper amis at improving the heat radiation performance of thermoelectric module (TEM) for a commercialization of high-powered LED light with using a multichip LED module. In addition, a 10W multichip LED light was prepared for the heat performance on radiating of which LED light was made for a use of testing by the driving of the thermoelectric module. So, it was found that about 30% in the effect of temperature reduction was confirmed if compared with the radiation heat by heat sink only.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.12
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• pp.23-30
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• 2009

LEDs are increasingly used for many applications including automotive, aviation, display, transportation and special lighting applications. Generally, the RGB multichip LED luminaire applied to signboard, emotional lighting system and display device and the white LED luminaire applied to general lighting system. white LED spectra for general lighting should be designed for high luminous efficacy as well as good color rendering. This paper describes characteristics of LED luminaire white LED and RGB multichip LED. Two type of LED luminaire prototype used experiment physical, electrical and optic test and performance analyzed. RGB multi-chip and phosphor-type white LED luminaire were analyzed by experiment on their color characteristics and luminous efficacy of radiation, distribution curve, and electrical characteristics. Research work is in progress to develop an improved performance for optic and electrical works well for two type of LED luminaires.