• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.11
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• pp.938-941
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• 2012

LED is divided to multichannel in order not to exceed a certain voltage in aspects of electric standard. However, it's not possible to know in accordance with what channel SMPS controls the constant voltage and current. In order to solve this problem, it needs to detect the maximum LED String voltage which is applied to LED control circuit, and it is possible to minimize the voltage drop when a difference of LED string voltage occurs by each channel if LED is controlled by the maximum LED string voltage detected. In addition, it is also possible to maximize the efficiency of LED if change LED voltage by detecting the maximum voltage. Feasibility of this claim was verified through implementation of the circuit.

• Journal of Power Electronics
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• v.19 no.1
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• pp.1-10
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• 2019

Current imbalance is the main factor affecting the lifespan of light-emitting diode (LED) lighting systems and is generally solved by active or passive approaches. Given many new lighting applications, independent control is particularly important in achieving different levels of luminance. Existing passive and active approaches have their own limitations in current sharing and independent control, which bring new challenges to the design of LED drivers. In this work, a multichannel resonant converter based on switched-capacitor control (SCC) is proposed for solving this challenge. In the resonant network of the upper and lower half-bridges, SCC is used instead of fixed capacitance. Then, the individual current of the LED array is obtained through regulation of the effective capacitance of the SCC under a fixed switching frequency. In this manner, the complexity of the control unit of the circuit and the precision of the multichannel outputs are further improved. Finally, the superior performance of the proposed LED driver is verified by simulations and a 4-channel experimental prototype with a rated output power of 20 W.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.391-392
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• 2012

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.