• Journal of Information Display
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• v.12 no.1
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• pp.51-55
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• 2011

Efficient two-color-mixed white organic light-emitting diodes are presented herein by employing a sky-blue phosphorescent dopant of iridium(III)bis[4,6-(difluorophenyl)-pyridinato-N,$C^{2'}$]picolinate (FIrpic) and an orange phosphorescent dopant of bis(2-phenylquinoline)(acetylacetonate)iridium(III) ($Ir(phq)_2$acac) on the emissive layer. Very stable color variation under ${\Delta}$0.02 until a 5000 cd/$m^2$ brightness value was realized by efficient carrier control in a multi-stacked emitting layer of blue/red/blue colors. Maximum current and power efficiencies of 23.8 cd/A and 22.9 lm/W in the forward direction were obtained. With balanced emission from the two emitters, the white-light emission of high correlated color temperature of 7308K and the Commission Internationale de I'Eclairage coordinates of (0.30, 0.33) were achieved.

• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.295-296
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• 2014

본 논문에서는 저 전압 스트레스 및 다채널 전류평형을 위한 Floating 전압 스택형 단일스위치 LED(Light Emitting Diode) 구동회로를 제안한다. 기존의 다채널 LED 구동회로는 LED 채널 수 만큼 boost converter가 필요하지만, 제안된 LED 구동회로는 단 하나의 buck converter와 n-1개의 balancing capacitor만을 필요로 한다. 기존 boost converter의 경우 모든 구성 요소는 LED 전압만큼의 높은 전압 스트레스를 갖지만 제안 회로의 경우 모든 구성 요소들은 기존 대비 절반 정도의 전압 스트레스를 갖는다. 또한 제안 LED 구동회로는 다채널의 LED 전류의 평형을 위하여 balancing capacitor만을 사용하기 때문에 높은 신뢰성과 비용의 효율성을 제공한다. 최종적으로 제안된 구동회로의 우수성과 이론적 분석의 타당성 검증을 위하여 46" 2채널 LED 구동회로를 위한 시작품을 제작하여 고찰된 실험결과를 제시한다.

• Progress in Superconductivity and Cryogenics
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• v.23 no.4
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• pp.10-13
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• 2021

Recently, cable conductors composed of numerous coated conductors have been developed to transport huge current for large-scale applications, for example accelerators and fusion reactors. Various cable conductors such as CORC (Conductor on round core), Roebel Cable, and TSTC (Twisted stacked tape cable) have been designed and tested to apply for large-scale applications. But, these cable conductors cannot improve the engineering critical current density (J_e) because they are made by simple stacking of coated conductors. In this study, multi-HTS (High temperature superconductor) layers on one substrate (MHOS) wire was fabricated to increase the engineering critical current density by using the exfoliation of superconducting layer from substrate and silver diffusion bonding method. By the repetition of these processes, the 10 m long 6-layer MHOS conductor was successfully fabricated without any intermediate layers like buffer or solder. 6-layer MHOS conductor exhibited a high critical current of 2,460A/12mm-w. and high engineering critical current density of 1,367A/mm² at liquid nitrogen temperature.

• Steel and Composite Structures
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• v.29 no.5
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• pp.569-578
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• 2018

This paper aims to investigate the transient vibration behavior of functionally graded carbon nanotube (FG-CNT) reinforced nanocomposite plate resting on Pasternak foundation under pulse excitation. The plate is considered to be composed of matrix material and multi-walled carbon nanotubes (MWCNTs) with distribution as per the functional grading concept. The functionally graded distribution patterns in nanocomposite plate are explained more appropriately with the layer-wise variation of carbon nanotubes weight fraction in the thickness coordinate. The layers are stacked up in such a way that it yields uniform and three other types of distribution patterns. The effective material properties of each layer in nanocomposite plate are obtained by modified Halpin-Tsai model and rule of mixtures. The governing equations of an illustrative case of simply-supported nanocomposite plate resting on the Pasternak foundation are derived from third order shear deformation theory and Navier's solution technique. A converge transient response of nanocompiste plate under uniformly distributed load with triangular pulse is obtained by varying number of layer in thickness direction. The validity and accuracy of the present model is also checked by comparing the results with those available in literature for isotropic case. Then, numerical examples are presented to highlight the effects of distribution patterns, foundation stiffness, carbon nanotube parameters and plate aspect ratio on the central deflection response. The results are extended with the consideration of proportional damping in the system and found that nanocomposite plate with distribution III have minimum settling time as compared to the other distributions.

• Journal of Power Electronics
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• v.18 no.6
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• pp.1791-1804
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• 2018

To achieve a fast dynamic response and to solve the multi-objective control problems of the output currents, capacitor voltages and system constraints, this paper proposes a deadbeat and hierarchical predictive control with space-vector modulation (DB-HPC-SVM) for five-level nested neutral point piloted (NNPP) converters. First, deadbeat control (DBC) is adopted to track the reference currents by calculating the deadbeat reference voltage vector (DB-RVV). After that, all of the candidate switching sequences that synthesize the DB-RVV are obtained by using the fast SVM principle. Furthermore, according to the redundancies of the switch combination and switching sequence, a hierarchical model predictive control (MPC) is presented to select the optimal switch combination (OSC) and optimal switching sequence (OSS). The proposed DB-HPC-SVM maintains the advantages of DBC and SVM, such as fast dynamic response, zero steady-state error and fixed switching frequency, and combines the characteristics of MPC, such as multi-objective control and simple inclusion of constraints. Finally, comparative simulation and experimental results of a five-level NNPP converter verify the correctness of the proposed DB-HPC-SVM.

• Journal of Radiopharmaceuticals and Molecular Probes
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• v.8 no.2
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• pp.95-101
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• 2022

Microfluidic radioimmunoassay (RIA) platform called µ-RIA spends less reagent and shorter reaction time for the analysis compared to the conventional tube-based radioimmunoassay. This study reported the design of µ-RIA chips optimized for the gamma counter which could measure the small samples of radioactive materials automatically. Compared with the previous study, the µ-RIA chips developed in this study were designed to be compatible with conventional RIA test tubes. And, the automatic gamma counter could detect radioactivity from the ¹²⁵I labeled anti-PSA attached to the chips. Effects of the multi-layer microchannels and two-phase flow in the µ-RIA chips were investigated in this study. The measured radioactivity from the ¹²⁵I labeled anti-PSA was linearly proportional to the number of stacked chips, representing that the radioactivity in µ-RIA platform could be amplified by designing the chips with multi-layers. In addition, we designed µ-RIA chip to generate liquid-gas plug flow inside the microfluidic channel. The plug flow can promote binding of the biomolecules onto the microfluidic channel surface with recirculation in the liquid phase. The ratio of liquid slug and air slug length was 1 : 1 when the ¹²⁵I labeled anti-PSA and the air were injected at 1 and 35 µL/min, respectively, exhibiting 1.6 times higher biomolecule attachment compared to the microfluidic chip without the air injection. This experimental result indicated that the biomolecular reaction was improved by generating liquid-gas slugs inside the microfluidic channel. In this study, we presented a novel µ-RIA chips that is compatible with the conventional gamma counter with automated sampler. Therefore, high-throughput radioimmunoassay can be carried out by the automatic measurement of radioactivity with reduced radiowaste generation. We expect the µ-RIA platform can successfully replace conventional tube-based radioimmunoassay in the future.

• The Bulletin of The Korean Astronomical Society
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• v.46 no.1
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• pp.60.2-60.2
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• 2021

In this study, we determinate the differential emission measure(DEM) of solar corona using three SDO/AIA EUV channel images and three AI-generated ones. To generate the AI-generated images, we apply a deep learning model based on multi-layer perceptrons by assuming that all pixels in solar EUV images are independent of one another. For the input data, we use three SDO/AIA EUV channels (171, 193, and 211). For the target data, we use other three SDO/AIA EUV channels (94, 131, and 335). We train the model using 358 pairs of SDO/AIA EUV images at every 00:00 UT in 2011. We use SDO/AIA pixels within 1.2 solar radii to consider not only the solar disk but also above the limb. We apply our model to several brightening patches and loops in SDO/AIA images for the determination of DEMs. Our main results from this study are as follows. First, our model successfully generates three solar EUV channel images using the other three channel images. Second, the noises in the AI-generated EUV channel images are greatly reduced compared to the original target ones. Third, the estimated DEMs using three SDO/AIA images and three AI-generated ones are similar to those using three SDO/AIA images and three stacked (50 frames) ones. These results imply that our deep learning model is able to analyze temperature response functions of SDO/AIA channel images, showing a sufficient possibility that AI-generated data can be used for multi-wavelength studies of various scientific fields. SDO: Solar Dynamics Observatory AIA: Atmospheric Imaging Assembly EUV: Extreme Ultra Violet DEM: Diffrential Emission Measure

• Korean Journal of Optics and Photonics
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• v.35 no.4
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• pp.170-174
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• 2024

A laser beam propagating in free space can be negatively affected by atmospheric turbulence. To overcome this and correct the wavefront error of the laser beam itself, a deformable mirror (DM), which is a key component of adaptive optics, is widely used. In this paper, a novel precision assembling method is suggested for a multi-channel high-density DM. The material of the mirror sheet of the DM is silicon carbide (SiC), and the actuator is a stacked-type lead-magnesium-niobate (Pb(Mg_1/3Nb_2/3)O₃; PMN). To connect the mirror sheet and each actuator, a flexure is inserted. The flexure can make the DM operate with full strokes without the failure of adhesive. A series of jigs were designed and applied in order to assemble these three parts (the mirror sheet, actuators, and flexures) precisely. After assembly, the performance of the DM was also checked.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.43-51
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• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.