• Title/Summary/Keyword: Multi-chip System

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A Study on the Verification Platform Architecture for MPSoC (MPSoC 검증 플랫폼 구조에 관한 연구)

  • Song, Tae-Hoon;Song, Moon-Vin;Oh, Chae-Gon;Chung, Yun-Mo
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.8
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    • pp.74-79
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    • 2007
  • In general, the high cost, long time, and complex steps are required in the design and implementation of MPSoC(Multi-Processor System on a Chip), therefore a platform is used to test the functionality and performance of IPs(Intellectual Properties). In this paper, we study a platform architecture to verify IPs based on Interconnect Network among processors, and show that the MPSoC platform gives better performance than a single processor for an application program.

Design and Build of Transmit/Receive Module for X Band (X 대역 T/R 모듈의 설계 및 구현)

  • Park, Sung-Kyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.2
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    • pp.168-173
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    • 2008
  • In this paper, we have designed transmit/receive Module for X band which can be applied to active phase array radar system. AESA(active electrically beam steered array) is able to transmit high power as like TWTA with composition of TH Module and steer a main beam faster than mechanically steering system. The proposed structure of T/R Module for X band is brick type for physical structure, common leg structure electrically and small size design as MCM(multi chip module). The results show that the characteristic of proposed T/R module can fully cover the specification of required military radar application.

Long Pulse Generation Technology of an Alexandrite Laser System for Hair Removal

  • Kim, Hee-Je;Park, Jin-Young;Kwak, Su-Young;Kim, Su-Weon;Min, Byoung-Dae;Jung, Jong-Han;Hong, Jung-Hwan
    • KIEE International Transactions on Electrophysics and Applications
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    • v.3C no.4
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    • pp.155-160
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    • 2003
  • In this study, an Alexandrite laser system for hair removal adopting a multi-discharge method in which three flash lamps are turned on consecutively was designed and fabricated to examine the pulse width and the pulse shape of the laser beams depending upon the changes in the lamp turn-on time. Specifically, this study demonstrates a technology that makes it possible to formulate various pulse shapes by turning on three flashlamps consecutively on a real-time basis with the aid of a PIC (program integrated circuit) one-chip microprocessor. With this technique, the lamp turn-on delay time can be varied more diversely from 0 to 10 ms and real-time control is possible with an external keyboard, enabling an assortment of pulse shapes. In addition, longer pulses can be more widely used for industrial processing as well as for numerous medical purposes.

A Task Scheduling Strategy in a Multi-core Processor for Visual Object Tracking Systems (시각물체 추적 시스템을 위한 멀티코어 프로세서 기반 태스크 스케줄링 방법)

  • Lee, Minchae;Jang, Chulhoon;Sunwoo, Myoungho
    • Transactions of the Korean Society of Automotive Engineers
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    • v.24 no.2
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    • pp.127-136
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    • 2016
  • The camera based object detection systems should satisfy the recognition performance as well as real-time constraints. Particularly, in safety-critical systems such as Autonomous Emergency Braking (AEB), the real-time constraints significantly affects the system performance. Recently, multi-core processors and system-on-chip technologies are widely used to accelerate the object detection algorithm by distributing computational loads. However, due to the advanced hardware, the complexity of system architecture is increased even though additional hardwares improve the real-time performance. The increased complexity also cause difficulty in migration of existing algorithms and development of new algorithms. In this paper, to improve real-time performance and design complexity, a task scheduling strategy is proposed for visual object tracking systems. The real-time performance of the vision algorithm is increased by applying pipelining to task scheduling in a multi-core processor. Finally, the proposed task scheduling algorithm is applied to crosswalk detection and tracking system to prove the effectiveness of the proposed strategy.

Study on the multi-channel dosimetry system with microprocessor and its application to radition therapy (마이크로 프로세서를 이용한 선량측정 장치의 제작과 그 응용에 관한 연구)

  • 강정구;이정옥;김승곤;김부길;김진기
    • Progress in Medical Physics
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    • v.3 no.1
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    • pp.19-24
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    • 1992
  • We have desingned multi channel dosimetry system with Intel single-chip microprocessor. We considered that this system is very useful for patient dose measurement, measurement of sealed source dose distribution and calibration of small field for stereotatic radiosurgery system We have designed that this system use commercially available semicondutor detector and personal computer can control this system and process data through RS-232C serial port.

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Effects of Encapsulation Layer on Center Crack and Fracture of Thin Silicon Chip using Numerical Analysis (봉지막이 박형 실리콘 칩의 파괴에 미치는 영향에 대한 수치해석 연구)

  • Choa, Sung-Hoon;Jang, Young-Moon;Lee, Haeng-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.1
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    • pp.1-10
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    • 2018
  • Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

Real-time Implementation of a Multi-channel G.729A Speech Coder on a 16 Bit Fixed-point DSP (16 비트 고정 소수점 DSP를 이용한 다채널 G.729A음성 부호화기의 실시간 구현)

  • 안도건;유승균;최용수;이재성;강태익;박성현
    • The Journal of the Acoustical Society of Korea
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    • v.19 no.4
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    • pp.45-51
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    • 2000
  • This paper describes real-time implementation of a multi-channel G.729A speech coder using a 16 bit fixed-point Digital Signal Processor (DSP) and its application to a Voice Mailing Service (VMS) system. TMS320C549 by Texas Instruments was used as a fixed point DSP chip and a 4 channel G.729A coder was implemented on the chip. The implemented coder required 14.5 MIPS for the encoder and 3.6 MIPS for the decoder at each channel. In addition, memories required by the coder were 9.88K words and 1.69K words for code and data sections, respectively. As a result, the developed VMS system that accommodates two DSP chips was able to support totally 8 channels. Experimental results showed that the our multi-channel coder passes all of test vectors provided by ITU-T.

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A SoC based on the Gaussian Pyramid (GP) for Embedded image Applications (임베디드 영상 응용을 위한 GP_SoC)

  • Lee, Bong-Kyu
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.3
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    • pp.664-668
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    • 2010
  • This paper presents a System-On-a-chip (SoC) for embedded image processing and pattern recognition applications that need Gaussian Pyramid structure. The system is fully implemented into Field-Programmable Gate Array (FPGA) based on the prototyping platform. The SoC consists of embedded processor core and a hardware accelerator for Gaussian Pyramid construction. The performance of the implementation is benchmarked against software implementations on different platforms.

Design and Implementation of Image-Pyramid

  • Lee, Bongkyu
    • Journal of Korea Multimedia Society
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    • v.19 no.7
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    • pp.1154-1158
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    • 2016
  • This paper presents a System-On-a-chip for embedded image processing applications that need Gaussian Pyramid structure. The system is fully implemented into Field-Programmable Gate Array (FPGA) based on the prototyping platform. The SoC consists of embedded processor core and a hardware accelerator for Gaussian Pyramid construction. The performance of the implementation is benchmarked against software implementations on different platforms.

A Single Transistor-Level Direct-Conversion Mixer for Low-Voltage Low-Power Multi-band Radios

  • Choi, Byoung-Gun;Hyun, Seok-Bong;Tak, Geum-Young;Lee, Hee-Tae;Park, Seong-Su;Park, Chul-Soon
    • ETRI Journal
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    • v.27 no.5
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    • pp.579-584
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    • 2005
  • A CMOS direct-conversion mixer with a single transistor-level topology is proposed in this paper. Since the single transistor-level topology needs smaller supply voltage than the conventional Gilbert-cell topology, the proposed mixer structure is suitable for a low power and highly integrated RF system-on-a-chip (SoC). The proposed direct-conversion mixer is designed for the multi-band ultra-wideband (UWB) system covering from 3 to 7 GHz. The conversion gain and input P1dB of the mixer are about 3 dB and -10 dBm, respectively, with multi-band RF signals. The mixer consumes 4.3 mA under a 1.8 V supply voltage.

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