• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2169-2171
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• 2001

The vacuum gauge control system has been designed and implemented using multi-serial communication controllers (MSCC) for the 2.5 Gev storage ring at the Pohang Accelerator Laboratory (PAL). There are 20 Balzers vacuum gauges and 17 Granville-Phillips vacuum gauges at the storage ring. A MSCC have two RS485 (max speed 460.8Kbps) field network port, 8 channel serial communication ports (max speed 460.8Kbps) connected to gauge controller for serial communication control. 12 MSCCs are connected to a personal computer (PC) through the RS485 field network. The PC can automatically control the MSCCs by sending set of commands through the network. The commands specify the duration of the MODBUS protocol. Upon receiving a command from a PC running under Windows2000 through the network, the MSCC communicate through the serial output ports to gauge controller. In this paper, we describe control structure and scheme of the vacuum gauge control system.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2344-2346
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• 2002

A vacuum control system has been developed for using Ethernet Multi Serial Device Severs (EMSDS) for the Pohang Accelerator Laboratory (PAL) storage ring. There are 124 vacuum ion pumps at the storage ring. It was a very important problem to solve the problem how to control such a big number of vacuum pumps distributed around the ring. After discussions, we decided to develop a serial to ethernet interrace device sever that will be mounted in the control system rack. It has a 32-bits microprocessor embedded Linux, 12 ports RS485 (or RS232) slave interface. one channel 10/100BaseTx ethernet host port, one channel UART host port, and 16 Mbytes large memory buffer. These vacuum pumps are connected to Ion-Pump serial controllers, which chop the AC current so as to control the current in the pumps. The EMSDS connect either 100BaseTx or 10BaseT ethernet networks to asynchronous serial ports for communication with serial device. It can simultaneously control up to 12 ion-pump serial controllers. 12 EMSDS are connected to a personal computer (PC) through the network. The PC can automatically control the EMSDS by sending a set of commands through the TCP/IP network. Upon receiving a command from a PC running under Windows2000 through the network, the EMSDS communicate through the stave serial interrace ports to ion-pump controller. We added some software components on the top of EPICS (Experimental Physics and Industrial Control System) toolkit.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.5
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• pp.29-36
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• 2019

In modern society in which the fourth industrial revolution has come to the fore and rapid technology innovations are taking place, a phenomenon of making and selling small quantities of various products that consumers want instead of mass producing one item has emerged. As the market is moving toward the multi-item small-sized production system, there is a need for a system in which a machine independently judges and carries out machining and post-processing. In order for a machine to judge processing on its own, it is necessary to measure the force applied to a product. This study aimed to develop a large-scale dynamometer that enables three-axis measurement using octagonal ring load cells. As for the device's configuration, four octagonal ring load cells, which were previously researched, were used to enable three-axis measurement. It was reconfigured by modifying the attachment position of the octagonal ring load cells' strain gauge and the Wheatstone bridge of each axis, and a system was set up to allow the monitoring of data measured through the monitor. The configured device calculated a strain rate by an experiment, and this rate was compared with the theoretical strain rate to find a correction value. The correction value was entered into a formula, deriving a modified formula. The modified formula was entered into the device, which completed the large-scale dynamometer.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.247.1-247.1
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• 2014

The capacitive coupled plasma is used widely in the semiconductor industries. Especially, the uniformity of the industrial plasma is heavily related with defect ratio of devices. Therefore, the industries need the capacitive coupled plasma source which can generate the uniform plasma and control the plasma's uniformity. To achieving the uniformity of the large area plasma, we designed multi-powered electrodes. We controlled the uniformity by controlling the power of each electrode. After this work, we started to research another concept of the plasma device. We make the plasma chamber that has multi-ground electrodes imaginary (CST microwave studio) and simulate the electric field. The shape of the multi-ground electrodes is ring type, and it is same as the shape of the multi-power electrodes that we researched before. The diameter of the side electrode's edge is 300mm. We assumed that the plasma uniformity is related with the impedance of ground electrodes. Therefore we simulated the imaginary chamber in three cases. First, we connected L (inductor) and C (capacitor) at the center of multi-ground electrodes. Second, we changed electric conductivity of multi-ground electrode. Third, we changed the insulator's thickness between the center ground electrode and the side ground electrode. The driving frequency is 2, 13.56 and 100 MHz. We switched our multi-powered electrode system to multi-ground electrode system. After switching, we measured the plasma uniformity after installing a variable vacuum capacitor at the ground line. We investigate the effect of ground electrodes' impedance to plasma uniformity.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.1
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• pp.33-41
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• 2010

This study was aimed at the design of the dies for the unified pipe joint of the intermediate shaft using the computer simulation to shorten the period of production, on the basis of the process planning which was designed by the field experts. In the computer simulation, 'Deform-3d' and 'eesy-DieOpt' have been used, which are the commercial process analysis and die design program. Through the process analysis, we could know the propriety of the forming process, the inner pressure of the die and the suitable fitting pressure between the insert and the sleeve which was not showing any positive tangential stresses in the insert. Through the simulation of die design, we could know the number of the stress ring, the diameter ratios, the stresses of the die, the shrink fitting tolerance and temperature in the condition of the already determined maximum outer die diameter of the multi-stage former. The validity of the die design using the computer simulation was analyzed by the experiments and the results were satisfactory. As the results of this study, the new and easy die design system for multi-forging has been developed.

• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.186-189
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• 2010

Reflection(R($\omega$)), transmission(T($\omega$)) and loss(L($\omega$)) characteristics of multi-layer metamaterials are investigated experimentally in free space with the incident EM waves perpendicular to the substrate plane. The sample is made of split-ring resonators(SRRs) and wires which are the typical model of metamaterials. The R($\omega$) and T($\omega$) of multi-layer metamaterials have been calculated from the measured S-parameters. In this paper, we got the impedance-matched result according to the curves of R($\omega$), meanwhile the T($\omega$) decreased with increasing number of layers. At last, we attained the result that the L($\omega$) gets to nearly 98% around 8 GHz, with R($\omega$)=T($\omega$)=0. The design presented in this paper achieves experimented loss near unity.

• Progress in Superconductivity
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• v.8 no.1
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• pp.8-15
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• 2006

The size of the superconducting domains and the critical current density inside these domains have to be enhanced for most of cryomagnetic applications of melt-textured YBCO bulks. To enlarge the size of the domains we studied the multi-seeding technique based on a well-established procedure for preparing high quality YBCO monoliths using self-made SmBCO seeds. The distance between the seeds was optimised as a result of the investigation of the effects of various seed distances on the characteristics of the grain boundary Junctions. The influences of a-b plane intersections and c-axis misalignments were researched. Thereby, a small range of tolerance of the misorientations between the seed crystals was found. Field mapping was applied to control the materials quality and the superconductor's grain structure was investigated using polarisation microscopy. YBCO function elements with iou. seeds in a line and an arrangement of making type (100)/(100) and (110)/(110) boundary junctions, respectively, were processed. The trapped field profile in both sample types shows single domain behaviour. To demonstrate the potential of the multi-seeding method a ring-shaped sample was processed by placing sixteen seeds in a way to make both (100)/(100) and (110)/(110) grain junctions at the same time. The results up to now are very promising to prepare large single domain melt-textured YBCO semi-finished products in complex shapes.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.581-584
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• 2008

At the inlet and outlet differential pressure and The fluid velocity over 32m/s are damaged (Plug, sheet ring, trim) About reduction trim parts of the control valve. AOV of the differential pressure 1,500psi become often the damage in the nuclear power plant. Damages of AOV studied CFD analysis and improvement program. Multi-stage trim designs which decrease a fluid kinetic energy are demanded and AOV parts are demanded case hardening and material change.

• Journal of Biomedical Engineering Research
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• v.10 no.2
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• pp.157-164
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• 1989

Three-dimensional imaging and manipulation of CT data are becoming increasingly important for deterRing the complex structure and pathologies. Octree which is a hierarchical data model is used to reconstruct three- dimensional objects from CT scans. Orthogonal cross sections are displayed by traverse the octree partially. Arbitrary oblique planes are derived by intersecting the square region of plane and cubic volume of octal node. Thia method enables the display of multi-structured complex organ ann the realization by personal computer.