• Journal of the Korean Society of Industry Convergence
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• v.23 no.4_2
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• pp.675-682
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• 2020

Multi-wire sawing is the prominent technology employed to cut hard material ingots into wafers. This paper aimed to research the effect of diamond toughness index on the cutting performance of electroplated diamond wire. Three different toughness index of diamond abrasives were used to manufacture electroplated diamond wires. The cutting performance of electroplated diamond wire is verified through experiments, in which sapphire ingot are cut using single wire sawing machine. A single wire saw for constant load slicing is developed for the cutting performance evaluation of electroplated diamond wire. Choosing the cutting depth, total cutting depth, cutting force and wear of electroplated diamond wires as evaluation parameters, the performance of electroplated diamond wire is evaluated. The results of this study showed that there was a significant direct relationship between the toughness index of diamond abrasives and the cutting performance. Results demonstrated that diamond abrasive with a high toughness index showed higher cutting performance. However, all diamond abrasives showed similar cutting performance under low load conditions. The results of this paper are useful for the development of cutting large diameter ingots and cutting high hardness ingots at high speed.

• Journal of Welding and Joining
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• v.32 no.4
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• pp.1-9
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• 2014

A quantitative understanding on the effect of the welding conditions on weld joint dimensions and weld thermal cycle is difficult through experimental studies alone. The experimental realization of temperature distribution in the weld pool is proved to be extremely difficult due to the small size of welds, high peak temperature and steep temperature gradients in weld pool. This review deals with the heat transfer and fluid flow analysis to understand the parametric influence of a single wire submerged arc welding (SAW) and multi-wire SAW processes on the weld bead dimensions, temperature and fluid flow distribution in the weldment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.837-838
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• 2012

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.128-129
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• 2006

To investigate impact property characteristics on the low temperature plate weld metal, the two different plates of the same steel grade were welded and evaluated by Mo bearing and no Mo containing welding consumables. The results are summarized as follows; 1) Multi pass welded Mo bearing weldment was not satisfied with the requirement of tensile strength, while no Mo containing one was satisfied with it 2) In the plate butt weldment, the impact property of weld metal was highly affected by both the welding consumable and plate.

• Journal of Welding and Joining
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• v.23 no.2
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• pp.66-74
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• 2005

API(American Petroleum Institute) steel, as a line pipe material, requires the enhanced mechanical and chemical properties with the environmental severity. Especially, the weld part(weld metal and heat affected zone) is an important region for the safety. However, the study for the behavior of microstructure and toughness in multi-pass welding is seldom. In this study, the relationship between the microstructure and toughness of welds with several welding, bending and heat-treatment conditions was examined. In particular, HIC property in the weld metal was evaluated. The microstructure and toughness in multi-passed HAZ seemed to be determined by the final welding thermal cycle and the low toughness was attributed to the MA constituents formed in the intercritically reheated region. The weld metal showed very low toughness and it was not improved by the change in bending and heat treatment conditions. Additionally, the cracks are observed in the weld metal. from these results, it was found that the choice of welding wire/flux is very important.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.320-323
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• 2002

This paper presents a new generation of system for pressure vessel and shipbuilding. Typical pressure vessel and ship building weld joint preparations are either traditional V, butt, fillet grooves or have narrow or semi narrow gap profiles. The fillet and U groove are prevalently used in heavy industries and shipbuilding to melt and join the parts. Since the wall thickness can be up to 6" or greater, welds must be made in many layers, each layer containing several passes. However, the welding time for the conventional processes such as SAW(Submerged Arc Welding) and FCAW(Flux Cored Arc Welding) can be many hours. Although SAW and FCAW are normally a mechanized process, pressure vessel and ship structures welding up to now have usually been controlled by a full time operator. The operator has typically been responsible for positioning each individual weld run, for setting weld process parameters, for maintaining flux and wire levels, for removing slag and so on. The aim of the system is to develop a high speed welding system with multitorch for increasing the production speed on the line and to remove the need for the operator so that the system can run automatically for the complete multi-torch multi-layer weld. To achieve this, a laser vision sensor, a rotating torch and an image processing algorithm have been made. Also, the multitorch welding system can be applicable for the fine grained steel because of the high welding speed and lower heat input compare to a conventional welding process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.6
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• pp.225-229
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• 2011

Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.177-182
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• 2017

The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.

• Tribology and Lubricants
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• v.33 no.3
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.