• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.2
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• pp.230-239
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• 1996

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.883-884
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• 2010

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.6
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• pp.103-110
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• 2004

The major trend in global automotive market is changing drastically in the way that a vehicle FECPS(Front End Cooling Pack System) is designed and manufactured as an assembly part. The system can encompass many functions, be assembled into a vehicle as a module, and reduce the production cost as well as time. The FECPS consists of an impact beam, an aluminum condenser and a radiator, a carrier and a cooling fan with a BLDC motor. In order to predict the performance of a FECPS accurately, it is essential to properly model the air flow field through various heat exchangers, such as a condenser or a radiator. In this study, the flow field of the system is measured by a PIV(Particle Image Velocimetry) system. The result is compared with that measured with multi-channel anemometer.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.6
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• pp.589-598
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• 2004

Flow condensation heat transfer coefficients (HTCs) of R22 and R134a were measured on a horizontal 9 hole aluminum multi-channel tube. The main test section in the refrigerant loop was made of a flat multi-channel aluminum tube of 1.4 mm hydraulic diameter and 0.53 m length. Refrigerant was cooled by passing cold water through an annulus surrounding the test section. Data were obtained in the vapor qualities of 0.1∼0.9 at mass flux of 200∼400 kg/$m^2$s and heat flux of 7.3∼7.7 ㎾/$m^2$ at the saturation temperature of 4$0^{\circ}C$. All popular correlations in single-phase subcooled liquid and flow condensation originally developed for large single tubes predicted the present data of the flat tube within 20% deviation when effective heat transfer area is used in determining experimental data. This suggests that there is little change in flow characteristics and patterns when the tube diameter is reduced down to 1.4 mm diameter range. Thermal insulation for the outer tube section surrounding the test tube for the transport of heat transfer fluid is very important in fluid heat-ing or cooling type heat transfer experimental apparatus.

• Design & Manufacturing
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• v.17 no.4
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• pp.63-71
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• 2023

In order to increase the extrusion production speed of aluminum, extrusion die cooling technology using liquid nitrogen has recently attracted a lot of attention. Increasing the extrusion speed increases the temperature of the bearing area of extrusion dies and the extrusion profile, which may cause defects on the surface of extruded profile. Extrusion die cooling technology is to directly inject liquid nitrogen through a cooling channel formed between the die and the backer inside the die-set. The liquid nitrogen removes heat from the die-set, and gaseous nitrogen at the exit of the channel, covers the extrusion profile of an inert atmosphere reducing the oxidation and the profile temperature. The aim of this study is to evaluate the cooling capacity by applying die cooling to extrusion of Al-Mn-based aluminum alloy flat tubes, and to investigate the effects of die cooling on the change in extrusion characteristics of flat tubes. Cooling capacity was confirmed by observing the temperature change of the extrusion profile depending on whether or not die cooling is applied. To observe changes in material characteristics due to die cooling, surface observation is conducted and microstructure and precipitate analysis are performed by FE-SEM on the surface and longitudinal cross section of the extruded flat tubes.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.113-116
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• 2008

This work presents numerical optimization for design of staggered arrays of dimples printed on opposite surfaces of a cooling channel with a fast and elitist Non-Dominated Sorting of Genetic Algorithm (NSGA-II) of multi-objective optimization. As Pareto optimal front produces a set of optimal solutions, the trends of objective functions with design variables are predicted by hybrid multi-objective evolutionary algorithm. The problem is defined by three non-dimensional geometric design variables composed of dimpled channel height, dimple print diameter, dimple spacing and dimple depth to maximize heat transfer rate compromising with pressure drop. Twenty designs generated by Latin hypercube sampling were evaluated by Reynolds-averaged Navier-Stokes solver and the evaluated objectives were used to construct Pareto optimal front through hybrid multi-objective evolutionary algorithm. The optimum designs were grouped by k-mean clustering technique and some of the clustered points were evaluated by flow analysis. With increase in dimple depth, heat transfer rate increases and at the same time pressure drop also increases, while opposite behavior is obtained for the dimple spacing. The heat transfer performance is related to the vertical motion of the flow and the reattachment length in the dimple.

• Journal of the Korea Safety Management & Science
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• v.15 no.2
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.