• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.1039-1042
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• 2002

SMD(Surface Mounting Device) which mounts electronic components as IC-Chips on PCB automatically, produces a large dynamic force and vibration. The unwanted vibrations in SMD degrade the performance of the precision device and it is the major obstacle to limit its speed for mounting. This study investigated the vibration analysis of a typical SMD to predict the natural frequencies and mode shapes. To validate the finite element analysis of SMD, the FE result was compared with that of ODS measurements. It was shown that the predicted results were well correlated with the experimental modal parameters.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.7
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• pp.90-99
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• 1996

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformed which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backlash and friction. Therefore a dynamic modeling and state sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensit- ivity analysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensit- ivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design and faster operating based on the results of dynamic and state sensitivity.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.628-634
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• 1995

In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformer which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backash and friction. Therefore a dynamic modeling and stste sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensitivity snalysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensitivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design based on the results on the results of dynamic and state sensitivity.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.121-121
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• 2000

This paper presents a design of macro-micro system for high-speed mounting of micro-chips. A macro motion device is driven by DC servomotor and ball screw mechanism. To obtain fast response, a micro motion device utilizes a precision elector magnetic actuator In order to reduce peak impact force, We evaluate the design parameters that have an effect on it. And a characteristic of response is simulated using PID controller in velocity and force control.

• Journal of Information Technology Applications and Management
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• v.11 no.2
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• pp.29-43
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• 2004

As the development of an information technique, gradually, mobile device is going to be miniaturized and operates at high speed. By such the requirements, the devices using a flash memory as a storage media are increasing. The flash memory consumes low power, is a small size, and has a fast access time like the main memory. But the flash memory must erase for recording and the erase cycle is limited. JFFS is a representative filesystem which reflects the characteristics of the flash memory. JFFS to be consisted of LSF structure, writes new data to the flash memory in sequential, which is not related to a file size. Mounting a filesystem or an error recovery is achieved through the sequential approach. Therefore, the mounting delay time is happened according to the file system size. This paper proposes a MJFFS to use a multi-checkpoint information to manage a mass flash file system efficiently. A MJFFS, which improves JFFS, divides a flash memory into the block for suitable to the block device, and stores file information of a checkpoint structure at fixed interval. Therefore mounting and error recovery processing reduce efficiently a number of filesystem access by collecting a smaller checkpoint information than capacity of actual files. A MJFFS will be suitable to a mobile device owing to accomplish fast mounting and error recovery using advantage of log foundation filesystem and overcoming defect of JFFS.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.4 no.3
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• pp.316-321
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• 2004

In this paper, we have developed a new mounting head system for flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provides the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed system with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1060-1065
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• 2003

This paper contributes to development of a new chip mounting head system for flip chip. Recently, the LDM(Linear DC Motor) has been widely used, because it has particular merits than the rotary type motors. In this paper, we proposed a macro/micro positioning system for force control of a chip mounting system. In the proposed macro/micro system, the macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and PCB surface. In order to prove the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed chip mounting head with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions of various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.4
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• pp.122-128
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• 1996

In high speed and high precision assembly systems such as a surface mounting device and robotend effector, the contact force control is required. As the operation repeats, the repetitive control is applied to reduce the periodic contact force errors. Since high order unmodelled dynamics are easily excited in contact force control, a Q filter was introduced and its robust stability was analyzed. Simulation and Experimental results show the effectiveness of the algorithm.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.4
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• IE interfaces
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• v.10 no.1
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• pp.155-167
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• 1997

The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.