• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.491-499
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• 2003

Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I ＋ mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.62-67
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• 2021

In this study, we have successfully developed an unique NVIS Green A compatible LED by combining two technologies. One is white LED made with a black EMC (epoxy molding compound) lead frame. The other is NVIS Green A filter that shields the near infrared region made in the film method. The form factor of the developed NVIS Green A compatible LED was 2.0 × 2.0 × 0.95 mm. And it is possible to satisfy NVIS radiance and color limit specified in MIL-STD-3009 by controlling the concentration of Green A dye and the thickness of the NVIS filter as well as adjusting of color temperature of the white LED. From these results, we are expected that the developed NVIS Green A suitable LED is a promising solution for the weight reduction and the cost reduction of avionic applications.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.531-537
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• 1999

A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Clean Technology
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• v.28 no.4
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• pp.331-338
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• 2022

The objective of this study is to prepare bead-type and pellet-type Pt (1 wt%)/Kieselguhr catalysts as hydrogenation catalysts for the polycyclic aromatic hydrocarbons (PAHs) included in pyrolysis fuel oil (PFO). The optimal reaction temperature to maximize the yield of saturated cyclic hydrocarbons during the PFO-cut hydrogenation reaction in a trickle bed reactor was determined to be 250 ℃. A hydrogen/PFO-cut flow rate ratio of 1800 was found to maximize 1-ring saturated cyclic compounds. The yield of saturated cyclic compound increased as the space velocity (LHSV) of PFO-cut decreased. The difference in hydrogenation reaction performance between the pellet catalyst and the bead catalyst was negligible. However, the catalyst impregnated by Pt after molding the Kieselguhr support (AI catalyst) showed higher hydrogenation activity than the catalyst molded after Pt impregnation on the Kieselguhr powder (BI catalyst), which was a common phenomenon in both the pellet catalysts and bead catalysts. This may be due to a higher number of active sites over the AI catalyst compared to the BI catalyst. It was confirmed that the pellet catalyst prepared by the AI method had the best reaction activity of the prepared catalysts in this study. The majority of the PFO-cut hydrogenation products were cyclic hydrocarbons ranging from C₈ to C₁₅, and C₁₁ cyclic hydrocarbons had the highest distribution. It was confirmed that both a cracking reaction and hydrogenation occurred, which shifted the carbon number distribution towards light hydrocarbons.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Polymer(Korea)
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• v.24 no.4
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• pp.564-570
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• 2000

The waste FRP occured in the fabrication of SMC (sheet molding compound) bathtubs and the waste polyurethane foam occured in electronic manufacture and waste insulator were applied as a soundproof and light weight pannel in the waste FRP unsaturated polyester matrix resin composites to recycle. The effect of filler contents on the mechanical properties and interfacial phenomena of the filler and matrix on the composites was evaluated. The tensile strength of composites reached its maximum value of 82.34 MPa when the filler content was 70 wt%, and the more content of reinforcement is increased, the more tensile modulus was decreased. The flexural strength and modulus of composites, reinforced 70 wt% with filler content, were dominant compared to the other samples to 72.5 MPa, 958.4 MPa respectively. When composite of reinforced 70 wt% with filler content, it was confirmed that pull out phenomena and cracks did not occur in the interface of reinforcement and matrix resin through the SEM observation. Also, waste FRP and urethane foam were dispersed well into matrix resin as filler.

• Journal of the Korean Society for Advanced Composite Structures
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• v.5 no.1
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• pp.1-8
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• 2014

Pultruded glass fiber reinforced polymeric plastic (PFRP) and FRP member manufactured by sheet molding compound (SMC) have superior mechanical and physical properties compared with those of conventional structural materials. Since FRP has an excellent corrosion-resistance and high specific strength and stiffness, the FRP material may be highly appreciated for the development of floating-type photovoltaic (PV) power generation system. In this paper, advanced floating PV generation system made of PFRP and SMC is designed. In the design, it includes tracking solar altitude by tilting photovoltaic arrays and tracking solar azimuth by spinning structures. Moreover, the results of the finite element analysis (FEA) are presented to confirm stability of entire structure under the external loads. Additionally, installation procedure and mooring systems in the Hap-Cheon Dam are discussed and the measurement of strain under the actual circumstances is conducted for assuring stability of actually installed structures. Finally, by comparison with allowable stress, appropriate safety of structure is confirmed to operate the system.

• Journal of Environmental Science International
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• v.18 no.12
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• pp.1339-1347
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• 2009

This study tried to investigate and analyze the actual state such as the regional, classified, and material characteristics of the water quality in order to research the several factors by which the filtrated water of the total 250 cases can be polluted in the water tank. The 215 points (86%) clean the water tanks twice a year regularly and J-city has done the best job of cleaning the water tanks. The fifty points (20%) of the total 250 investigation points examine the water quality of the water tanks every year, however, the 175 investigation points (70%) do not execute the inspection of water quality. In the case of the regional characteristics in the water quality, the 23 points (46%) in H-county, the 17 points (34%) in S-county, and the 16 points (32%) in G-city are incongruent in the standard, and the incongruity ratio of the water quality in J-city is the lowest. The result of the classified incongruity shows that total coliforms were found at the 61 investigation points, mesophilic bacteria were found at the 27 points, and turbidity was found at the 12 points. In the case of the material incongruity, concrete was found at the 63 investigation points as the most distinguished factor, and FRP (fiberglass reinforced plastic) at the 23 points, SMC (sheet molding compound) at the 12 points, and stainless steel was found at the 2 points.

• Archives of Plastic Surgery
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• v.38 no.1
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• pp.35-42
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• 2011

Purpose: Blow-out fractures can be reduced using various methods. The orbital reconstruction technique using a balloon under endoscopic control has advantages over other methods. However, this method has some problems too, such as postoperative follow-up, management of the balloon catheter, and reduction of the posterior orbital floor. Thus, we developed a simple, effective method for orbital floor reduction that involves molding and shaping the antral balloon catheter. Methods: A 0, 30, or $70^{\circ}$, 4-mm endoscope was placed though a two-point, 5-mm maxillary antrostomy. The balloon catheter is placed directly at the orbital apex to reconstruct the anterior shelf (spherical shape), while it is turned in a U-shape towards the anterior maxilla for the posterior shelf (elliptical shape). Orbital floor defects, compound or comminuted fractures are reconstructed with alloplastic materials through an open lid incision under the endoscopic control. Results: This technique was applied to ten patients with orbital floor fractures: five anterior shelf and five posterior shelf fracture, respectively. Four of the patients had zygomatico-orbital fractures, while the rest had isolated orbital floor fractures. Two patients were given porous polyethylene implants Synpor$^{(R)}$) and three underwent reconstruction with a resorbable mesh plate. No complication associated with this technique was identified. Conclusion: The freestyle placement and selection of a urinary balloon catheter under endoscopic control and the preoperative estimation of the volume enhanced the stabilization of the orbital contour. This method improves the adaptation of the orbital floor without the risk of injuring the surrounding orbital contents, dissecting blindly, or using sharp traction. One drawback of this method is the patient's discomfort from the catheter during treatment.