• Proceedings of the Optical Society of Korea Conference
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• 2008.07a
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• pp.415-416
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• 2008

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.5
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• pp.625-634
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• 1986

The strain distribution on a welded aluminum alloy transition joint produced by a static tensile load has been measured using a moire method combined with photoelastic coating method. The test specimens were made of aluminum alloy 6061-T6 and 2014-T6 butt welded with ER-4043 filler metal, and were post welded heat treated (solid solution heat treatment 502.deg. C 70min.) and precipitated (artificial aging 171.deg. C 600min.) to cause an abrupt change of mechanical properties between the base metals and weld metal. The photoelastic epoxy rubber was cemented on the specimen grating which had been reproduced on the specimen surface by using an electropolishing. The measurements were compared with strains computed by Finite Element Analysis. The following results were abtained. (1) The maximum strain were distributed along the center line in the transverse directiion of the weld metal. (2) The strain gradient along the fusion line increased approaching the V-groove tip and the maximum value was observed at a quarter of width from the V-groove tip. (3) The moire method combined with photoelastic coating was proved very useful for real time strain measurement in the welded aluminum alloy transition joint.

• Journal of the Korean Society of Safety
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• v.19 no.1
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• pp.117-123
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• 2004

The prediction to the hydroscopic moisture warping behaviors is analyzed for cellulose-based laminates using a numerical method base on a modified classical laminate(MCL) theory for hygroscopic moisture deformations with cycling testing data. The experimental measurement of the interferometric hygroscopic warping effects, moisture generator, and curvature of cellulose reinforced epoxy laminates is studied under cyclic environmental conditions using a Moire interferometer coupled. Accurate determination of curvatures provides a description of dimensional stability evolution; the tools for validation of computational internal stress and for the warpage prediction in model safety.

• Transactions of the Korean Society of Mechanical Engineers
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• v.6 no.4
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• pp.315-322
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• 1982

The slab analogy method was introduced in the 1920's for the first time as a new experimental stress analysis method. Notwithstanding its theoretical propriety, this method has not been recognized as efficient one because of its difficulty in practical measurement of the slab curvature. In this paper, aiming at experimental determination of two-dimensional stress intensity factors(S. I. F) of arbitrarily shaped cracks which had been regarded as almost impossible by conventional method, the slab analogy was reevaluated. Measuring of slab curvature was replaced by three simple measuring factors to overcome vital slab-analogy's shortcoming by joint use of the shadow-moire method. A determination formula was also derived from the theory of fracture mechanics. By this newly exploited method, it was found that the slab analogy still has its great advantage in determination of S.I.F. of arbitrarily shaped cracks with considerable accuracy compared with existent experimental methods.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.3
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• pp.52-57
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• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar. laser, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment specimen was loaded in parallel with a loadcell. The specimen was the cold rolled steel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• Transactions of the Korean Society of Mechanical Engineers
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• v.6 no.3
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• pp.197-203
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• 1982

The fatigue crack propagation behavior or non-heat-treatment and thermally aged type 304 stainless steel was investigated on the basis of linear elastic fracture mechanics. This Study was concentrated on the relations between the crack propagation rate and the stress intensity factor range. The following results are obtained : The precision measurement and observation of fatigue crack propagation behavior is studied with moire grating. The effect of thermally aged type 304 stainless steel is investigated under small load. In the equation da/dN=c(.DELTA. k)/SUP m/, factor m of thermally aged steel is a little higher than non-heat-treatmented steel and its limit is m=1.35-4.2.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1261-1267
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• 2003

Since the grating optical low-pass fillet degrades the resolution of images, we developed a hologram optical low-pass filter that show low degradation of the image and studied its characteristics. We designed the hologram that divides input beam into circular shaped 21 beams with a Monte-Carlo based hologram generation program and calculated its MTE characteristics to compare it with that of a grating filter. The hologram was manufactured through the optical lithography process and attached to a digital imaging device (Zoran 732212) for measurement. The moirfiltering is compared with zone plate images and the resolution loss is measured with USAF resolution chart. The hologram optical low-pass filter showed better characteristics in both moly filtering and resolution.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.424-428
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• 2005

This paper shows a non-contact optical method to inspect micron scale parts which will be manufactured in micro-factory system. This inspection system should have some characteristics like a small size, flexibility, and high measuring speed. In the viewpoint of measuring capabilities, it also has resolution under micron scale with measuring range over millimeter scale. Two methods will be presented in this paper, one is Moire and the other is white-light scanning interferometry. Also some experimental results will be presented to show the possibilities of the proposed inspection system.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.88-93
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• 2005

$Moir\acute{e}$ topography method is a well-known non-contacting 3-D measurement method. Recently, the automatic 3-D measurement by $Moir\acute{e}$ topography has been required, since the method was frequently applied to the engineering and medical fields. The 3-D measurement using projection $Moir\acute{e}$ topography is very attractive because of its high measuring speed and high sensitivity. In this paper, using two-wavelength method of projection $Moir\acute{e}$ topography was tested to measuring object with $2\pi-ambiguity$ problems. The experimental results prove that the proposed scheme is capable of finding absolute fringe orders, so that the $2\pi-ambiguity$ problems can be effectively overcome so as to treat large step discontinuities in measured objects.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.376-380
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• 2008

This paper presents the Projection Moire method using a line scan camera. The high resolution feature of a line scan camera makes it possible to scan an image quickly, thus enabling a much quicker 3D profile. This method uses a high resolution line scan camera making it possible to scan an image at high speed simultaneously measuring the 3D profile of a large FOV. When using a high resolution scan camera, a full FOV is scanned, thus requiring just one movement of a projection grating. As a result, the number of grating movements is reduced drastically. The end result is a faster and more accurate 3D measurement. Moving the grating too quickly causes vibration in the imaging system, which will normally be required to apply a stitching technique when using an area scan camera. However the technique is not required when using a line scan camera. Compared with the previous techniques, it has the advantages of simple hardware without moving mechanical parts - single exposure for obtaining three-dimensional information. A method using a high resolution line scan camera can be used in mass production to measure the bump height of wafers or the bump height of package substrates.