• The Journal of Pediatrics of Korean Medicine
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• v.16 no.2
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• pp.171-185
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• 2002

Objectives : The purpose of this study was to investigate the spine distortion and self-conscious pain in high school students. Method : Using the phase-shifting moire developed by KAIST(Korea Advanced Institute of Science and Technology) we measured the back surface distortion, and using questionnaire investigation, we investigated the self-conscious pain in 30 high school students(17 boy students and 13 girl students). Results : This study show that low back pain was most cases, and next headache, upper back pain, abdominal pain, neck pain, shoulder pain, leg pain, chest pain and gluteal pain. The ratio of each self-conscious pain was 90.0%, 86.7%, 83.3%, 83.3%, 80.0%, 76.7%, 66.7%, 33.3%, 33.3%, 30.0%. In remainder value of left and right shoulder, above of 3.0 were three students., above 2.0 to bellow 3.0 were 10 students, bellow 2.0 were 17 students. In remainder value of left and right gluteal, above of 2.0 was one students, above 1.0 to bellow 2.0 were 18 students, bellow 1.0 were 10 students. In remainder value of cervical vertical line to left and right axillae, above 4.0 was 1 student, above 3.0 to bellow 2.0 were 2 students, above 2.0 to bellow 3.0 were 3 students, above 1.0 to bellow 2.0 were 16 students, bellow 1.0 were 7 students. In remainder value of gluteal vertical line to left and right axillae, above 6.0 was 1 student, above 5.0 to bellow 6.0 were 7 students, above 4.0 to bellow 5.0 were 3 students, above 3.0 to bellow 4.0 were 2 students, above 2.0 to bellow 3.0 were 5 students, above 1.0 to bellow 2.0 were 7 students, bellow 1.0 were 5 students. In remainder value of cervical vertical line to gluteal vertical line, above 40 was 1 student, above 3.0 to bellow 4.0 were 4 students, above 3.0 to bellow 3.0 were 6 students, above 1.0 to bellow 2.0 were 8 students, bellow 1.0 were 11 students. Conclusion : It is suggested that the significant correlation exist between the spinal distortion and self-conscious pain. And we can find many cases as spinal distortion in high school students also. We have to study further more about juvenile postural distortion and it's prevention.

• The Journal of Korean Physical Therapy
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• v.15 no.4
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• pp.112-128
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• 2003

Since areas of pain and dysfunction of musculoskeletal typically suffered by the patients with back disorders spread all over the body, WBIP(GCM Program) for the primary treatment and management is required. The purpose of this study is to analyze if WBIP(GCM Program) based on the hyper/hypomobility pattern of Four Body Types can identify the effective treatment of back disorders and the effect on the postural balanced restoration of the spine and extremities. Non-specific back disorder is still a major reason for sick leave. And moreover, its been reported that there was often recurrence to the patients whose symptom had been diminished. As a WBIP(GCM Program) based on kinematic chain patterns of Four Body Types, this study gave a new information on the effective diagnosis, treatment and management of non-specific back disorders. 337 patients above the twenty-five years old with the non-specific back disorders at the hospital and oriental medical clinics at Kyungnam and Busan areas in South Korea from August 24th, 2000 to Feb 23rd, 2001 have randomly been assigned to four experimental groups such as Whole Body Intervention Program Group, Physical Therapy Group like modality treatments, Acupuncture-Treatment Group, and Placebo Control Group. According to intervention program applied to the each four group for three times per week(twelve times per 4weeks), as the time-series methods, we compared and evaluated the body status of the pretest with that of post treatment completion of four week, three month, and six month, respectively. As the analytical method of measurement, our researchers used the Moire Interferometry Unit and Postural Kit that could measure the postural balance of spine and extremities. The collection of data was performed in the designated hospital and oriental medical clinics. For the analysis of the data, the SPSS 10.0 package program was used. X2-test has been taken in order to compare and analyze characteristics and GPES of the patients in four experimental groups. Repeated Measure ANOVA and Tukey post hoc test has been adopted in order to compare the effects of the balanced restoration of the spine and extremities among four Groups categorized for this study. Statistical significance was accepted at the 0.05 level of confidence The effect of the balanced restoration on the spine and extremities of the patients with non-specific back disorders has been proved in all of the Groups. As for the restoration degree, however, WBIP(GCM Program) Group produced the highest effectiveness in terms of the fact that it had a dense moire in comparison with the other three Groups and that the Moires of both sides had the same level by the time(p<0.01). WBIP(GCM Program) based on four tilting types of scapular and ilium and hyper/hypomobility pattern took a higher effect on the balanced restoration of the spine and extremities through a whole body as well as the treatment of back disorders than the other three Groups which the usual remedy without classification of body type had been applied to.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.1
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• pp.684-692
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• 2016

In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.71-71
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• 2009

전자제품의 다양한 기능들의 융복합화 및 휴대 편의성 경향은 이제 더 이상 새로운 것이 아니다. 이러한 추세에 따라 전자부품들은 모듈화 되고, 휴대하기 용이해 지고 있다. 또한 다양한 제품 디자인에 적용하기 위해 제품에 장착되는 부품의 기구적 위치 배열의 한계 또한 제약 받고 있다. 따라서 최근의 전자부품은 모듈화 되고 있으며, 기구적 한계를 극복하기 위한 Flexible 모듈의 사용이 증가하고 있다. 또한 양산측면에서 Roll-to-Roll(R2R) 방식을 적용함으로써 생산성을 극대화 하고 있다. 이때 R2R 적용을 위해서는 제품이 굴곡 될 수 있도록 유연성이 보장되는 Bendable 전자모듈의 개발이 필수적으로 요구되고 있다. Flexible 기판은 더 이상 새로운 기술이 아니지만, Felxible 기판 내부에 칩이 내장되고, 회로가 형성되어 자체적으로 기능을 수행할 수 있도록 한 Bendable 전자모듈을 R2R 방식으로 제조하는 기술은 매우 새로운 접근이라 할 수 있다. 이러한 기술개발이 현실화 된다면, Wearable Electronics 및 Flexible Display 등 다양한 전자제품에 응용될 수 있을 것으로 기대된다. 그러나 이러한 제품의 상용화를 위해서는 Bendable 전자모듈에 대한 신뢰성이 확보되고, 제품으로써의 수명이 보증되어야 한다. 신규 개발되는 제품의 신뢰성 검증항목이나 수명평가 모델은 현재까지 제안되지 않고 있는 실정이다. 또한 다양한 사용 환경에서 고장(Failure) 발생을 유발하는 스트레스 인자(Stress Factor)를 도출함으로써, 가속시험 또는 신뢰성 검증을 위한 인가 스트레스를 선정할 수 있다. 그러나 이러한 고장물리를 기반으로 스트레스 인자를 해석한 결과는 아직 보고되고 있지 않다. 따라서 본 연구에서는 $50{\mu}m$ 두께의 Si Chip에 저항변화를 관찰하기 위한 회로를 형성한 후 폴리이미드 기판을 이용하여 Si Chip이 임베딩된 Bendable 전자모듈을 제작하였다. 전자모듈의 실사용 환경에서의 수명예측을 위한 사전단계로써 고장물리에 기반한 고장모드와 고장메카니즘을 해석하는 것이 최우선 수행되어야 하며, 이를 바탕으로 고장을 유발하는 스트레스 인자를 도출 하였다. 고장도출을 위해 시제품은 JEDEC J-STD-020C의 MSL시험, 고온가압시험, 열충격시험 및 고온저장시험을 각각 수행하였으며, 이로부터 발생된 각각의 고장유형을 분석함으로써 스트레스 인자를 도출하였다. 또한 모아레(Moire) 간섭계를 이용하여 제작된 샘플의 온도변화에 따른 변형해석을 수행하였고, 동시에 Half Symetry Model을 이용한 유한요소해석(FEA)을 수행하여 변형해석 및 스트레스 유발원인을 도출하였다. 이 결과로 부터 고장물리 기반의 고장해석과 Moire 분석 그리고 시뮬레이션 해석 결과를 바탕으로 Bendable 전자모듈의 고장유발 스트레스 인자를 해석할 수 있었다.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1990-1993
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• 2003

In this paper, we propose a technique for automatic spinal deformity detection from $moir\acute{e}$ topographic images. Normally the $moir\acute{e}$ stripes show symmetry as a human body is almost symmetric. According to the progress of the deformity of a spine, asymmetry becomes larger. Numerical representation of the degree of asymmetry is therefore useful in evaluating the deformity. First, displacement of local centroids and difference of gray values are evaluated statistically between the left- and the right-hand side regions of the $moir\acute{e}$ images with respect to the extracted middle line. We classify the moire images into two categories i.e., normal and abnormal cases from the features, employing discriminant analysis. An experiment was performed employing 1,200 $moir\acute{e}$ images and 85% of the images were classified correctly.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Journal of the Korean Society of Clothing and Textiles
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• v.27 no.2
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• pp.270-276
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• 2003

Methodology was suggested to analyze breast volume, base area of breast bulk. and surface area of breast using the 3D measurement system. Thirty-seven middle-aged (30s-40s) women wearing 80A brassiere were participated in this study. Image of the upper body was captured by Phase-shifting moire. The posture of the subject was adjusted to get the full image of the right breast. Rapidform 2001 was used for the analysis of the images. The mean breast volume was 547.0㎤ and mean base area of breast bulk was 235. I$\textrm{cm}^2$ It was also found that the volume(r=0.169) and surface area of breast(r=10.242) were loosely correlated with the circumference difference between top and under breast. Therefore, it is noted that current selection criterion of cup size based on the difference in the two kinds of breast circumference is inadequate. The result of this study is expected to contribute to the design of ergonomic brassiere as well as surgical operations in the medical field.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.12
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• pp.757-761
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• 2017

The computational fourier-transform moire (CFTM) method has been briefly explained and this method was used to perform strain analysis of a misfit dislocation in a strained $Si/Si_{0.55}Ge_{0.45}$ layer. An essential advantage of the CFTM method is that it does not require unwrapping, such that errors due to improper unwrapping can be excluded. The analysis results revealed that the Si layer was grown with tensile stress on $Si_{0.55}Ge_{0.45}$ and lattice constant of the Si layer along the growth direction was 1.9% smaller than that of $Si_{0.55}Ge_{0.45}$. On the other hand, strain of the misfit dislocation in the strained $Si/Si_{0.55}Ge_{0.45}$ layer was maximum at the dislocation core due to an extra half-plane and the $e_{xx}$ and $e_{yy}$ values were positive and negative, respectively, along the direction of a burgers vector.