• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.31 no.11
• /
• pp.1100-1107
• /
• 2007

In this study, a method to characterize material properties of adhesive that is used in a layered plates bonding process is developed by combined evaluation of experiment, simulation and optimization technique. A small bonded specimens of rectangular plate are prepared to this end, and put into a thermal loading conditions. $Moir{\acute{e}}$ interferomety is used to measure submicron displacements occurred during the process. The elevated temperature is chosen as control factors. FE analysis with constant values for the adhesive materials is also carried out to simulate the experiment. Significant differences are observed from the two results, in which the simulation predicts the monotonic increase of the bending displacement whereas the measurement shows decrease of the displacement at above $75^{\circ}C$. In order to minimize the difference of the two, material parameters of the adhesive at a number of different temperatures are posed as unknowns to be determined, and optimization is conducted. As a result, optimum material parameters are found that excellently matches the simulation and experiment, which are decreased with respect to the temperature.

• Journal of the Optical Society of Korea
• /
• v.19 no.2
• /
• pp.165-168
• /
• 2015

A simple method to determine the focal length of a lens using the Talbot image is presented. This method uses only one grating, requiring neither Moir$\acute{e}$ fringe analysis nor the angle between the gratings. The original Fourier transform was used to access the spectrum beyond the limitation set of the usual fast Fourier transform to determine the (de)magnification accurately enough to be used for the focal length. A set of Talbot images simulated numerically with the Fresnel diffraction integral was used to demonstrate the method. For focal lengths between 5550 mm and 5650 mm, the mean difference between the focal lengths determined from the Talbot images and the true values was 3.3 mm with the standard deviation of the difference being 3.8 mm. The true focal lengths can be recovered with an accuracy of 0.06%.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.10
• /
• pp.1377-1384
• /
• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.17-27
• /
• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.3
• /
• pp.37-44
• /
• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.17-28
• /
• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• International Journal of Aeronautical and Space Sciences
• /
• v.10 no.2
• /
• pp.86-94
• /
• 2009

This paper deals with the creation of a new, low-cost point/position tracking system that can measure deformations in engineering structures with simple commercially widespread cameras. Though point tracking systems do exist today, such as Stereo Pattern Recognition (SPR) and Projection Moir$\acute{e}$ Interferometry (PMI) systems, they are far too costly to use to analyze small, simple structures because complex optical components such as large flashes, high-resolution cameras and data acquisition systems with several computers are required. We developed a point tracking system using commercial cameras. This system used IR LEDs and commercial IR CCD cameras to minimize the interference posed by other extraneous light sources. The main algorithm used for this system is an optical point tracking algorithm, which is composed of the point extraction algorithm and the point matching algorithm for 3-D motion estimation. a series of verification tests were performed. Then, the developed point tracking system was applied to measure deformations of an acrylic plate under a mechanical load. The measured deformations of the acrylic plate matched well with the numerical analysis results. The results indicate that the developed point tracking system is reliable enough to measure continuous deformed shapes of various engineering structures.