• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.205-207
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• 2008

The new process for hybrid silicon thin film transistor (TFT) using DPSS laser has been developed for realizing both low-temperature poly-Si (LTPS) TFT and a-Si:H TFT on the same substrate as a backplane of active matrix liquid crystal display. LTPS TFTs are integrated on the peripheral area of the panel for gate driver integrated circuit and a-Si:H TFTs are used as a switching device for pixel in the active area. The technology has been developed based on the current a-Si:H TFT fabrication process without introducing ion-doping and activation process and the field effect mobility of $4{\sim}5\;cm^2/V{\cdot}s$ and $0.5\;cm^2/V{\cdot}s$ for each TFT was obtained. The low power consumption, high reliability, and low photosensitivity are realized compared with amorphous silicon gate driver circuit and are demonstrated on the 14.1 inch WXGA+ ($1440{\times}900$) LCD Panel.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.10 no.5
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• pp.7-12
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• 2010

The bandwidth of a Jerusalem AMC was investigated based on the equivalent circuit model. Using the circuit model and the derivative of the admittance(Y'), the relation between the bandwidth and various circuit parameters was analyzed. It was shown that the substrate thickness and permeability enhance the bandwidth whereas the loadings on FSS grid degrade the bandwidth. Among the two loadings, the capacitive loading had better bandwidth characteristics than the inductive loading. AMC with single polarization was suggested to relax the bandwidth degradation by the inductive loading.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.799-802
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• 2003

[ $LaNiO_3$ ](LNO) thin films were deposited on various substrates as Si and $Al_2O_3$ by sol-gel process using lanthanum nitrate and nickel acetate. The structure and orientation of the films were characterized by X-ray diffraction. The orientation factors of films on Si(100), Si(111), $SiO_2/Si(100)$ and $Al_2O_3$were 97%, 63%, 73%, and 24% respective. The conductivity was $7.6{\times}10^{-3}{\Omega}{\cdot}cm$ with 10 times coating at Si(100) substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.734-737
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• 2004

The metal-ferroelectric-semiconductor (MFS) structure is widely studied for nondestructive readout (NDRO) memory devices, but conventional MFS structure has a critical problem. It is difficult to obtain ferroelectric films like PZT on Si substrate without interdiffusion of impurities such as Pb, Ti and other elements. In order to solve these problems, the metal-ferroelectric-insulator-semiconductor (MFIS) structure has been proposed with a buffer layer of high dielectric constant such as MgO, $Y_2O_3$, and $CeO_2$. In this study, the etching characteristics (etch rate, selectivity) of MgO thin films were etched using $Cl_2/Ar$ plasma. The maximum etch rate of 85 nm/min for MgO thin films was obtained at $Cl_2$(30%)/Ar(70%) gas mixing ratio. Also, the etch rate was measured by varying the etching parameters such as ICP rf power, dc-bias voltage, and chamber pressure. Plasma diagnostics was performed by Langmuir probe (LP) and optical emission spectroscopy (OES).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.906-911
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• 2004

In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode. Considering these results, we fabricated p-i-n diodes on the high resistive($4k{\Omega}{\cdot}cm$) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of p-i-n diode can be decreased by the application of finger pattern has parallel resistance structure from $571\Omega$ to $393\Omega$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.297-297
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• 2010

Transparent conductive Oxide (TCO) is an essential material in the various optoelectronic applications as a transparent electrode, such as solar cells, flat panel displays and organic light emitting diodes. Currently, Indium tin oxide (ITO) is commonly used in industry due to its low electrical resistivity, high transmittance and high adhesion to substrate. However, ITO is expensive and should be prepared at high temperature, which makes it hard to use ITO in flexible devices. In this regard, Ga-doped ZnO is expected as an ideal candidate for replacing ITO.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.130-131
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• 2008

Chalcogenide glass has been known for many photo induced phenomena and superial electron / optical specific by structure flexibility, unique electronic configuration. It is become known to the greatest specific as photonic material medium that possible to perfect controlling by continuity and photo inducing direction of amorphous chalcogenide. In our experiment, we choose the amorphous As-Ge-Se-S and coming glass as a substrate. And then we have evaporated in the ${\sim}2{\times}10^{-6}$ Torr using a E-beam evaporator, completed thin film sample that have 1um thickness of As-Ge-Se-S 600 $\AA$, 10~5 $\AA$/s. At first, we let the change the angle between laser and sample by holography litho method and then, expect that satisfied conclusion which 2-dimension diffraction lattice manufacture and specifics by investing a He-Ne laser for 2000 seconds.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.37 no.6
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• pp.36-43
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• 2000

Three-Dimensional FDTD method is applied to analyze the dielectric resonator coupled with two microstrip lines. We model accurately the curved surface using Noriaki model. The frequency resolution is 106.46 MHz by the conventional FFT However it is not sufficient for determining its resonant frequency. So we introduce the Pad approximation and Stoer-Bulirsch method in order to have the high frequency resolution degree, 1.00 MHz. All results are compared with the measured data. As a result, we acquire the very precise result through the Pad approximation. And sinusoidal wave is applied. From the plot of the electric and magnetic field distribution, it is shown that the resonant mode is TE$_{01{\delta}}$ mode.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.285-288
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• 2007

박막형 태양전지 및 플렉서블 태양전지 기판으로 사용되는 금속기판의 우수성은 잘 알려져 있다. 그러나 상용 금속기판이 직면하고 있는 문제점을 보완하기 위해서 전주법으로 제조된 2원합금 금속포일을 개발하였으며, 박막형 및 플렉서블 태양전지의 기판재로 적용가능성을 확인하였다. 일반적으로 태양전지를 제조할 때 열 공정이 수행되며, 이때 기판재와 cell을 구성하는 반도체의 열팽창 계수 차이에 의한 열변형으로 결함이 발생될 수 있고, 태양전지 효율 및 수명을 저하시키는 원인이 될 수 있다. 이러한 원인이 될 수 있는 구성 재료간의 열팽창계수 차이에 의한 cell 의 변형량을 추정하기 위해 유한요소해석 방법을 사용하였다. 유한요소해석을 수행하기 위해 ALGOR 라는 해석 tool 을 사용하였다. 유한요소해석 수행에 사용된 상용 금속인 Mo, Ti, Al, SUS 포일과 전주법으로 제조된 2원합금 금속포일의 열팽창 계수는 실험을 통한 측정치이며, cell을 구성하는 반도체의 열팽창 계수와 열특성은 참고 문헌에 있는 자료들이다. 이 값들을 기반으로 cell 의 구성을 단순화시킨 가상의 태양전지가 제조 공정 온도에서 상온으로 냉각될 때의 열변형량을 계산하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.13-17
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• 2004

The PZT thin films are well-known material that has been widely studied for ferroelectric random access memory (FRAM). We etched the PZT thin films by $CF_4/(Cl_2+Ar)$ plasma and investigated improvement in etching damage by $O_2$ annealing. PZT thin films were etched for 1 min in an ICP using a gas mixture of $Cl_2$(80%)/Ar (20%) with 30% $CF_4$ addition. The etching conditions were fixed at a substrate temperature of $30^{\circ}C$, an rf power of 700 W, a dc-bias voltage of -200 V and a chamber pressure of 2 Pa. To improve the ferroelectric properties of PZT thin films after etching, the samples were annealed for 10 min at various temperatures in $O_2$ atmosphere. After $O_2$ annealing, the remanent polarization, fatigue, and the leakage current were gradually recovered to the characteristics of the as-deposited film, according as the temperature increased.