• Title/Summary/Keyword: Mo substrate

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Characteristics of Fatigue Crack Initiation and Fatigue Strength of Nitrided 1 Cr- 1Mo-0.25V Turbine Rotor Steels

  • Suh, Chang-Min;Hwang, Byung-Won;Murakami, Ri-Ichi
    • Journal of Mechanical Science and Technology
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    • v.16 no.8
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    • pp.1109-1116
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    • 2002
  • To investigate the effect of nitriding layer on both fatigue crack initiation and fatigue life, turbine rotor steel ( IC.- 1Mo-0.25V steel) specimens were nitrided by the nitemper method and then put to a rotary bending fatigue test at room and elevated temperatures. In nitriding, temperature and time were controlled to obtain a different nitrided thickness. Microstructure analysis, micro-Victors hardness test, and scanning electron microscope observation were carried out for evaluating experiments. In results, the fatigue cracks of nitrided specimens were initiated at inclusion near the interface between nitrided layer and substrate, which showed fish-eye type appearance in fractograph. The fatigue life of nitrided specimens at every temperature was prolonged compared to that of the non-nitrided. However, there was not observable improvement in fatigue characteristics with the increase of a nitrided thickness.

Wear Resistance Characteristics of Iron Weld Overlays by Composite Chromium Powders (복합 크롬 분말에 의한 철계 용접 오버레이의 내마모 특성)

  • 김종철;박경채;최창옥
    • Journal of Welding and Joining
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    • v.19 no.5
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    • pp.506-511
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    • 2001
  • Weld overlay has been developed to improve the property of material surface which is used in the severe environment. Weld overlay is the process which uses an arc heat and welds different composition of alloy on the substrate for the improvements of heat resistance and wear resistance. Weld overlay has a lot of advantages which are high hardness, good processing efficiency, easy controlling of layer thickness, good quality and low cost. In this study, weld overlay was performed by MAG welding on the base metal(SS400) with filler metal which contain composite powders(Cr+C+Mn+Mo+NbC) and solid wire(JIS-YGW11). Characterization of hardness and wear resistance were analyzed by EDS, EPMA, XRD and observations of microstructure were performed to investigate characteristics of overlays. The experimental results of overlaid specimens manufactured with Cr+C+Mn+Mo+NbC powders were obtained as fellows. ${\alpha}-phase$, M(Fe, Cr)3C and NbC of overlays were increased with decreasing the wire feed rates and increasing powder feed rates. Also the hardness of overlays were increased and the specific wear were decreased.

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Laser Micromachining of Submicron Aperture for Electronbeam Microcolumn Application using Piezo Q-Switched Nd:YAG Laser

  • S.J. Ahn;Kim, D.W.;Park, S.S.
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.78-78
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    • 1999
  • Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

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Electrode Thickness Optimization at Full Color OLED and Analysis of Power Consumption

  • Park, Sung-Joon;Kim, Ok-Tae;Kim, Hee-Je
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.3
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    • pp.106-110
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    • 2004
  • The operating condition of the OLED (organic light-emitting diode) is very sensitive to electrode thickness properties. The electrode thickness is a significant issue in the construction of OLEDs because of its transparency, high conductivity and high efficiency as an injector into organic materials. We carried out a systematic study to optimize the electrode thickness conditions in Indiumtin oxide (ITO), Molybdenum (Mo) and Aluminum (Al). Further, we measured electrode thickness under standard conditions [ITO 1500$\AA$, Mo 2600$\AA$, Al 1500$\AA$]. We also evaluated power consumption. In addition, we analyzed substrate uniformity with IVL measurement results. From these results, it is known that the electrode thickness should be optimized in order to accomplish optimal power efficiency.

Thermal treatment effects of sputtered ITO(glass) (Sputtered ITO(glass)의 열처리 효과)

  • 김호수;정순원;구경완
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.554-557
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    • 2001
  • Indium Tin Oxide(ITO) thin films have been fabricated by the dc magnetron sputtering technique with a target of a mixture In$_2$O$_3$(90mo1%) and SnO$_2$(10mo1%). We prepared ITO thin films with substrate temperature 200 to 400$^{\circ}C$ and annealing temperature 200 to 500$^{\circ}C$ food polycrystalline-structured ITO films with a low electrical resistivity of 3.4${\times}$10$\^$-4/ Ω$.$cm have been obtained. The visible light transmittance of all obtained films was over 80 %.

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Electrical Properties of (Pb, LaITiO$_3$ Thin Films fabricated by Sol-Gel Processing (Sol-Gel 법에 의한 (Pb, La)TiO$_3$ 박막의 전기적 특성)

  • 구본혁;박정흠;장낙원;마석범;박창엽
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.48-51
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    • 1997
  • (Pb. La)TiO$_3$ thin films were fabricated by sol-gel Processing and spin-coated on the Pt substrate. The spin-coated PLT films were sintered at 75$0^{\circ}C$ for 5min by rapid thermal ann La content dependence of the electrical properties of the PLT thin films are discussed. Wit La mole% from 20 to 36mo1e%. the dielectric constant of the PLT thin films decreased f 570. P-E hysteresis loops changed from ferroelectric to paraelectric. and the charge storage charging time decreased. The Curie Point decreased with increasing La content. The leak density also decreased and La 36mo1% species shows mood characteristics less than 10- electric field 500 (KV/cm) Because of the broad range of composition-controlled ferroelectric PLT thin films are suitable for memory application.

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Joule-heating Induced Crystallization (JIC) of Amorphous Silicon Films

  • Ko, Da-Yeong;Ro, Jae-Sang
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.101-104
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    • 2018
  • An electric field was applied to a Mo conductive layer in the sandwiched structure of $glass/SiO_2/Mo/SiO_2/a-Si$ to induce Joule heating in order to generate the intense heat needed to carry out the crystallization of amorphous silicon. Polycrystalline silicon was produced via Joule heating through a solid state transformation. Blanket crystallization was accomplished within the range of millisecond, thus demonstrating the possibility of a new crystallization route for amorphous silicon films. The grain size of JIC poly-Si can be varied from few tens of nanometers to the one having the larger grain size exceeding that of excimer laser crystallized (ELC) poly-Si according to transmission electron microscopy. We report here the blanket crystallization of amorphous silicon films using the $2^{nd}$ generation glass substrate.

CO Gas Sensing Characteristic of ZnO Thin Film/Nanowire Based on p-type 4H-SiC Substrate at 300℃ (P형 4H-SiC 기판에 형성된 ZnO 박막/나노선 가스 센서의 300℃에서 CO 가스 감지 특성)

  • Kim, Ik-Ju;Oh, Byung-Hoon;Lee, Jung-Ho;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.2
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    • pp.91-95
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    • 2012
  • ZnO thin films were deposited on p-type 4H-SiC substrate by pulsed laser deposition. ZnO nanowires were formed on p-type 4H-SiC substrate by furnace. Ti/Au electrodes were deposited on ZnO thin film/SiC and ZnO nanowire/SiC structures, respectively. Structural and crystallographical properties of the fabricated ZnO thin film/SiC and ZnO nanowire/SiC structures were investigated by field emission scanning electron microscope and X-ray diffraction. In this work, resistance and sensitivity of ZnO thin film/SiC gas sensor and ZnO nanowire/SiC gas sensor were measured at $300^{\circ}C$ with various CO gas concentrations (0%, 90%, 70%, and 50%). Resistance of gas sensor decreases at CO gas atmosphere. Sensitivity of ZnO nanowire/SiC gas sensor is twice as big as sensitivity of ZnO thin film/SiC gas sensor.

Deposition of Diamond Film by Hydrogen-oxyacetylene Combustion Flame (수소-산소아세틸렌 연소염에 의한 다이아몬드 필름의 증착)

  • Ko, Chan-kyoo;Kim, Ki-young;Park, Dong-wha
    • Applied Chemistry for Engineering
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    • v.8 no.1
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    • pp.84-91
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    • 1997
  • Diamond film was deposited on Mo substrate at atmospheric pressure using a combustion flame apparatus with the addition of $H_2$. With the substrate temperature, the nucleation density of the substrate was increased. At temperatures above $1000^{\circ}C$, some of diamond was partly converted into graphite and etched by hydrogen atoms. With an increase of the $C_2H_2/O_2$ ratio, the nucleation density was increased. But crystals were cauliflower-shaped and a large number of amorphous carbon were deposited. With the addition of $H_2$, the nucleation density of diamond was increased by the improvement of surface activity. Diamond film of high crystallinity was deposited by etching amorphous carbon. With an increase of deposition time, the thickness of diamond film was increased.

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Adhesion Improvement for Copper Process in TFT-LCD

  • Tu, Kuo-Yuan;Tsai, Wen-Chin;Lai, Che-Yung;Gan, Feng-Yuan;Liau, Wei-Lung
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1640-1644
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    • 2006
  • The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

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