• Title/Summary/Keyword: Mo Mask

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Development of New LTPS Process

  • Yi, Chung;Park, Kyung-Min;Choi, Pil-Mo;Kim, Ung-Sik;Kim, Dong-Byum;Kim, Chi-Woo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.1024-1026
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    • 2004
  • We have developed the five mask $PMOS^1$ and the six mask CMOS process architecture for poly-Si TFT. In order to have a competitive process with that for a-Si TFT, the simple co-planar electrode structure whose data line electrode and pixel electrode are on the same plane was adopted. In addition, RGB + White four color $technology^2$ were applied to achieve high aperture ratio and transmittance. Using the aforementioned process architecture and four color technology, 2.0 inch qCIF transmissive micro-reflectance (TMR) device was successfully fabricated.

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The evaluation of lens absorbed dose according to the Optimold for whole brain radiation therapy (전뇌 방사선치료 시 Optimold에 따른 수정체의 흡수선량 평가)

  • Yang, Yong Mo;Park, Byoung Suk;Ahn, Jong Ho;Song, Ki Won
    • The Journal of Korean Society for Radiation Therapy
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    • v.26 no.1
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    • pp.77-81
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    • 2014
  • Purpose : In the current whole brain Radiation Therapy, Optimold was used to immobilize the head. However, skin dose was increased about 22% due to the scattering radiation by the Optimold. Since the minimum dose causing cataracts was 2 Gy, it could be seen that the effects were large especially on the lens. Therefore, in the whole brain Radiation Therapy, it was to compare and to evaluate the lens absorbed dose according to the presence of Optimold in the eyeball part. Materials and Methods : In order to compare and to evaluate the lens absorbed dose according to the presence of Optimold in the eyeball part, the Optimold mask was made ??up to 5mm bolus on the part of the eye lens in the human model phantom (Anderson Rando Phantom, USA). In the practice treatment, to measure the lens dose, the simulation therapy was processed by placing the GafChromic EBT3 film under bolus, and after the treatment plan was set up through the treatment planning system (Pinnacle, PHILIPS, USA), the treatments were measured repeatedly three times in the same way. After removing the Optimold mask in the eyeball part, it was measured in the same way as above. After scanning the film and measuring the dose by using the Digital Flatbed Scanner (Expression 10000XL, EPSON, USA), the doses were compared and evaluated according to the presence of Optimold mask in the eyeball part. Results : When there was the Optimold mask in the eyeball part, it was measured at $10.2cGy{\pm}1.5$ in the simulation therapy, and at $24.8cGy{\pm}2.7$ in the treatment, and when the Optimold mask was removed in the eye part, it was measured at $12.9cGy{\pm}2.2$ in the simulation therapy, and at $17.6cGy{\pm}1.5$ in the treatment. Conclusion : In case of removing the Optimold mask in the eyeball part, the dose was increased approximately 3 cGy in the simulation therapy and was reduced approximately 7 cGy in the treatment in comparison to the case that the Optimold mask was not removed. During the whole treatment, since the lens absorbed dose was reduced about 27%, the chance to cause cataracts and side effects was considered to be reduced due to decrease of the absorbed dose to the eye lens which had the high sensitivity on the radiation.

Liquid crystal display panel fabricated in dual mode

  • Wang, Yaping;Mo, Aiping;Jiang, Qingfeng
    • Journal of Information Display
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    • v.13 no.1
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    • pp.17-20
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    • 2012
  • The current panels for liquid crystal display (LCD) TV sets are all characterized by pins placed on two sides. To manufacture one type of panel, a dedicated mask is needed, and the production line should be started once. Moreover, the whole panel needs to be removed if a dead pixel is found. If the panel, however, will first be fabricated with pins placed on four sides and then divided by a cross-cut into four equal-sized panels with pins placed on two sides, one set of masks can be used to manufacture two types of LCD panels, which was referred to by the authors as dual mode. In this paper, the concept of the dual mode and its differences from the conventional way of producing panels are introduced. Its advantages in boosting production efficiency, improving the product's good rate, and lowering the production cost are also described based on case studies. Of particular importance is the fact that the dual mode is very suitable for the trial production of very-large-area LCD TV sets.

Microfluidic LOC System (Microfluidic LOC 시스템)

  • Kim, Hyun-Ki;Gu, Hong-Mo;Lee, Yang-Du;Lee, Sang-Yeol;Yoon, Young-Soo;Ju, Byeong-Kwon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.906-911
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    • 2004
  • In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode. Considering these results, we fabricated p-i-n diodes on the high resistive($4k{\Omega}{\cdot}cm$) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of p-i-n diode can be decreased by the application of finger pattern has parallel resistance structure from $571\Omega$ to $393\Omega$.

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Technological Trends in a local anodization (국부적 양극산화 기술 동향)

  • Kwang-Mo Kang;Sumin Choi;Yoon-Chae Nah
    • Journal of the Korean institute of surface engineering
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    • v.56 no.2
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    • pp.115-124
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    • 2023
  • Anodization is an electrochemical process that electrochemically converts a metal surface into an oxide layer, resulting in enhanced corrosion resistance, wear resistance, and improved aesthetic appearance. Local anodization, also known as selective anodization, is a modified process that enables specific regions or patterns on the metal surface to undergo anodization instead of the entire surface. Several methods have been attempted to produce oxide layers via localized anodic oxidation, such as using a mask or pre-patterned substrate. However, these methods are often intricate, time-consuming, and costly. Conversely, the direct writing or patterning approach is a more straightforward and efficient way to fabricate the oxide layers. This review paper intends to enhance our comprehension of local anodization and its potential applications in various fields, including the development of nanotechnologies. The application of anodization is promising in surface engineering, where the anodic oxide layer serves as a protective coating for metals or modifies the surface properties of materials. Furthermore, anodic oxidation can create micro- and nano-scale patterns on metal surfaces. Overall, the development of efficient and cost-effective anodic oxidation methods is essential for the advancement of various industries and technologies.

Decimation-in-time Search Direction Algorithm for Displacement Prediction of Moving Object (이동물체의 변위 예측을 위한 시간솎음 탐색 방향 알고리즘)

  • Lim Kang-mo;Lee Joo-shin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.2
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    • pp.338-347
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    • 2005
  • In this paper, a decimation-in-time search direction algorithm for displacement prediction of moving object is proposed. The initialization of the proposed algorithm for moving direction prediction is performed by detecting moving objects at sequential frames and by obtaining a moving angle and a moving distance. A moving direction of the moving object at current frame is obtained by applying the decimation-in-time search direction mask. The decimation-in-tine search direction mask is that the moving object is detected by thinning out frames among the sequential frames, and the moving direction of the moving object is predicted by the search mask which is decided by obtaining the moving angle of the moving object in the 8 directions. to examine the propriety of the proposed algorithm, velocities of a driving car are measured and tracked, and to evaluate the efficiency, the proposed algorithm is compared to the full search algorithm. The evaluated results show that the number of displacement search times is reduced up to 91.8$\%$ on the average in the proposed algorithm, and the processing time of the tracking is 32.1ms on the average.

Implementation of AI-based Object Recognition Model for Improving Driving Safety of Electric Mobility Aids (전동 이동 보조기기 주행 안전성 향상을 위한 AI기반 객체 인식 모델의 구현)

  • Je-Seung Woo;Sun-Gi Hong;Jun-Mo Park
    • Journal of the Institute of Convergence Signal Processing
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    • v.23 no.3
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    • pp.166-172
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    • 2022
  • In this study, we photograph driving obstacle objects such as crosswalks, side spheres, manholes, braille blocks, partial ramps, temporary safety barriers, stairs, and inclined curb that hinder or cause inconvenience to the movement of the vulnerable using electric mobility aids. We develop an optimal AI model that classifies photographed objects and automatically recognizes them, and implement an algorithm that can efficiently determine obstacles in front of electric mobility aids. In order to enable object detection to be AI learning with high probability, the labeling form is labeled as a polygon form when building a dataset. It was developed using a Mask R-CNN model in Detectron2 framework that can detect objects labeled in the form of polygons. Image acquisition was conducted by dividing it into two groups: the general public and the transportation weak, and image information obtained in two areas of the test bed was secured. As for the parameter setting of the Mask R-CNN learning result, it was confirmed that the model learned with IMAGES_PER_BATCH: 2, BASE_LEARNING_RATE 0.001, MAX_ITERATION: 10,000 showed the highest performance at 68.532, so that the user can quickly and accurately recognize driving risks and obstacles.

Implementation of AI-based Object Recognition Model for Improving Driving Safety of Electric Mobility Aids (객체 인식 모델과 지면 투영기법을 활용한 영상 내 다중 객체의 위치 보정 알고리즘 구현)

  • Dong-Seok Park;Sun-Gi Hong;Jun-Mo Park
    • Journal of the Institute of Convergence Signal Processing
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    • v.24 no.2
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    • pp.119-125
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    • 2023
  • In this study, we photograph driving obstacle objects such as crosswalks, side spheres, manholes, braille blocks, partial ramps, temporary safety barriers, stairs, and inclined curb that hinder or cause inconvenience to the movement of the vulnerable using electric mobility aids. We develop an optimal AI model that classifies photographed objects and automatically recognizes them, and implement an algorithm that can efficiently determine obstacles in front of electric mobility aids. In order to enable object detection to be AI learning with high probability, the labeling form is labeled as a polygon form when building a dataset. It was developed using a Mask R-CNN model in Detectron2 framework that can detect objects labeled in the form of polygons. Image acquisition was conducted by dividing it into two groups: the general public and the transportation weak, and image information obtained in two areas of the test bed was secured. As for the parameter setting of the Mask R-CNN learning result, it was confirmed that the model learned with IMAGES_PER_BATCH: 2, BASE_LEARNING_RATE 0.001, MAX_ITERATION: 10,000 showed the highest performance at 68.532, so that the user can quickly and accurately recognize driving risks and obstacles.

Optimization of Glass Wafer Dicing Process using Sand Blast (Sand Blast를 이용한 Glass Wafer 절단 가공 최적화)

  • Seo, Won;Koo, Young-Mo;Ko, Jae-Woong;Kim, Gu-Sung
    • Journal of the Korean Ceramic Society
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    • v.46 no.1
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    • pp.30-34
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    • 2009
  • A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

Deposition of $SiC_xN_y$ Thin Film as a Membrane Application

  • Huh, Sung-Min;Park, Chang-Mo;Jinho Ahn
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.1
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    • pp.39-43
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    • 2001
  • $SiC_{x}N$_{y}$ film is deposited by electron cyclotron resonance plasma chemical vapor deposition system using $SiH_4$(5% in Ar), $CH_4$ and $N_2$. Ternary phase $SiC_{x}N$_{y}$ thin film deposited at the microwave power of 600 W and substrate temperature of 700 contains considerable amount of strong C-N bonds. Change in $CH_4$flow rate can effectively control the residual film stress, and typical surface roughness of 34.6 (rms) was obtained. Extreme]y high hardness (3952 Hv) and optical transmittance (95% at 633 nm) was achieved, which is suitable for a LIGA mask membrane application.

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