• Korean Journal of Optics and Photonics
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• v.22 no.6
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• pp.262-268
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• 2011

MIRIS(Multi-purpose Infra-Red Imaging System) is the main payload of the STSAT-3(Korea Science and Technology Satellite. 3), which is being developed by KASI(Korea Astronomy & Space Institute). EOC(Earth Observation Camera), which is one of two infrared cameras in MIRIS, is the camera for observing infrared rays from the Earth in the range of $3{\sim}5{\mu}m$. The optical system of the EOC is a Cassegrain prescription with aspheric primary and secondary mirrors, and its aperture is 100mm. A ring type flexure supports the EOC primary mirror with pre-loading in order to withstand expected load due to the shock and vibration from the launcher. Here we attempt to use the same mechanism by which a retainer supports the lens. Through opto-mechanical analysis it was confirmed that the EOC primary mirror is effectively supported.

• Korean Journal of Optics and Photonics
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• v.18 no.6
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• pp.452-460
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• 2007

Ultra-low loss ZERODUR and fused silica mirrors were manufactured and their light scattering characteristics were investigated. For this purpose, ZERODUR and fused silica substrates were super-polished by the bowl feed method. The surface roughness were 0.292 ${\AA}$ and 0.326 ${\AA}$ in rms for ZERODUR and fused silica, respectively. To obtain the high reflectivity, 22 thin film layers of $SiO_2$ and $Ta_2O_5$ were deposited by Ion Beam Sputtering. The measured light scattering of ZERODUR and fused silica mirror were 30.9 ppm and 4.6 ppm, respectively. This shows that the substrate surface roughness is not the only parameter which determines the light scattering of the mirror. In order to investigate the mechanism for additional light scattering of the ZERODUR mirror, the surface roughness of the mirror was measured by AFM and was found to be 2.3 times higher than that of the fused silica mirror. It is believed that there is some mismatch at the interface between the substrate and the first thin film layer which leads to the increased mirror surface roughness. To clarify this, the contact angle measurements were performed by SEO 300A, based on the Giriflaco-Good-Fowkes-Young method. The fused silica substrates with 0.46 ${\AA}$ in its physical surface roughness shows lower contact angle than that of the ZERODUR substrate with 0.31 ${\AA}$. This indicates that the thin film surface roughness is determined by not only its surface roughness but also the surface energy of the substrate, which depends on the chemical composition or crystalline orientation of the materials. The surface energy of each substrate was calculated from a contact angle measurement, and it shows that the higher the surface energy of the substrate, the better the surface roughness of the thin film.

• Journal of the Korea Society of Computer and Information
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• v.19 no.12
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• pp.31-37
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• 2014

In this paper, to compensate the degraded performance in high-resolution infrared sensor due to assembling error, the influence of each component was evaluated through the sensitivity analysis of lens assembly, axis mirror, and detector and also suggested detector tilt mechanism for compensation. 3 detector tilt mechanisms were investigated. The first one is 'Shim plate' method which is applying shim on installing plane. The second one is 'Tilting screw' method that is using tilt screw for adjusting detection plane. The last one is 'Micrometer head' method that is installing micrometer on detection plane and acquiring quantitative data. Based on the investigation result, 'Tilting screw' method was applied due to ease of user control, small volume, and real-time controllability, thereby we could acquire high-resolution infrared images. The research result shows that the tilting mechanism is necessary technology for the implementation of high-resolution infrared imaging system.

• East Asian Economic Review
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• v.24 no.4
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• pp.313-336
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• 2020

In this paper, I review evidence on changing global specialization in labor-intensive exporting. Production of apparel, footwear, furniture, and related products are how many low-income countries first enter export manufacturing. Just as China's rise as a powerhouse in these goods supplanted a role previously occupied by the East Asian Tigers, the world may again be on the cusp of significant change in where labor-intensive goods are produced. China's prowess in these sectors peaked in the early 2010s; its share in their global exports, while still substantial, is now in decline. Mechanisms through which the global economy may adjust to China's graduation into more technologically sophisticated activities include expanded labor-intensive export production in other emerging economies and labor-saving technological change in products currently heavily reliant on less-educated labor. Available evidence suggests that the first mechanism is operating slowly and the second hardly at all. As a third mechanism, China may in part replace itself by moving labor-heavy factories out of densely populated and expensive coastal cities and into the country's interior. Such a transition, though still in its infancy, would mirror the decentralization of manufacturing production in the U.S. and Europe, which occurred after World War II.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.3
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• pp.41-46
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• 2008

Generally optical components are fabricated by grinding, lapping and polishing processes. Those processes take long time to obtain optical high surface quality. In the case of large optical components, the on-machine measurement is strongly recommended because the workpiece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm mechanism which can be used for on-machine measurement of a surface profile with a sensing probe end-effect, and also for grinding or lapping the surface with a corresponding tool. The measuring accuracy and uncertainty using a swing arm type profilometer have been studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $5{\mu}m$. Those inspection data are provided for correcting the residual figuring error in next processes.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.25-30
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• 1997

In recent years, grinding techniques for precision machining of astainless steel used in shaft, screw parts and clear value have been improved by using superabrasive wheel and precision grinding machine. The completion of optimum dressing of superabrasive wheel makes possible the effective percision grinding of stainless steel. However, the present dressing system cannot have control of optimum dressing of the superabrabive wheel. In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This system can carry out optimum in-process dressing of superabrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of stainless steel(SUS304).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.5
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• pp.29-37
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• 1998

In recent years, grinding techniques for precision machining of stainless steel used in shaft, screw parts and clear value have been improved by using the superabrasive wheel and precision grinding machine. The completion of optimum dressing of superabrasive wheel makes possible the effective precision grinding of stainless steel. However, the present dressing system cannot have control of optimum dressing of the superabrasive wheel. In this study, a new system and the grinding mechanism of optimum in-process dressing of superabrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of stainless steel (STS304)

• Journal of Biosystems Engineering
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• v.24 no.1
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• pp.67-74
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• 1999

A prototype cut-flower sorter was developed and tested for its performance with five varieties of roses. Support plates driven by a chain mechanism transported the roses into an image inspection chamber. Color image processing algorithms were developed to evaluate the length, thickness, and straightness of stem and color, height, and maturity of bud. The average absolute errors of the system for the measurements of stem length, stem thickness, and height of bud were 19.7 mm, 0.5 mm, and 3.8 mm, respectively. The results of classification by the sorter were compared with those of a human inspector for straightness of stem and maturity of bud. The classification error for the straightness of stem was 8.6%, when both direct image and reflected image by a mirror were analyzed. The accuracy in classifying the maturity of bud varied among the varieties, the smallest for‘Nobless’(1.5%) and the largest for‘Rote Rose’(13.5%). The time required to process a rose averaged 2.06 seconds, equivalent to the capacity of 1,600 roses per hour.

• Journal of the Korean Chemical Society
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• v.36 no.2
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• pp.329-334
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• 1992

Ultrasonic absorption was measured in bovine serum albumin (BSA) aqueous solution (50 g/l) in the frequency range from 100 kHz to 1600 MHz at neutral pH. Three experimental techniques were used to cover the wide frequency range : plano-concave resonator, conventional Bragg reflection, and high-resolution Bragg reflection methods. The absorption spectrum at neutral pH fitted the relaxation curve well using the distribution function of a mirror image of Davidson-Cole function. The relaxaition behavior was interpreted in terms of various degree of hydration of BSA molecules.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.1
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• pp.13-16
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• 2000

Progress in Si crystal and wafer technologies is discussed on single crystal growth, wafer fabrication, epitaxial growth, gettering, 300 mm and SOI. As for bulk crystal growth, the mechanism of grown-in defects (voids) formation, the succes of grown-in defect free crystal growth technology and nitrogen doped crystal are shown. New wafer fabrication technologies such as both-side mirror polishing and etchingless process have been developed. The epitaxial growth of SiGe/Si heterostructure for high speed bipolar device is treated. Gettering technology under low temperature process such as RTP is important, and also it is shown that IG effect for Ni could be predicted using computer simulation of precipitate density and size. The development of 300 mm wafer and SOI has made progress steadily.