• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.353-358
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• 2000

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

• 설비공학논문집
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• 제13권1호
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• pp.18-24
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• 2001

Woven wire wick is very effective structure because of its easiness to insert inside of pipe for a miniature heat pipe. The present study was conducted to investigate the effect of the effective flow passage with respect to wire helix angle. Also effective thermal conductivity were examined by defining mean porosity considering effective liquid flow passages. Effective heat transfer area is varied with respect to wire helix angle, and in the range of $\thet=60~65^{\circ}C$, heat transfer area is decreased about 15~20%. Permeability of woven wire wick shows similar value of 200 mesh screen wick. And comparison of experimental results on effective thermal conductivity shows a fairly good agreement with the analytical results.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 12th Asian Congress of Fluid Mechanics
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• pp.42.5-42.5
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• 2008

• 설비공학논문집
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• 제12권3호
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2142-2147
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• 2007

Experimental study was conducted to evaluate the performance of a miniature loop heat pipe (MLHP) with non-inverted meniscus type capillary structure. All parts of MLHP in this study were made of copper including the capillary structure and the distilled water was used as a working fluid of MLHP. The outer diameter of evaporator was 9 mm and its length was 119 mm. The effective pore size of the capillary structure was 30 micron and its porosity was 60%. The vapor transport line, the liquid transport line and the condenser were consisted of single 4.0 mm copper tube. The distance between the evaporator and the condenser region was 200 mm and the length of the loop was 969 mm. This MLHP was operated successfully at any orientation but the gravity highly influenced the thermal performance of the MLHP. The maximum thermal load was 130 watts at the bottom heat mode and the 20 watts at the top heat mode.

• 동력기계공학회지
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• 제17권2호
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• pp.70-77
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• 2013

An experimental study was carried out to understand the heat transfer performance of a miniature loop heat pipes using water-based copper nanoparticles suspensions as the working fluid. The suspensions consisted of deionized water and copper nanoparticles with an average diameter of 80 nm. Effects of the cupper mass concentration and the operation pressure on the average evaporation and condensation heat transfer coefficients, the critical heat flux and the total heat resistance of the mLHPs were investigated and discussed. The pressure frequency also depends upon the evaporator temperature which has been maintained from $60^{\circ}C$ to $90^{\circ}C$. The Investigation shows 60% filling ratio gives the highest inside pressure magnitude of highest number pressure frequency at any of setting of evaporator temperature and 5wt% results the lowest heat flow resistance.

• International Journal of Air-Conditioning and Refrigeration
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• 제15권2호
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• pp.70-77
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• 2007

As electric and mechanical devices have been miniaturized and highly integrated, heat generation per unit volume has been greatly increased. Therefore, effective cooling methods for micro and miniature systems have emerged as critical issues nowadays and a lot of studies have been carried out to find an optimum cooling strategy. This paper reviews recent researches on the cooling technologies which are mainly based on micro-fabrication processes. Design, development, experiments and numerical analysis of various cooling devices are discussed and their characteristics, problems and advantages are compared.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2005년도 하계학술발표대회
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• pp.123-123
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• 2005

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.572-578
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• 2001

This study is to research the heat transfer characteristics in copper-water heat pipes with screen wick, #100. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size is smaller than before. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle ${-6}^{\circ}$, #100 2layer screen mesh is shown the best heat transfer performance.