• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of Korean Society of Archives and Records Management
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• v.19 no.4
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• pp.1-33
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• 2019

The key to the long-term preservation of electronic records is the long-term retention of the bitstream that contains the original functional attributes and appearances of the electronic records that were originally created and utilized. Considering economic and technical aspects, most of the major domestic and foreign archives have adopted a migration strategy that allows conversion to a new format depending on the stability and reliability of the format containing the original bitstream. However, as the type of electronic records varies and its scope continuously expands, several problems arise if a single migration strategy is observed. Therefore, the applicability of the emulation strategy is examined in this paper to reproduce the system and application environment where electronic records are created and utilized. As such, electronic records can be maintained without any changes in the bitstream by utilizing cloud computing technology.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.7
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• pp.993-1000
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• 2002

In this paper, we design the CORBA-based Mobile Agent Model (CMAM) which has the capability of the efficient work processing in distributed environment through sensing network traffic and searching the optimal path for migration nodes of mobile agent. In case existing mobile agent model is given various works from user, the network overhead and traffic are increased by increasing of execution module size. Also, if it happens a large quantity of traffics due to migration of nodes according to appointment of the passive host(below node) routing schedule by user, it needs much cost for node search time by traffic. Therefore, in this paper, we design a new mobile agent m()del that assures the reliability of agent's migration through dynamic act on the specific situation according to appointment of the active routing schedule and can minimize agent's work processing time through optimal path search. The proposed model assigns routing schedule of the migration nodes actively using an extended MAFFinder. Also, for decreasing overhead of network by agent's size, it separates the existing mobile agent object by mobile agent including only agent calling module and push agent with work executing module based on distributed object type of CORBA. Also, it reduces the required time for round works of mobile agent through the optimal path search of migration nodes.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.550-554
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• 2002

In this paper, we design the CORBA-based Mobile-Agent Model (CMAM) which has the capability of the efficient work processing in distributed environment through sensing network traffic and searching the optimal path for migration nodes of mobile agent. In case existing mobile agent model is given various works from user, the network overhead and traffic are increased by increasing of execution module size. Also, if it happens a large quantity of traffics due to migration of nodes according to appointment of the passive host(node) muting schedule by user, it needs much cost for node search time by traffic. Therefore, in this paper, we design a new mobile agent model that assures the reliability of agent's migration through dynamic act on the specific situation according to appointment of the active routing schedule and can minimize agent's work processing time through optimal path search. The proposed model assigns routing schedule of the migration nodes actively using an extended MAFFinder. Also, for decreasing overhead of network by agent's size, it separated by mobile agent including oかy agent calling module and push agent with work executing module based on distributed object type of CORBA. Also, it can reduce the required time for round works of mobile agent through the optimal path search of migration nodes.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.12 no.2
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• pp.229-237
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• 1992

Series system reliability analysis of non-reactive contaminant transport is performed in a two dimensional horizontal domain with two different limit state functions: (1) concentration threshold and (2) exposure time threshold. The transient source transport model is combined with the system reliability model to evaluate the probability that a specified maximum concentration at a node of interest would be exceeded or that a moderate concentration would exceed some exposure limit over a given period of time. The results give probabilities of exceedence greater than probability of each component and they tend to be dominanted by the component with larger probability. Transverse dispersivity turns out to be an important parameter in addition to hydraulic conductivity in a two-dimensional contaminant transport model with transient source. System sensitivity is found to reflect the corresponding sensitivity of both components, with the component with larger probability having a greater influence.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.10
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• pp.2359-2368
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• 2013

In this paper, an IRD (internal read data) circuit preventing the reentry into the read mode while keeping the read-out DOUT datum at power-up even if noise such as glitches occurs at signal ports such as an input signal port RD (read) when a power IC is on, is proposed. Also, a pulsed WL (word line) driving method is used to prevent a DC current of several tens of micro amperes from flowing into the read transistor of a differential paired eFuse OTP cell. Thus, reliability is secured by preventing non-blown eFuse links from being blown by the EM (electro-migration). Furthermore, a compared output between a programmed datum and a read-out datum is outputted to the PFb (pass fail bar) pin while performing a sensing margin test with a variable pull-up load in consideration of resistance variation of a programmed eFuse in the program-verify-read mode. The layout size of the 8-bit eFuse OTP IP with a $0.18{\mu}m$ process is $189.625{\mu}m{\times}138.850{\mu}m(=0.0263mm^2)$.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.331-337
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• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• The KIPS Transactions:PartD
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• v.11D no.1
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• pp.105-114
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• 2004

In this paper, we propose a collaboration method of diverse agents each others in multi-agent model and describe a node migration algorithm of Mobile-Agent (MA) using by the metadata of Naming-Agent (NA). Collaboration work of multi-agent assures stability of agent system and provides reliability of information retrieval on the distributed environment. NA, an important part of multi-agent, identifies each agents and series the unique name of each agents, and each agent references the specified object using by its name. Also, NA integrates and manages naming service by agents classification such as Client-Push-Agent (CPA), Server-Push-Agent (SPA), and System-Monitoring-Agent (SMA) based on its characteristic. And, NA provides the location list of mobile nodes to specified MA. Therefore, when MA does move through the nodes, it is needed to improve the efficiency of node migration by specified priority according to hit_count, hit_ratio, node processing and network traffic time. Therefore, in this paper, for the integrated naming service, we design Naming Agent and show the structure of metadata which constructed with fields such as hit_count, hit_ratio, total_count of documents, and so on. And, this paper presents the flow of creation and updating of metadata and the method of node migration with hit_count through the collaboration of multi-agent.

• Transactions on Electrical and Electronic Materials
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• v.2 no.3
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• pp.12-17
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• 2001

It is shown in the present study that during the HTS (hot temperature storage) test, the metal contamination by impure elements can be highly susceptible to the void formation, leading to the open failure of the power line in the memory device. Such a functional failure associated with the metal contamination was investigated to be dominant in the early stages of the HTS test while the formation of a stress-driven void is mainly observed in the later stages. In particular, it was found that the void formed in the contaminated metal takes on a slit-like shape which has been known to be characteristic of the stress-related voiding. The impure elements leading to the metal degradation were identified to be carbon and oxygen introduced during the metal sputtering process. The experimental works show that the device reliability was significantly improved by reducing the level of such impure elements within metal. It is shown in the present study that during the HTS (hot temperature storage) test, the metal contamination by impure elements can be highly susceptible to the void formation, leading to the open failure of the power line in the memory device. Such a functional failure associated with the metal contamination was investigated to be dominant in the early stages of the HTS test while the formation of a stress-driven void is mainly observed in the later stages. In particular, it was found that the void formed in the contaminated metal takes on a slit-like shape which has been known to be characteristic of the stress-related voiding. The impure elements leading to the metal degradation were identified to be carbon and oxygen introduced during the metal sputtering process. The experimental works show that the device reliability was significantly improved by reducing the level of such impure elements within metal.