• Journal of Korean Society on Water Environment
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• v.30 no.2
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• pp.199-205
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• 2014

The knowledge on the migration of antimony (Sb) from PET bottles into the water is of greate concern. Antimony in all bottled water marketed in korea and in raw water was analyzed. The detection rate of antimony in total bottled water was 88 % and 100% in PET (Polyethylene terephthalate, PET), 55% in PC (Polycarbonate, PC) bottled water. 55% of raw water contained antimony. The average concentration of Sb in PET bottled water was $0.39{\mu}g/L$, higher than PC bottles ($0.20{\mu}g/L$) and the raw water ($0.22{\mu}g/L$). The migration of Sb into water that is stored in different conditions (room temperature, $45^{\circ}C$, and direct sunlight exposure) was investigated for 180 days. The migration tendency increased with the storage time and temperature. PET bottles showed a sharp increase of Sb concentration at $45^{\circ}C$, but there was no differences between the room temperature and sunlight exposure. The Sb migration in all simulated solution(deionized water, 4% acetic acid, and 20% ethanol) also increased with storage time and temperature. The Sb migration values ranged from 0.35 to $0.49{\mu}g/L$ in all simulated solution, which was far below the permissible korean migration level of $40{\mu}g/L$. There was a tendency that the number of re-use of a bottle and the amount of leaching were in inverse proportion.

• The Journal of Fisheries Business Administration
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• v.49 no.2
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• pp.49-65
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• 2018

The aim of this study is to develop suitability site indicator of urban-rural return to fishing and to analysis priority of the indicators. The study is based on literature review, expert survey and AHP(Analytic Hierarchy Process) methods. This study found 5 factors(natural environment, acceptance environment, social overhead capital, economy, fishing environment) and 21 detail variables. as a result of AHP, fisheries resources, acquisition convenience of fishing license, income(except fishing), attitude of local resident, one-person household income, high income fishing were showed high priority. This result indicate that economic foundation is most important factor for suitable site of the returning.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.9
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• pp.4165-4187
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• 2016

As an emerging technology, cloud computing is a revolution in information technology that attracts significant attention from both public and private sectors. In this paper, we proposed a dynamic approach for live migration to obviate overloaded machines. This approach is applied on OpenStack, which rapidly grows in an open source cloud computing platform. We conducted a cost-aware dynamic live migration for virtual machines (VMs) at an appropriate time to obviate the violation of service level agreement (SLA) before it happens. We conducted a preemptive migration to offload physical machine (PM) before the overload situation depending on the predictive method. We have carried out a distributed model, a predictive method, and a dynamic threshold policy, which are efficient for the scalable environment as cloud computing. Experimental results have indicated that our model succeeded in avoiding the overload at a suitable time. The simulation results from our solution remarked the very efficient reduction of VM migrations and SLA violation, which could help cloud providers to deliver a good quality of service (QoS).

• Journal of Applied Reliability
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• v.12 no.3
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• pp.153-163
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• 2012

Recently, as a electronic components are becoming more high-density, so that electronic circuits have smaller pitches between the leads and are more vulnerable to insulation failure. And the reliability of electric insulation has become an ever important issue as device contact pitches and print patterns shrink. Ion migration occurs in highly humid environment as voltage is applied to an installed print circuit. Under highly humid and voltage applied circumstances, electronic components respond to applied voltages by electrochemical ionization of metals, and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. In thesis, we study acceleration test of ion migration in FR-4 PCB plated with Sn. Voltage applied test of FR-4 PCB circuits plated with Sn was tested in the temperature and humidity environments. As a result of this test, equation of acceleration model was derived.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.261-272
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• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board), electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water droll acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• Journal of Radiation Protection and Research
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• v.17 no.2
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• pp.49-59
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• 1992

A new model was developed in order to investigate the effects of chelating agents on the migration of a radionuclide in the form of ion or chelate. The migration behavior of the chelated radionuclide was analyzed by formulating a convective-dispersion transport equation which included a degradation of chelating agent and chelated radionuclide. The mathematical model was analytically solved and checked with the existing retardation factor. The results show that the migration velocity of the chelated radionuclide was much faster than the ionic one due to the decreased retardation. Therefore, it was concluded that a new remedial action should be developed to reduce the generation and release of chelating agents from the nuclear power plant into the environment.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.339-348
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• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity o of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• Animal cells and systems
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• v.8
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• pp.51-51
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• 2004

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.202-207
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• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.