• Title/Summary/Keyword: Microstructural evolution

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Fabrication of Carbon Nanofiber/Cu Composite Powder by Electroless Plating and Microstructural Evolution during Thermal Exposure (무전해 도금에 의한 탄소나노섬유/Cu 복합 분말 제조 및 열적 안정성)

  • Kim In-soo;Lee Sang-Kwan
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.10a
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    • pp.39-42
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    • 2004
  • Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

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A Study of fabrication and microstructural evolution of twisted BSCCO superconductor tape (Twisting된 BSCCO 선재 제조 및 미세조직 연구)

  • 임준형;지봉기;박형상;주진호;장미혜;고태국;이상진;하홍수;오상수
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2000.02a
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    • pp.112-114
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    • 2000
  • We fabricated BSCCO multifilaments superconductor tape and evaluated the effect of twisting on the microstructural evolution and critical current. Twist pitches of the tapes are in the range of 70 - 8 mm and uniformly deformed. It was observed that grain size and the degree of texture decreased as decreasing pith, probably due to the formation of the irregular interface between Ag and filaments. In addition, critical current of the tapes decreased to 6.5A with decreasing pitch to 8 mm, showing 48% of degradation compared to the untwisted tape(12.5 A). These reduction of critical current may be related to the interface irregularity, smaller grain size, worse texture and the presence of cracks due to the induced strain during twisting processing.

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Microstructural Evolution during the Equal Channel Angular Pressing of Ti-6Al-4V Alloy (Ti-6Al-4V 합금의 ECAP 가공시 미세 조직의 변화 연구)

  • 고영건;정원식;신동혁;이종수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.177-180
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    • 2002
  • The effects of pressing temperatures on the formability and the microstructural evolution during equal channel angular pressing (ECAP) of lamellar Ti-6Al-4V alloy were investigated in this study. ECAP above isothermally 600$^{\circ}C$ was successful without producing any noticeable segments at the specimen surfaces after a single pass of pressing. After 4 passes of ECA pressing, lamellar microstructures were significantly refined revealing equiaxed grains of 0.3$\mu\textrm{m}$ in diameter consisting of high angle grain boundaries. Also these ultrafine grains were relatively stable with little grain growth when annealed up to 600$^{\circ}C$ for 1hour.

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Constitutive Modelling of Alloys Implementing Microstructural Variables (미세조직학적 변수를 고려한 합금의 구성모델링)

  • ;;;Yuri Estrin
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.129-132
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    • 2002
  • A unified elastic-viscoplastic ocnstitutive model based on dislocation density considerations is described. A combination of a kinetic equation, which describes the mechanical response of a material at a given microstructure in terms of dislocation glide and evolution equations for internal variables characterizing the microstructure provide the constitutive equations of the Model. Microstructural features of the material, such as the grain size, spacing between second phase particles etc., are directly implemented in the constitutive equations. The internal variables are associated with the total dislocation density in the simple version of the model. The model has a modular structure and can be adjusted to describe a particular type of metal forming processes.

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An Investigation of Microstructural Evolution and Sliding Wear Behavior of Ultra-Fine Grained 5052 Aluminum Alloy Fabricated by an Accumulative Roll-Bonding Process (누적압연접합에 의한 5052 Al 합금의 결정립 미세화와 기계적 특성 연구)

  • 하종수;강석하;김용석
    • Transactions of Materials Processing
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    • v.12 no.4
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    • pp.376-381
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    • 2003
  • Microstructural evolution and dry sliding wear behavior of ultra-fine grained 5052 Al alloy obtained by an accumulative roll-bonding process have been investigated. After 7 ARB cycles, ultra-fine grains with a large misorientation between neighboring grains were obtained. The grain size was about 0.2 $\mu$m. The hardness, tensile and yield strengths of the ultra-fine grained alloy increased as the amount of accumulated strain increased with the ARB cycles. Sliding wear tests of the ultra-fine grained 5052 Al alloy were conducted at room temperature. Wear rate of the ultra-fine grained alloy increased in spite of the increase of hardness. Surface of the worn specimens were examined with SEM to investigate wear mechanism of the ultra-fine grained alloy.

Effect of Cr2O3 Content on Densification and Microstructural Evolution of the Al2O3-Polycrystalline and Its Correlation with Toughness

  • Seo, Mi-Young;Kim, Hee-Seung;Kim, Ik-Jin
    • Journal of the Korean Ceramic Society
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    • v.43 no.8 s.291
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    • pp.469-471
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    • 2006
  • The effects of $Cr_2O_3$ on the microstructural evolution and mechanical properties of $Al_2O_3$ polycrystalline were investigated. The microstructure of $Al_2O_3-Cr_2O_3$ composites (ruby) was carefully controlled in order to obtain dense and fine-grained ceramics, thereby improving their properties and reliability with respect to numerous applications related to semiconductor bonding technology. Ruby composites were produced by Ceramic Injection Molding (CIM) technology. Room temperature strength, hardness, Young's modulus and toughness were determined, as well as surface strengthening induced by thermal treatment and production of a fine-grained homogenous microstructure.

Effect of VC Addition on the Microstructural Evolution of Fe-TiC Cermet (VC의 첨가에 따른 Fe-TiC계의 미세조직변화)

  • 채기웅
    • Journal of the Korean Ceramic Society
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    • v.36 no.4
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    • pp.366-371
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    • 1999
  • The effect of VC addition on the microstructural evolution of Fe-TiC cermet has been investigated. The microstructures of the Fe-TiC varied with the amount of VC addition. The addition of 1wt% VC enhanced the instability of liquid-solid interface ; the dissolving interface showed round shape instead of facetted one which was ascribed to the increase of lattice mismatch between TiC and solid-solution carbide. in the speci-men with 10wt% VC the new set of solid-solution carbide grains of uniform and small size was formed in-side coarse TiC particles by diffusion induced recrystallizatin (DIR). With increasing the heat-treatment time fine recrystallized grains were dispersed homogeneously in the matrix and resulted in the increase in fracture strength.

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Microstructural Evolution during the Equal Channel Angular Pressing of Ti-6Al-4V Alloy (Ti-6AI-4V 합금의 ECAP 가공에 따른 미세조직의 변화)

  • 고영건;정원식;신동혁;이종수
    • Transactions of Materials Processing
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    • v.11 no.6
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    • pp.519-528
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    • 2002
  • The microstructural evolution during the equal channel angular pressing of Ti-6Al-4V alloy was investigated using the transmission electron microscopy (TEM). ECA pressing was carried out isothermally with route C at $600^{\circ}C$ for two types of initial microstructure, i.e., equiaxed and Widmanstatten microstructures. At an initial stage of ECA pressing, the equiaxed microstructure showed more uniform flow than the Widmanstatten microstructure. However, both microstructures were significantly refined revealing nearly equiaxed grains of 0.3$mu extrm{m}$ in diameter with high angle grain boundaries after 4 passes of ECA pressing. These ultrafine gains were found to be stable with little grain growth, when annealed up to $600^{\circ}C$ for 1hr.

Microstructural Evolution and Recrystallization Behavior Traced by Electron Channeling Contrast Imaging

  • Oh, Jin-Su;Yang, Cheol-Woong
    • Applied Microscopy
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    • v.48 no.4
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    • pp.130-131
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    • 2018
  • Electron channeling contrast imaging (ECCI) is one of the imaging techniques in scanning electron microscopy based on a variation in electron backscattering yield depending on the direction of the primary electron beam with respect to the crystal lattice. The ECCI provides not only observation of the distribution of individual grains and grain boundaries but also identification of the defects such as dislocations, twins, and stacking faults. The ECCI at the interface between recrystallized and deformed region of shot peening treated nickel clearly demonstrates the microstructural evolution during the recrystallization including original grain boundaries, and thus can provide better insight into the recrystallization behavior.