(Microstructural Evolution of the Joint Interface between Eutectic 80Au-20Sn Solder and Under Bump Metallurgy) (액상 80Au-20Sn 솔더와 UBM(Au/Ni(V)/Al)의 계면현상에 대한 고찰)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2004.11a
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- pp.54-54
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- 2004