• Transactions of Materials Processing
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• v.11 no.2
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• pp.108-113
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• 2002

The application fields of medicine and biology are spotlighted because of the increasing concentration of health and the abundance of life. MEMS is very good solution in this fields for the concept of point of care which makes systems more useful and spread wide. This paper shows the major fabrication schemes and application fields of microelectromechanical system specially in medicine and biology fields.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.949-958
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• 2018

A voice recognition control system is a system for controlling a peripheral device by recognizing a voice. Recently, a voice recognition control system have been applied not only to smart devices but also to various environments ranging from IoT(: Internet of Things), robots, and vehicles. In such a voice recognition control system, the recognition rate is lowered due to the ambient noise in addition to the voice of the user. In this paper, we propose a dual channel acoustic beamforming hardware architecture for MEMS(: Microelectromechanical Systems) microphones to eliminate ambient noise in addition to user's voice. And the proposed hardware architecture is designed as ASIC(: Application-Specific Integrated Circuit) using TowerJazz $0.18{\mu}m$ CMOS(: Complementary Metal-Oxide Semiconductor) technology. The designed dual channel acoustic beamforming ASIC has a die size of $48mm^2$, and the directivity index of the user's voice were measured to be 4.233㏈.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.62-66
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• 2023

With the advancement in technology and rapid increase in the demand for microelectromechanical systems (MEMS) based inertial measurement units (IMUs), high-volume production and test system remain a major challenge for the MEMS industry. To compete with the challenging market of Industry 4.0, here we developed an automatic test system to evaluate the performance of the ovenized IMU sensors as well as analyze the data. The automatic test system was developed by interfacing a commercial MEMS IMU (BMI 088) using LabVIEW. The BMI 088 was tested experimentally for long-term bias stability, ON/OFF bias repeatability, and root mean square (rms) noise. Furthermore, the data was analyzed through the developed test system. The results show that the automatic test system has improved the test time and reduced human effort. The developed automatic test system is a significant approach to MEMS research and development (R&D) to increase and improve the mass production of IMUs.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Korean Journal of Optics and Photonics
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• v.30 no.6
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• pp.230-236
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• 2019

We propose and demonstrate a searching and autoalignment method for indoor optical wireless communication, using a cost-effective retroreflective sheet and a microelectromechanical system (MEMS) mirror. We use an extremum-seeking method for a single axis and beam steering with a MEMS mirror to maintain a line of sight (LOS) with the optical link. This autoalignment method shows a receiver sensitivity of -31.87 dBm for a bit rate of 2.5 Gb/s over a 7 m communication link.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.195-198
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• 2002

현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• The Journal of Korea Robotics Society
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• v.8 no.1
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• pp.29-36
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• 2013

This paper presents a sensitivity optimization of a MEMS (microelectromechanical systems) gyroscope for a magnet-gyro system. The magnet-gyro system, which is a guidance system for a AGV (automatic or automated guided vehicle), uses a magnet positioning system and a yaw gyroscope. The magnet positioning system measures magnetism of a cylindrical magnet embedded on the floor, and AGV is guided by the motion direction angle calculated with the measured magnetism. If the magnet positioning system does not measure the magnetism, the AGV is guided by using angular velocity measured with the gyroscope. The gyroscope used for the magnet-gyro system is usually MEMS type. Because the MEMS gyroscope is made from the process technology in semiconductor device fabrication, it has small size, low-power and low price. However, the MEMS gyroscope has drift phenomenon caused by noise and calculation error. Precision ADC (analog to digital converter) and accurate sensitivity are needed to minimize the drift phenomenon. Therefore, this paper proposes the method of the sensitivity optimization of the MEMS gyroscope using DEAS (dynamic encoding algorithm for searches). For experiment, we used the AGV mounted with a laser navigation system which is able to measure accurate position of the AGV and compared result by the sensitivity value calculated by the proposed method with result by the sensitivity in specification of the MEMS gyroscope. In experimental results, we verified that the sensitivity value through the proposed method can calculate more accurate motion direction angle of the AGV.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.26 no.4
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• pp.271-274
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• 2013

Inclinometer sensors are widely applied in many fields. Especially in the field of construction of high-rise buildings also measure the horizontal and vertical help has been applied to monitor. Recent micro electro-mechanical system(MEMS) technology with the development of the many sensors have been developed. In this paper, a MEMS inclinometer is based on a MEMS accelerometer. The sensor can measure the angle of inclination using the relationship between static acceleration and gravity acceleration from an accelerometer. From this principle, inclinometer has been developed that has more accurate. The accuracy is proved by the experiment with laser displacement. Results in the experiment express high-accuracy, stability and economics of MEMS inclinometer. In conclusion, wireless MEMS inclinometer sensor is expected to be applicable in the areas of construction and many other industries with accurate and convenient monitoring system.

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.53-62
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• 1999

Micro polysilicon actuators, which are widely used in the field of MEMS (Microelectromechanical System) technology, were fabricated using polysilicon thin layers. Polysilicon deposition were carried out to have symmetrical layer structures with a LPCVD (Low Pressure Chemical Vapor Deposition) system, and we have measured physical characteristics by micro test patterns, such as bridges and cantilevers to verify minimal mechanical stress and stress gradient in the polysilicon layers according to the methods of mutilayer deposition, doping, and thermal treatment, also, analyzed the properties of each specimen, which have a different process condition, by XRD, and SIMS etc.. Finally, the fabricated planar polysilicon resonator, symmetrically stacked to $6.5{\mu}m$ thickness, showed Q of 1270 and oscillation ampitude of $5{\mu}m$ under DC 15V, AC 0.05V, and 1000 mtorr pressure. The developed micro polysilicon resonator can be utilized to micro gyroscope and accelerometer sensor.